DLA SMD-5962-86027 REV D-2003 MICROCIRCUIT DIGITAL 4-BIT BIPOLAR MICROPROGRAM SEQUENCER MONOLITHIC SILICON《硅单块 4比特双极微程序序列发生器数字微型电路》.pdf

《DLA SMD-5962-86027 REV D-2003 MICROCIRCUIT DIGITAL 4-BIT BIPOLAR MICROPROGRAM SEQUENCER MONOLITHIC SILICON《硅单块 4比特双极微程序序列发生器数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-86027 REV D-2003 MICROCIRCUIT DIGITAL 4-BIT BIPOLAR MICROPROGRAM SEQUENCER MONOLITHIC SILICON《硅单块 4比特双极微程序序列发生器数字微型电路》.pdf（16页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Convert to military drawing format. Add case outline Z, change case outline 3 lead finish from C to A for vendor part number AM2909A/B3A. Add vendor CAGE number 50088 to drawing. 87-10-07 Michael A. Frye B Table I, change IIH2test conditions. Edi

2、torial changes throughout. 88-09-27 Michael A. Frye C Changes in accordance with NOR 5962-R027-93. 92-11-30 Monica L. Poelking D Incorporate revision C. Update boilerplate to MIL-PRF-38535 requirements. LTG 03-01-21 Thomas M. Hess REV SHET REV D SHET 15 REV STATUS REV D D D D D D D D D D D D D D OF

3、SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Greg A. Pitz DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Ray Monnin COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT

4、, DIGITAL, 4-BIT BIPOLAR MICROPROGRAM SEQUENCER, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 86-02-24 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 86027 SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E177-03 DISTRIBUTION STATEMENT A. Approved for public release;

5、distribution is unlimited.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This draw

6、ing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 86027 01 X X Drawing number Device type (see 1.2.1) Case outline

7、 (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type. The device type identify the circuit function as follows: Device type Generic number Circuit function 01 2909A Microprogram sequencer 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter De

8、scriptive designator Terminals Package style X GDIP1-T28 or CDIP2-T28 28 Dual-in-line package Y See figure 1 28 Flat pack Z GDFP2-F28 28 Flat pack 3 CQCC1-N28 28 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings

9、. Supply voltage range. -0.5 V dc to +7.0 V dc Input voltage range -0.5 V dc to +5.5 V dc Storage temperature range . -65C to +150C Maximum power dissipation (PD). 770 mW 1/ Thermal resistance, junction-to-case (JC): Cases X, Z, and 3 See MIL-STD-1835 Case Y. 14C/W 2/ Junction temperature (TJ) 175C

10、DC output current, into inputs 30 mA DC input current -30 mA to +5.0 mA 1.4 Recommended operating conditions. Supply voltage (VCC) 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL). 0.8 V dc Case operating temperature range (TC

11、) -55C to +125C 1/ Must withstand the added PDdue to short circuit test;e.g., IOS. 2/ When a thermal resistance value for this case is included in MIL-STD-1835, that value shall supersede the value indicated herein. Provided by IHSNot for ResaleNo reproduction or networking permitted without license

12、 from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form

13、a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DE

14、FENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard

15、 Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence

16、. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements

17、. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non- JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has

18、 been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modificatio

19、ns to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2

20、 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein and figure 1. 3.2.2 Logic diagram. The logic diagram shall be

21、 as specified on figure 2 3.2.3 Terminal connections. The terminal connections shall be as specified on figure 3. 3.2.4 Truth table. The truth table shall be as specified on figure 4. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure

22、 5. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless

23、otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for

24、 each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For packages where markin

25、g of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A.

26、The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved s

27、ource of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of confor

28、mance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535, appendix A. 3.9 Verification and

29、review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitt

30、ed without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C VCC= 5.0 V 10% unless otherwise spe

31、cified Group A subgroups Device type Limits Unit Min Max Output high voltage VOHVCC= minimum, IOH= 1.0 mA VIN= VIHor VIL1, 2, 3 All 2.4 V Output low voltage VOLVCC= minimum, IOL= 16 mA VIN= VIHor VIL1, 2, 3 All 0.5 V Input high level VIH1, 2, 3 All 2.0 V Input low level VIL1, 2, 3 All 0.8 V Input cl

32、amp voltage VICVCC= minimum, IIN= -18 mA 1, 2, 3 All -1.5 V Cn-1.08 Push/pop, OE -0.76 Input low current IILVCC= maximum VIN= 0.4 V Others 1, 2, 3 All -0.41 mA Cn40 Push/pop, OE 40 Input high current IIH1VCC= maximum VIN= 2.7 V Others 1, 2, 3 All 20 A Cn, Push/pop 0.2 Input high current IIH2VCC= max

33、imum VIN= 5.5 V Others 1, 2, 3 All 0.1 mA Y0 Y3-30 -100 Output short circuit current 1/ IOSVCC= 6.0 V VOUT= 0.5 V Cn+41, 2, 3 All -30 -85 mA TC= -55C and +125C 1, 3 140 Power supply current ICCVCC= maximum 2/ TC= +25C 2 All 110 mA IOZLVOUT= 0.4 V -20 Output OFF current IOZHVCC= maximum (Y0-3) VOUT=

