DLA SMD-5962-76032 REV E-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON《硅单片计算器肖脱基小功率TTL双极数字微型电路》.pdf
《DLA SMD-5962-76032 REV E-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON《硅单片计算器肖脱基小功率TTL双极数字微型电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-76032 REV E-2005 MICROCIRCUIT DIGITAL BIPOLAR LOW POWER SCHOTTKY TTL COUNTER MONOLITHIC SILICON《硅单片计算器肖脱基小功率TTL双极数字微型电路》.pdf(12页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED C Revised to military drawing format. Delete vendors, CAGE 07263, 27014 and 18324. Add note for no approved source available for packages A and B. Add LCC package, case outline 2. Table I, fMAX(A to QA, CL= 15 pF, 10 and 11); change 20 MHz to 19 MH
2、z. (50 pF, 10 and 11); change 23 MHz to 18 MHz. (B to QB, CL= 15 pF, 10 and 11); change from 11 MHz to 10 MHz. Change IIH3, 200 A to 80 A. IIH4, 200 A to 400 A, IIH5, 80 A to 160 A, IIH6, 400 A to 800 A. Add logic diagram. Change CAGE number to 67268. 87-10-05 R. P. Evans D Update to reflect latest
3、changes in format and requirements. Editorial changes throughout. - les 03-04-07 Raymond Monnin E Change 3.5 marking paragraph to remove “5962”. Update boilerplate to MIL-PRF-38535 requirements. - CFS 05-08-16 Thomas M. Hess CURRENT CAGE CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN RE
4、PLACED. REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Monica L. Grosel DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY D. A. Di Cenzo COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAIL
5、ABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Robert P. Evans MICROCIRCUIT, DIGITAL, BIPOLAR LOW POWER SCHOTTKY TTL, COUNTER, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 76-11-24 MONOLITHIC SILICON AMSC N/A REVISION LEVEL E SIZE A CAGE CODE 14933 76032 SHEET 1 OF 11 DSCC FORM 2233
6、APR 97 5962-E476-05 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76032 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing de
7、scribes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 76032 01 C X Drawing number Device type (see 1.2.1) Case outline(see 1
8、.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS90 Decade counter 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive
9、designator Terminals Package style A GDFP5-F14 or CDFP6-F14 14 Flat B GDFP4-F14 14 Flat C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum r
10、atings. Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range . -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) per device 1/ 85 mW Lead temperature (soldering, 10 seconds) . +300C Thermal resistance, junction-to-case (JC): See MIL-STD-18
11、35 Junction temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimim to 5.5 V dc maximum Minimum high level input voltage (VIH) 2.0 V dc Maximum low level input voltage (VIL). 0.7 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Must wit
12、hstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76032 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 3 DSCC FORM 2234 APR
13、97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contra
14、ct. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOO
15、KS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D
16、, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption h
17、as been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certifie
18、d and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in
19、 the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is requ
20、ired to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.
21、2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth tables shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified
22、herein, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are d
23、escribed in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76032 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL E SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in a
24、ccordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, ap
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