DLA SMD-5962-89943 REV B-2011 MICROCIRCUITS MEMORY DIGITAL CMOS 4K X 9 PARALLEL-SERIAL FIFO MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add device type 05. Update boilerplate. Make corrections to figure 4. Editorial changes throughout. 94-06-22 M.A. Frye B Update body of drawing to reflect current requirements. glg 11-04-01 Charles Saffle THE ORIGINAL FIRST SHEET OF THIS DRAWING
2、HAS BEEN REPLACED. REV B B B B SHEET 35 36 37 38 REV B B B B B B B B B B B B B B B B B B B B SHEET 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 REV STATUS REV B B B B B B B B B B B B B B OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Kenneth Rice DLA LAND AND MA
3、RITIME STANDARD MICROCIRCUIT DRAWING CHECKED BY Charles Reusing COLUMBUS, OHIO 43218-3990http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUITS, MEMORY, DIGITAL, CMOS, 4K X 9 PARALLEL-SERIAL FIFO, MONOLITHIC SILICON AND AGENCIES OF THE D
4、EPARTMENT OF DEFENSE DRAWING APPROVAL DATE 90-05-12 AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-89943 SHEET 1 OF 38 DSCC FORM 2233 APR 97 5962-E278-11 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHSSTANDARD MICROCIRCUIT DRAWING SIZE A 5962-899
5、43 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number
6、 (PIN). The complete PIN is as shown in the following example: 5962-89943 01 Q X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function Shift R
7、ate 01 72104L 4K X 9-bit parallel-serial FIFO 120 ns 02 72104L 4K X 9-bit parallel-serial FIFO 80 ns 03 72104L 4K X 9-bit parallel-serial FIFO 65 ns 04 72104L 4K X 9-bit parallel-serial FIFO 50 ns 05 72104L 4K X 9-bit parallel-serial FIFO 40 ns 1.2.2 Case outline(s). The case outline(s) are as desig
8、nated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style Q GDIP1-T40 or CDIP2-T40 40 Dual-in-line X CQCC1-N44 44 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Term
9、inal voltage with respect to ground . -0.5 V dc to +7.0 V dc DC output current . 50 mA Storage temperature range . -65C to +150C Maximum power dissipation . 1.0 W Lead temperature (soldering, 10 seconds) . +260C Thermal resistance, junction to case(JC): See MIL-STD-1835 Junction temperature (TJ) . +
10、150C 1/ 1.4 Recommended operating conditions. Supply voltage range(VCC) . +4.5 V dc to +5.5 V dc Input high voltage (VIH) . 2.2 V dc minimum Input low voltage (VIL) . 0.8 V dc maximum 2/ Case operating temperature range (TC) -55C to +125C. 1/ Maximum junction temperature may be increased to +175C du
11、ring burn-in and steady-state life tests. 2/ 1.5 V undershoots are allowed for 10 ns once per cycle. Provided by IHSNot for Resale-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89943 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENT
12、S 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE
13、 SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of
14、 Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of prec
15、edence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requir
16、ements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer wh
17、o has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifi
18、cations to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used
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