DLA SMD-5962-86072 REV E-2009 MICROCIRCUIT DIGITAL BIPOLAR ADVANCED SCHOTTKY TTL BINARY COUNTER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Table I, pages 4 and 5, change: VOHfrom 2.5 V to 2.4 V. fMAX(Min), subgroup 9, from 100 MHz to 90 MHz and subgroups 10 and 11 from 90 MHz to 75 MHz. tPLH4, subgroups 10 and 11 from 15.5 ns to 16.5 ns. Add “5962“ to the military drawing number in
2、6.4. Editorial changes on pages 2 and 8. Change code ident. to 67268. 87-07-24 D. R. Cool B Technical changes in 1.4, recommended operating conditions. Increased setup and hold time. Delete footnote 2/ from table I. Table I fMAXtest from 75 MHz to 60 MHz. Table I tPHL2through tPHL4increase maximum l
3、imits. Made editorial changes throughout document. Change in table II. Add CAGE 27014 to all packages. Add figure 5. - ltg 89-01-03 D. R. Cool C Table I, maximum clock frequency, symbol column, add “2/“. Add footnote 2/ at the end of the table as follows: “2/ fMAX, if not tested shall be guaranteed
4、to the specified limits.“ - tvn 93-05-05 Monica L. Poelking D Update to reflect latest changes in format and requirements. Change LOAD to PE on Figure 4. Editorial changes throughout. - les 02-03-07 Raymond Monnin E Update drawing to current requirements. Editorial changes throughout. - gap 09-04-14
5、 Joseph D. Rodenbeck CURRENT CAGE CODE IS 67268 The original first sheet of this drawing has been replaced. REV SHET REV SHET REV STATUS REV E E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY David W. Queenan CHECKED BY N. A. Hauck DEFENSE SUPPLY CENTER
6、 COLUMBUS COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil APPROVED BY N. A. Hauck STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 87-01-28 MICROCIRCUIT, DIGITAL, BIPOLAR, ADVANCED SCHOTTKY, TTL, BINAR
7、Y COUNTER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 5962-86072 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E055-09 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86072 DEFENSE SUPPLY
8、CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). T
9、he complete PIN is as shown in the following example: 5962-86072 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54F169 synchr
10、onous 4-bit up/down binary counter 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or GDIP2-T16 16 Dual-in-line F GDFP2-F16 or GDFP3-F16 16 Flat 2 CQCC1-N20 20 Square chip carrier 1
11、.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage -0.5 V dc minimum to +7.0 V dc maximum Input voltage range -1.2 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) per device 1
12、/ 413 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc
13、 Maximum low level input voltage (VIL) . 0.8 V dc Case operating temperature range (TC) -55C to +125C Minimum setup time, Dnto CP: TC= +25C . 4.0 ns TC= -55C, +125C 4.5 ns Minimum hold time, Dnto CP: TC= +25C . 3.0 ns TC= -55C, +125C 3.5 ns _ 1/ Maximum power dissipation is defined as VCCx ICC. Must
14、 withstand the added PDdue to short circuit test (e.g. IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86072 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2
15、234 APR 97 Minimum setup time, CEP or CET to CP: TC= +25C 7.0 ns TC= -55C, +125C . 8.0 ns Minimum hold time, CEP or CET to CP 1.0 ns Minimum setup time, PE to CP: TC= +25C 8.0 ns TC= -55C, +125C . 10.0 ns Minimum hold time, PE to CP 1.0 ns Minimum setup time, U/ D to CP: TC= +25C 11.0 ns TC= -55C, +
16、125C . 14.0 ns Minimum hold time, U/ D to CP 0.0 ns Minimum width of clock pulse 9.0 ns 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise s
17、pecified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 -
18、 Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or from the Standard
19、ization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes a
20、pplicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-86072 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SH
21、EET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML
22、) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as doc
23、umented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-385
24、35 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 he
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