DLA DSCC-DWG-05007 REV F-2013 CAPACITORS FIXED CERAMIC CHIP 1206.pdf

《DLA DSCC-DWG-05007 REV F-2013 CAPACITORS FIXED CERAMIC CHIP 1206.pdf》由会员分享，可在线阅读，更多相关《DLA DSCC-DWG-05007 REV F-2013 CAPACITORS FIXED CERAMIC CHIP 1206.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Added “J” tolerance (5%) to all BR and BX capacitors. Added paragraphs 1.3 and 6.4. Corrected “Y” dimension in fig. 1. Revised tables VI, VII, and VIII. Added parts to table VII. 21 April 2008 Michael A. Radecki B Changed the address of vendor D 1 July 2010

2、 Michael A. Radecki C Updated tables VII and VIII for vendor D. 9 November 2010 Michael A. Radecki D Canceled PINs that have duplicates in MIL-PRF-55681. Changed the thickness dimension in fig. 1. Added K and M tolerance to BP capacitors. Specified the life test sample size. Updated tables VI, VII,

3、and VIII. 13 October 2011 Michael A. Radecki E Updated vendor offerings. 6 March 2013 Michael A. Radecki F Updated vendor offerings. 20 August 2013 Michael A. Radecki Prepared in accordance with ASME Y14.100 REV STATUS REV F F F F F F F F F F OF PAGES PAGES 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY

4、MICHAEL A. RADECKI DESIGN ACTIVITY DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OH Original date of drawing 11 April 2005 CHECKED BY MICHAEL A. RADECKI TITLE CAPACITORS, FIXED, CERAMIC, CHIP, 1206 APPROVED BY KENDALL A. COTTONGIM SIZE A CODE IDENT. NO. 037Z3 DWG NO. 05007 REV F PAGE 1 OF 10 AMSC N/A 59

5、10-2013-E20CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 HAS CHANGED NAMES TO: DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO

6、. 05007 REV F PAGE 2 1. SCOPE 1.1 Scope. This drawing and MIL-PRF-55681 describe the requirements for ceramic, chip. This drawing offers capacitors with higher capacitance values and lower voltages than those currently offered in MIL-PRF-55681/8. 1.2 Part or Identifying Number (PIN) The complete PIN

7、 is as follows: 05007- BX 102 B J Z - Drawing number Dielectric (see 1.2.1) Capacitance value (see 1.2.2) Voltage (see 1.2.3) Capacitance tolerance (see 1.2.4) Termination finish (see 1.2.5) Group C testing option (see 1.2.6) 1.2.1 Dielectric. The dielectric type is identified by the following 2 let

8、ters as defined in 3.3.1: BP, BR, BX. 1.2.2 Capacitance value. The nominal capacitance value, expressed in picofarads (pF) is identified by a three digit number; the first two digits represent significant figures and the last digit specifies the number of zeros to follow. When the nominal value is l

9、ess than 10 pF, the letter “R” is used to indicate the decimal point and the succeeding digit(s) of the group represent significant figure(s). 1R0 indicates 1.0 pF; R75 indicates .75 pF; and 0R5 indicates 0.5 pF. See tables VI, VII, and VIII for values. 1.2.3 Voltage. The rated voltage for continuou

10、s operation at +125C is identified by a single letter as shown in table I. TABLE I. Rated voltage. Symbol Rated voltage (volts, dc) X 10 Y 16 Z 25 A 50 B 100 C 200 1.2.4 Capacitance tolerance. The capacitance tolerance is identified by a single letter in accordance with table II. TABLE II. Capacitan

11、ce tolerance. Symbol Capacitance tolerance () Tolerance applicability C .25 pF BP 10 pF D .50 pF BP 10 pF F 1 percent BP 10 pF G 2 percent BP 10 pF J 5 percent BP 10 pF, BX, BR K 10 percent BP 10 pF, BX, BR M 20 percent BP 10 pF, BX, BR Provided by IHSNot for ResaleNo reproduction or networking perm

12、itted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 05007 REV F PAGE 3 1.2.5 Termination finish. Termination finish is identified by a single letter as shown in table III. TABLE III. Termination finish. Symbol Termination finish M Pal

13、ladium-silver U Base metallization-barrier metal-solder coated (tin/lead alloy, with a minimum of 4 percent lead). Solder has a melting point of +200C or less. Solder coat thickness is a minimum of 60 microinches. Z Base metallization-barrier metal-tinned (tin/lead alloy, with a minimum of 4 percent

14、 lead) 1.2.6 Group C testing option. To require MIL-PRF-55681 group C testing, use the appropriate letter from table IV. If group C testing is not desired, leave this location blank. NOTE: Ordering group C options that contain a 2,000 hour life test may extend the processing time by 90 days or more.