34、2.7 V 1, 2, 3 All 20 A Functional tests See 4.3.1c 7, 8 All Setup time 1 RE ts19, 10, 11 All 19 ns Hold time 1 RE th19, 10, 11 All 5 ns Setup time 2 Rits29, 10, 11 All 12 ns Hold time 2 Rith29, 10, 11 All 5 ns Setup time 3 PUP ts39, 10, 11 All 27 ns Hold time 3 PUP th39, 10, 11 All 5 ns Setup time 4

35、 FE ts49, 10, 11 All 27 ns Hold time 4 FE th49, 10, 11 All 5 ns Setup time 5 Cnts59, 10, 11 All 18 ns Hold time 5 Cnth59, 10, 11 All 5 ns Setup time 6 Dits69, 10, 11 All 25 ns Hold time 6 Dith69, 10, 11 All 0 ns Setup time 7 ORits79, 10, 11 All 25 ns Hold time 7 ORith7See figure 5 CL= 50 pF 9, 10, 1

36、1 All 0 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Elec

37、trical performance characteristics - Continued Test Symbol Conditions -55C TC +125C VCC= 5.0 V 10% unless otherwise specified Group A subgroups Device type Limits Unit Min Max Setup time 8 S0, S1 ts89, 10, 11 All 29 ns Hold time 8 S0, S1th89, 10, 11 All 0 ns Setup time 9 ZERO ts99, 10, 11 All 29 ns

38、Hold time 9 ZERO th99, 10, 11 All 0 ns tpd120 Propagation delay 1-2 from (input): DiTo (output): Y To (output): Cn+4tpd29, 10, 11 All 25 ns tpd329 Propagation delay 3-4 from (input): S0, S1To (output): Y To (output): Cn+4tpd49, 10, 11 All 34 ns tpd520 Propagation delay 5-6 from (input): ORiTo (outpu

39、t): Y To (output): Cn+4 tpd69, 10, 11 All 25 ns Propagation delay 7 from (input): CnTo (output): Cn+4tpd79, 10, 11 All 16 ns tpd830 Propagation delay 8-9 from (input): ZERO To (output): Y To (output): Cn+4tpd99, 10, 11 All 35 ns Propagation delay 10 from (input): OE low (enable) To (output): Y tpd10

40、See figure 5 CL= 50 pF 9, 10, 11 All 25 ns Propagation delay 11 from (input): OE high (disable) To (output): Y tpd11See figure 5 CL= 5 pF 9, 10, 11 All 25 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICR

41、OCIRCUIT DRAWING SIZE A 86027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C VCC= 5.0 V 10% unless otherwise specified Group A subgroups Device t

42、ype Limits Unit Min Max tpd1245 Propagation delay 12-13 from clock (input): Clock S1, S0= LH To (output): Y To (output): Cn+4tpd139, 10, 11 All 50 ns tpd1445 Propagation delay 14-15 from clock (input): Clock S1, S0= LL To (output): Y To (output): Cn+4tpd159, 10, 11 All 50 ns tpd1653 Propagation dela

43、y 16-17 from clock (input): Clock S1, S0= HL To (output): Y To (output): Cn+4tpd179, 10, 11 All 58 ns Minimum clock low time tCL9, 10, 11 All 20 ns Minimum clock high time tCHSee figure 5 CL= 50 pF 9, 10, 11 All 20 ns 1/ Not more than one output should be shorted at a time. Duration of the short cir

44、cuit test should not exceed 1 second. 2/ Apply GND to Cn, R0, R1, R2, R3, 0R0, 0R1, 0R2, 0R3, D0, D1, D2and D3. Other inputs high. All outputs open. Measured after low to high clock transition. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD

45、 MICROCIRCUIT DRAWING SIZE A 86027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 8 DSCC FORM 2234 APR 97 Case outline Y Min Max Min Max Parameter Millimeters Inches A .13 2.29 .055 .090 b .38 .48 .015 .019 C .10 .15 .004 .006 D 9.40 10.54 .370 .415 E 9.40 10.16 .370

46、 .400 E1 - 10.67 - .420 e 1.14 1.40 .045 .055 L 6.35 8.13 .250 .320 L1 23.37 24.89 .920 .980 Q .51 1.02 .020 .040 S - 1.14 - .045 S1.13 - .005 - S2.10 - .004 - NOTES: 1. Index area: A notch, tab, or pin one identification mark shall be located within the shaded area shown. 2. D and E1 allow for off-

47、center lid meniscus and glass overrun. 3. All leads in dimensions b and C increase by 3 mils maximum limit, when tinplate/solder dip lead finish applied. 4. Exterior of frames to be of any shape, as long as electrically continous with all leads and meets outside frame dimension measurement. FIGURE 1

48、 Case outline. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 9 DSCC FORM 2234 APR 97 FIGURE 2. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 86027 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL D SHEET 10 DSCC FORM 2234 APR 97 Device type All Case outli