DLA SMD-5962-77008 REV G-2010 MICROCIRCUIT LINEAR QUAD VOLTAGE COMPARATOR MONOLITHIC SILICON.pdf

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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Pgs 9 and 10: correct error in Replacement Military specification Part Number. 78-09-13 N. A. HAUCK B Pgs 4, 5, 7, 8: Subgroup 4 corrections. Pg 10, Suffix correction. 81-01-19 N. A. HAUCK C Change to Standardized Military Drawing format. Change

2、CAGE code 67268. Add case outline 2. Inactivate 01AX and 01CX for new design. Not available from an approved source is 01AX. Extensive changes to table I. Remove vendor CAGE 34335, 07263, 27014, 04713, and 01295. Add vendor CAGE 06665 and 07933. Editorial changes throughout. 88-11-08 M. A. FRYE D Ch

3、anges in accordance with N.O.R. 5962-R325-92. 92-11-05 M. A. FRYE E Add power dissipation and derating limits for case outline D. Make change to the derating temperature limit for case outlines C and 2. - ro 02-05-02 R. MONNIN F Add device class V devices. - ro 03-04-22 R. MONNIN G Update drawing to

4、 current MIL-PRF-38535 requirements. -rrp 10-01-19 C. SAFFLE CURRENT CAGE CODE 67268 THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY A. J. FOLEY DEFENSE SUPPLY CENTER COLUMBUS

5、 COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY C. R. JACKSON APPROVED BY N. A. HAUCK MICROCIRCUIT, LINEAR, QUAD VOLTAGE COMPARATOR, MONOLITHIC SILICON DRAWING AP

6、PROVAL DATE 77-05-25 AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 14933 77008 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E342-08 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77008 DEFENSE SUPPLY CENTER COLUMBUS COL

7、UMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are availabl

8、e and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: For device class M : 77008 01 C X Drawing Device Case Lead number type outline finish (se

9、e 1.2.2) (see 1.2.4) (see 1.2.5) For device classes Q and V: 5962 - 77008 01 V C X Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device cl

10、asses Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RH

11、A device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 LM139 Quad voltage comparator 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as follows:

12、Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 Provided by IHSNot for ResaleNo reproduct

13、ion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 3 DSCC FORM 2234 APR 97 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Out

14、line letter Descriptive designator Terminals Package style A 1/ GDFP5-F14 or CDFP6-F14 14 Flat pack C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for devic

15、e classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 2/ Supply voltage range 36 V dc or 18 V dc Input voltage range . -0.3 V dc to 36 V dc Maximum power dissipation (PD) Cases C and 2 . 900 mW 3/ Case D . 700 mW 3/ Sink current 20 mA Lead temperature (sold

16、ering, 10 seconds) . +300C Storage temperature range . -65C to +150C Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 1.4 Recommended operating conditions. Supply voltage range 5 V dc or 30 V dc Ambient operating temperature range (TA) . -55C to +125C 2.

17、 APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. D

18、EPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MI

19、L-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. 1/ Inactivate for new design. Acceptable only for use in equipment designed or redesigned on or before 29 November 1986. 2/ Stresses above the absolute maximum rating may cause permanent damage to the

20、 device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ For cases C and 2, derate above +60C ambient, 10 mW/C. For case D, derate above +25C ambient, 5.7 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,

21、-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbin

22、s Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

23、 specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the

24、 QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design

25、, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal c

26、onnections shall be as specified on figure 1. 3.2.3 Functional diagram. The functional diagrams shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postir

27、radiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. 3.

28、5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. Fo

29、r RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for d

30、evice classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed

31、 manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submi

32、tted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certifica

33、te of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, no

34、tification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review t

35、he manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 50 (see M

36、IL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performa

37、nce characteristics. Test Symbol Conditions -55C TA +125C unless otherwise specified Group A subgroups Device type Limits Unit Min Max Input offset voltage VIOV+ = 5 V to 30 V, 1 01 5.0 mV RS= 0 , VO= 1.4 V 2,3 9.0 Input offset current IIOIIN(+) IIN(-) with output in the linear range 1 01 25 nA 2,3

38、100 Input bias current IIBIIN(+) IIN(-) with output in the linear range 1 01 -100 -0.1 nA 2,3 -300 -1 Input common-mode voltage range VICRV+ = 5 V to 30 V 1,2,3 01 0 V+ -2.0 V Voltage gain AVRL 15 k, V+ = 15 V 4 01 50 V/mV 5,6 25 Output sink current I(sink) VIN(-) = 1 V, VIN(+) = 0 V, VO 1.5 V, TA=

39、+25C 1 01 6 mA Saturation voltage V(sat) VIN(-) = 1 V, VIN(+) = 0 V, 1 01 400 mV I(sink) 4 mA 2,3 700 Output leakage current IOLVIN(+) 1 V, VO= 30 V, 1 01 0.5 A VIN(-) = 0 V 2,3 1 Supply current ICCRL= , V+ = 5 V to 30 V 1,2,3 01 3 mA Input voltage common mode rejection ratio CMRR RL 15 k, V+ = 30 V

40、, VCM= 0 V to 28 V 1,2,3 01 70 dB Power supply rejection ratio PSRR V+ = 5 V to 30 V 1/ 1,2,3 01 70 dB Response time tRLHVRL= 5 V, RL= 5.1 k, 100 mV input step, TA= 25C 9 01 5 s tRHL5 mV overdrive, TA= 25C 2.5 1/ Guaranteed, if not tested to the limits specified in table I herein. Provided by IHSNot

41、 for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outlines A and C D 2 Terminal number Terminal symbol

42、1 OUT 2 OUT 1 NC 2 OUT 1 OUT 2 OUT 2 3 V+ V+ OUT 1 4 IN 1- IN 2- V+ 5 IN 1+ IN2+ NC 6 IN 2- IN 1- IN 1- 7 IN 2+ IN 1+ NC 8 IN 3- IN 3- IN 1+ 9 IN 3+ IN 3+ IN 2- 10 IN4- IN 4- IN 2+ 11 IN4+ IN 4+ NC 12 GND GND IN 3- 13 OUT 4 OUT 4 IN3+ 14 OUT 3 OUT 3 IN 4- 15 - - NC 16 - - IN 4+ 17 - - NC 18 - - GND

43、19 - - OUT 4 20 - - OUT 3 NC = No connection FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7

44、DSCC FORM 2234 APR 97 FIGURE 2. Functional diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77008 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 4.

45、VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as d

46、escribed herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology c

47、onformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A,

48、 B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specifi