DLA SMD-5962-76038 REV E-2005 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单片多路复用器肖脱基小功率TTL数字微型电路》.pdf

《DLA SMD-5962-76038 REV E-2005 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单片多路复用器肖脱基小功率TTL数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-76038 REV E-2005 MICROCIRCUIT DIGITAL LOW POWER SCHOTTKY TTL MULTIPLEXER MONOLITHIC SILICON《硅单片多路复用器肖脱基小功率TTL数字微型电路》.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED B Add vendor, FSCM 04713. Change maximum input voltage. Delete min limits from IILand propagation delays. Change supply current. Change VOLand IIHtest conditions. Change load capacitance for disable time tests. Change max limits for disable times.

2、Editorial changes throughout. 86-01-30 N. A. HAUCK C Add 02 package. Convert to Military drawing. Change power dissipation to 105 mW. Change ICC1to 15 mA max. Change ICC2to 9 mA max. Change RLto 667 ohms. Change tPHL2, subgroup 9, to 24 ns and subgroup 10 and 11 to 34 ns. Add CL= 45 pF to footnote 2

3、, table I. Change tPLZ1, CL= 50 pF, subgroups 10 and 11 to 40 ns. Change Code Ident. No. to 67268. 87-09-02 N. A. HAUCK D Update to reflect latest changes in format and requirements. Editorial changes throughout. - les 03-06-06 R. MONNIN E Make correction to the Marking paragraph 3.5. - ro 05-12-05

4、R. MONNIN CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY T. E. GORDON DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY ROBERT R. G

5、ONZALES COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. HAUCK AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 76-11-24 MICROCIRCUIT, DIGITAL, LOW POWER SCHOTTKY TTL, MULTIPLEXER, MONOLITHIC SILICON AMSC N/A REVIS

6、ION LEVEL E SIZE A CAGE CODE 14933 76038 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E045-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76038 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEV

7、EL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:

8、76038 01 E X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS258 Quad two-input data selector/multiplexer, three-state output, wi

9、th enable 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line F GDFP2-F16 or CDFP3-F16 16 Flat pack 2 CQCC1-N20 20 Square leadless chip carrier 1.2.3 Lead f

10、inish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range . -0.5 V dc to +7.0 V dc Input voltage range -1.5 V dc at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 105 mW 1/ Lead temperature (sol

11、dering, 10 seconds) +300C Thermal resistance, junction-to-case (JC): Cases E and F See MIL-STD-1835 Case 2 . 80C/W Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Max

12、imum low level input voltage (VIL) . 0.7 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand the added PDdue to short circuit test; e.g., IOS. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE

13、 A 76038 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified h

14、erein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Micr

15、ocircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksea

16、rch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes prece

17、dence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as s

18、pecified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers appro

19、ved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall

20、not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-3

21、8535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic d

22、iagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electr

23、ical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76038 DEFENSE SUPPLY CENTER COL

24、UMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOHVCC= 4.5 V, IOH= -1.0 mA, VIN=

25、 0.7 V or 2.0 V 1, 2, 3 All 2.4 V Low level output voltage VOLVCC= 4.5 V, IOL= 12 mA, VIN= 0.7 V or 2.0 V 1, 2, 3 All 0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA TC= +25C 1 All 1.5 V Low level input current at A, B, or output control IIL1VCC= 5.5 V, VIN= 0.4 V 1, 2, 3 All -0.4 mA Low level

26、 input current at select IIL2VCC= 5.5 V, VIN= 0.4 V 1, 2, 3 All -0.8 mA High level input current at A, B, or output control IIH1VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 All 20 A IIH2VCC= 5.5 V, VIN= 7.0 V 1, 2, 3 All 100 A High level input current at select IIH3VCC= 5.5 V, VIN= 2.7 V 1, 2, 3 All 40 A IIH4VCC=

