DLA SMD-5962-77020 REV F-2011 MICROCIRCUIT DIGITAL CMOS STROBED HEX INVERTER BUFFER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Convert to SMD format. Editorial changes throughout. Redrawn 92-11-18 Monica L. Poelking B Add device type 02. Add CAGE 34371 as a source of supply. Technical changes in 1.3 and 1.4 and table I. Boilerplate update. Editorial changes throughout. 9
2、3-11-19 Monica L.Poelking C Changes IAW NOR 5962-R081-94 ltg. 93-12-29 Monica l. Poelking D Update boilerplate to MIL-PRF-38535 requirements. jak 01-01-24 Thomas M. HessE Made change to paragraph 3.5. Update boilerplate to MIL-PRF-38535 requirements. LTG 05-01-26 Thomas M. Hess F Update boilerplate
3、paragraphs to the current MIL-PRF-38535 requirements. - LTG 11-03-24 David J. Corbett CURRENT CAGE CODE 67268 REV SHET REV F SHET 15 REV STATUS REV F F F F F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY A. J. Foley DLA LAND AND MARITIME COLUMBUS, OHIO 43218
4、-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY C. R. Jackson APPROVED BY Nelson A. Hauck MICROCIRCUIT, DIGITAL, CMOS, STROBED HEX INVERTER/BUFFER, MONOLITHIC SILICON DRAWING
5、 APPROVAL DATE 77-08-18 REVISION LEVEL F SIZE A CAGE CODE 14933 77020 SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E273-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77020 DLA LAND AND MARITIME COLUMBUS, OHIO 432
6、18-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the
7、 following example: 77020 01 E A Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 4502B Strobed hex inverter/buffer 02 4502B Strobed h
8、ex inverter/buffer 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 1.2.3 Lead finish. The lead finish is as specif
9、ied in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VDD) (01) (voltage referenced to VSS) . -0.5 V dc to +18.0 V dc Supply voltage range (VDD) (02) (voltage referenced to VSS) . -0.5 V dc to +20.0 V dc Input voltage range -0.5 V dc to VDD+ 0.5 V dc Storage temper
10、ature range (TSTG) . -65C to +150C Maximum power dissipation (PD) . 500 mW 2/ Lead temperature (soldering, 10 seconds) +260C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Supply voltage range (VDD) (01) . +3.0 V d
11、c to +15.0 V dc Supply voltage range (VDD) (02) . +3.0 V dc to +18.0 V dc Minimum high level input voltage (VIH) . +3.5 V dc at VDD= 5.0 V dc Minimum low level input voltage (VIL). +1.5 V dc at VDD= 5.0 V dc Case operating temperature range (TC) . -55C to +125C 1/ Stresses above the absolute maximum
12、 rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ For TA= +100C, derate linearly at 12 mW/C to 200 mW. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDAR
13、D MICROCIRCUIT DRAWING SIZE A 77020 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the
14、extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Me
15、thod Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.da
16、ps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Not
17、hing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified h
18、erein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved progra
19、m plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect
20、 the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appe
21、ndix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram sha
22、ll be as specified on figure 3. 3.2.5 Switching waveforms. The switching waveforms shall be as specified on figure 4. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77020 DLA LAND AND MARITIME COLUMBUS, OHIO 4321
23、8-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements
24、. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the m
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