DLA SMD-5962-87729 REV E-2006 MICROCIRCUIT DIGITAL ECL 8-LINE MULTIPLEXER MONOLITHIC SILICON《硅单片8线多工器发光数字微电路》.pdf
《DLA SMD-5962-87729 REV E-2006 MICROCIRCUIT DIGITAL ECL 8-LINE MULTIPLEXER MONOLITHIC SILICON《硅单片8线多工器发光数字微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-87729 REV E-2006 MICROCIRCUIT DIGITAL ECL 8-LINE MULTIPLEXER MONOLITHIC SILICON《硅单片8线多工器发光数字微电路》.pdf(16页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add figure 4. Technical changes to tables I. Change in terminal connections. Technical changes in 1.3, 1.4, and table II. Editorial changes throughout. - mlp 89-08-25 Michael A. Frye B Changes according to NOR 5962-R074-92 - tvn 91-12-10 Monica L
2、. Poelking C Add package CDFP4-F16. Use new boilerplate. - les 98-01-12 Raymond Monnin D Modified Figure 4 to be consistent with Table I. - ljs 98-08-17 Raymond Monnin E Update to current requirements. Editorial changes throughout. - gap 06-05-15 Raymond Monnin The original first page of this drawin
3、g has been replaced. REV SHET REV E SHET 15 REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Monica L. Poelking DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Monica L. Poelking COLUMBUS, OHIO 43218-3990 http:/w
4、ww.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ECL, 8-LINE AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-11-24 MULTIPLEXER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 67268 5962-87729 SHE
5、ET 1 OF 15 DSCC FORM 2233 APR 97 5962-E205-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. S
6、COPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-87729 01 E X Drawing number Device
7、 type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 10H564 8-line multiplexer 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and
8、 as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier X CDFP4-F16 16 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix
9、 A. 1.3 Absolute maximum ratings. Supply voltage range (VEE) . -8.0 V dc to 0.0 V dc Input voltage range . -5.2 V dc to 0.0 V dc Storage temperature range -65C to +165C Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) . 165C Maximum power dissipation (PD) 446 mW Thermal res
10、istance, junction-to-case (JC) See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VEE) . -5.46 V dc to -4.94 V dc Supply voltage range (VCC) . -0.02 V dc to +0.02 V dc or +1.98 V dc to +2.02 V dc Ambient operating temperature range (TA) . -55C to +125C Minimum high level in
11、put voltage (VIH): TA= +25C -0.780 V dc TA= +125C -0.650 V dc TA= -55C . -0.840 V dc Maximum low level input voltage (VIL) -1.950 V dc Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87729 DEFENSE SUPPLY CENT
12、ER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise spec
13、ified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - In
14、terface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil
15、or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, h
16、owever, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to
17、this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying ac
18、tivity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described he
19、rein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1
20、 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2. 3.2.4 Logic diagram(s). The logic diagram(s) shall be as
21、 specified on figure 3. 3.2.5 Test circuit and switching waveforms. Test circuit and switching waveforms shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall
22、apply over the full ambient operating temperature range. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-87729 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234
23、APR 97 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN l
24、isted in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance in
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