27、 5.5 V, VIN= 7.0 V 1, 2, 3 All 200 A Off state output current, low level voltage applied IOZLVCC= 5.5 V, VO= 0.4 V 1, 2, 3 All -20 A Off state output current, high level voltage applied IOZHVCC= 5.5 V, VO= 2.7 V 1, 2, 3 All 20 A Short circuit output current IOS VCC= 5.5 V, VOUT= GND 1/ 1, 2, 3 All -

28、15 -130 mA Supply current ICC1VCC= 5.5 V, VIN(data) = 5.5 V, VIN(output control) = GND 1, 2, 3 All 15 mA ICC2VCC= 5.5 V, VIN(data) = GND, VIN(output control) = GND 1, 2, 3 All 9 mA ICC3VCC= 5.5 V, VIN(output control) = 5.5 V 1, 2, 3 All 19 mA Functional tests See 4.3.1c 7 All See footnote at end of

29、table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76038 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics

30、- Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max tPHL19 All 18 ns Propagation delay time, high to low level output from data input to Y VCC= 5.0 V, RL= 667 5% 2/ CL= 15 pF 10% 10, 11 All 25 ns 9 All 23 ns CL= 50 pF 10% 10,

31、11 All 35 ns tPLH19 All 18 ns Propagation delay time, low to high level output from data input to Y CL= 15 pF 10% 10, 11 All 25 ns 9 All 23 ns CL= 50 pF 10% 10, 11 All 35 ns tPHL29 All 24 ns Propagation delay time, high to low level output from select to Y CL= 15 pF 10% 10, 11 All 34 ns CL= 50 pF 10

32、% 9 All 26 ns 10, 11 All 39 ns tPLH29 All 21 ns Propagation delay time, low to high level output from select to Y CL= 15 pF 10% 10, 11 All 29 ns 9 All 26 CL= 50 pF 10% 10, 11 All 39 ns tPZL19 All 30 ns Enable time to low level output, from output control to Y CL= 15 pF 10% 10, 11 All 42 ns 9 All 35

33、CL= 50 pF 10% 10, 11 All 53 ns tPZH19 All 30 ns Enable time to high level output, from output control to Y CL= 15 pF 10% 10, 11 All 42 ns 9 All 35 CL= 50 pF 10% 10, 11 All 53 ns See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from I

34、HS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76038 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevi

35、ce type Limits Unit Min Max tPLZ19 All 25 ns Disable time from low level output, from output control to Y VCC= 5.0 V, RL= 667 5% 2/ CL= 5 pF 10% 10, 11 All 35 ns 9 All 30 ns CL= 50 pF 10% 10, 11 All 40 ns tPHZ19 All 30 ns Disable time from high level output, from output control to Y CL= 5 pF 10% 10,

36、 11 All 42 ns 9 All 46 CL= 50 pF 10% 10, 11 All 60 ns 1/ Not more than one output should be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ Propagation delay time, enable time, and disable time testing may be performed using either CL= 5 pF or CL=

37、15 pF or CL= 45 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 here

38、in. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in

39、 accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitte

40、d to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be pr

41、ovided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufa

42、cturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76038 DEFENSE SUPPLY CE

43、NTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 7 DSCC FORM 2234 APR 97 Device type 01 Case outlines E and F 2 Terminal number Terminal symbol 1 SELECT NC 2 1A SELECT 3 1B 1A 4 1Y 1B 5 2A 1Y 6 2B NC 7 2Y 2A 8 GND 2B 9 3Y 2Y 10 3B GND 11 3A NC 12 4Y 3Y 13 4B 3B 14 4A 3A 15 OUTPUT CONTR

44、OL 4Y 16 VCCNC 17 - 4B 18 - 4A 19 - OUTPUT CONTROL 20 - VCCNC = No connection. FIGURE 1. Terminal connections. Inputs Output Output control Select A B Y H X X X Z L L L X H L L H X L L H X L H L H X H L H = High level. L = Low level. X = Irelevant. Z = High impedance (off) FIGURE 2. Truth table. Pro

45、vided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76038 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 8 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo r

46、eproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76038 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be

47、 in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (

48、1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim elect