DLA SMD-5962-78026 REV D-2004 MICROCIRCUIT DIGITAL BIPOLAR LOW POWER SCHOTTKY TTL DECADE COUNTER MONOLITHIC SILICON《硅单片十进制计数器 肖脱基小功率TTL双极数字微型电路》.pdf
《DLA SMD-5962-78026 REV D-2004 MICROCIRCUIT DIGITAL BIPOLAR LOW POWER SCHOTTKY TTL DECADE COUNTER MONOLITHIC SILICON《硅单片十进制计数器 肖脱基小功率TTL双极数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-78026 REV D-2004 MICROCIRCUIT DIGITAL BIPOLAR LOW POWER SCHOTTKY TTL DECADE COUNTER MONOLITHIC SILICON《硅单片十进制计数器 肖脱基小功率TTL双极数字微型电路》.pdf(11页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Delete normalized fanout. Change tp (IN): Inputs A and B. Change the following: fclock: Input B, IIH2, IIH3, IIL1, IIL2, fMAX1, fMAX2. Delete minimum limits from all prop. delay times. Change prop. delay time N to BDto B to QD. Change prop. delay
2、 time CLR to Q1. Change prop. delay time tPLH6and tPHL6to tPHL6only. Revise to new military format. Case E inactive for new design. Renumbered high level input current. 87-10-26 M. A. Frye C Changes in accordance with NOR 5962-R175-92. -tvn 92-04-27 Monica L. Poelking D Update to reflect latest chan
3、ges in format and requirements. Editorial changes throughout. -les 04-07-27 Raymond Monnin CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY Monica L. Grose
4、l DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. DiCenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, BIPOLAR, LOW POWER SCHOTTKY TTL, DECADE COUNTER, AND AGENCI
5、ES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 79-01-23 MONOLITHIC SILICON AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 14933 78026 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E348-04 .Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIR
6、CUIT DRAWING SIZE A 78026 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identify
7、ing Number (PIN). The complete PIN is as shown in the following example: 78026 01 E A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device types. The device types identify the circuit function as follows: Device type Generic number Circuit function 01 54L
8、S390 Dual decade counter with A and B inputs 1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 dual-in-line F GDFP2-F16 or CDFP3-F16 16 flat 1.2.3 Lead finish. The lead fi
9、nish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at 18 mA to +5.5 V dc Storage temperature -65C to +150C Maximum power dissipation (PD) . 143 mW 1/ Lead temperature (soldering, 10 seconds) .
10、 +300C Junction temperature (TJ) +175C Thermal resistance, junction-to-case (JC): Cases E and F . See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH): 2.0 V dc Maximum low lever input voltage (V
11、IL): . 0.7 V dc Case operating temperature range (TC) -55C to +125C Width of input count pulse, tp(IN): Input A 20 ns minimum Input B 40 ns minimum Width of CLEAR pulse . 20 ns minimum Input clock frequency, fclock: Input A 0 to 25 MHz Input B 0 to 12.5 MHz _ 1/ Maximum power dissipation is defined
12、as VCCX ICC, and must withstand the added PDdue to short circuit test e.g., IOS.DSCC FORM 2234 APR 97 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78026 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 RE
13、VISION LEVEL D SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the so
14、licitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMEN
15、T OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins A
16、venue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a sp
17、ecific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer List
18、ing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flo
19、w as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL
20、-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with
21、1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth tables. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3 3.3 Electrical performance characteristics. Unless ot
22、herwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for e
23、ach subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. DSCC FORM 2234 APR 97 Provided by IHSNot for ResaleNo reproduction or
24、networking permitted without license from IHS-,-STANDARD MICROCIRCUIT DRAWING SIZE A 78026 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 3.5.1 Certification/compliance mark. A compliance indicator C shall be marked on all non-JAN devices built in compliance to MIL
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