15、 TABLE IV. Group C testing option. Letter Group C testing option C Full group C L 2,000 hour life test only M 1,000 hour life test only H Low voltage humidity only N/A No group C testing. 1.3 MIL-PRF-55681 vs. DSCC Drawing 05007. When available, MIL-PRF-55681/8 capacitors are preferred over DSCC Dra

16、wing 05007 capacitors. The military specification requires failure rate level verification and provides additional quality assurance provisions that are not required in this drawing. Refer to tables VI and VIII for MIL-PRF-55681/8 availability guidance. 2. APPLICABLE DOCUMENTS 2.1 General. The docum

17、ents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this lis

18、t, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Government documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form

19、 a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract (see 6.2). DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, Unencapsulated, Ceramic Dielectri

20、c, Established Reliability and Non-Established Reliability, General Specification For. MIL-PRF-55681/8 - Capacitors, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-established Reliability, Style CDR32, Metric. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Electronic

21、 and Electrical Component Parts, Test Methods for. MIL-STD-1285 - Marking of Electrical and Electronic Parts. (Copies of these documents are available online at http:/quicksearch.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

22、Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 05007 REV F PAGE 4 T W Y L NOTES: 1. Dimensions are in inches. 2. Metric equivalents are given for general information

23、only. 3. Dimensions and tolerances are for bare chips. For solder coated terminations (symbol U), add .025 inch (0.64 mm) to the positive length tolerance and .015 inch (0.38 mm) to the positive width and thickness tolerances. FIGURE 1. Case dimensions and configuration. 2.3 Order of precedence. Unl

24、ess otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been

25、obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55681, and as specified herein. Unless otherwise stated, these capacitors shall be capable of meeting all electrical, environmental, and mechanical requirements of MIL-PRF-55681. 3.2

26、 Interface and physical dimensions. The interface and physical dimensions shall be as specified in MIL-PRF-55681 and herein (see figure 1). 3.2.1 Tin plated finishes. Tin plating is prohibited as a final finish or as an undercoat. Tin-lead (Sn-Pb) finishes are acceptable provided that the minimum le

27、ad content is 4 percent (see 6.4). Inches mm .008 0.20 .010 0.25 .020 0.51 .059 1.50 .062 1.57 .125 3.18 Dimensions L .008 W .008 T Max Y .010 .125 .062 .059 .020 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBU

28、S, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO. 05007 REV F PAGE 5 3.3 Electrical characteristics. 3.3.1 Dielectric type. The dielectric type shall be BP (30 ppm/C), BR (+15, -40 percent) or BX (+15, -25 percent) ceramic in accordance with table V. TABLE V. Voltage-temperature limits. Symbol Capacitance

29、 change with reference to +25C Step A through step D of MIL-PRF-55681 table XIII Percent rated voltage Step E through step G of MIL-PRF-55681 table XIII BP 0 30 ppm/C 100 0 30 ppm/C BR 15 percent 100 +15, -40 percent BX 15 percent 100 +15, -25 percent 3.3.2 Capacitance. Capacitance shall be in accor

30、dance with tables VI, VII, and VIII when measured in accordance with method 305 of MIL-STD-202. The following conditions shall apply: a. Test frequency: 1 MHz 50kHz (for all BP characteristic capacitors 1,000 pF); or 1kHz 50Hz for all other capacitors. b. Test voltage: 1.0 volt 0.2 volt rms. 3.3.3 D

31、issipation factor (+25C). The dissipation factor shall not exceed 0.15 percent for BP characteristic capacitors, 5.0 percent for 10V BR and BX characteristic capacitors, 3.5 percent for 16V and 25V BR and BX characteristic capacitors, and 2.5 percent for 50V to 200V BR and BX characteristic capacito

32、rs. 3.3.4 Insulation resistance. At +25C: minimum of 100,000 megohms or 1,000 megohm-microfarads, whichever is less. At +125C: minimum of 10,000 megohms or 100 megohm-microfarads, whichever is less for BR and BX dielectrics; and minimum of 1,000 megohms or 10 megohm-microfarads, whichever is less fo

33、r BP dielectric. 3.4 Solderability. In accordance with MIL-PRF-55681, except the sample size shall be 5 pieces with zero defectives permitted. 3.5 Moisture resistance. In accordance with MIL-PRF-55681, with the following exceptions: a. Polarizing voltage shall be rated voltage. b. Testing may be per

34、formed on chips with a larger width and/or length as long as they are cut from the same wafer(s) as those used for production. 3.6 Marking. As a minimum, marking shall be on the package due to the small size of the chips. The package marking shall be in accordance with MIL-STD-1285, except the PIN s

35、hall be as specified in paragraph 1.2 with manufacturers name or CAGE code and date code. The manufacturer may, at their option, mark some information on the chips. 3.7 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed in the MIL-PRF

36、-55681 Qualified Products Database for at least one part, or perform the group A and group C inspections specified herein on a sample of parts agreed upon by the manufacturer and DLA Land and Maritime-VAT. 3.8 Certificate of compliance. A certificate of compliance shall be required from manufacturer

37、s requesting to be an approved source of supply. 3.9 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the operational and maintenance re

38、quirements, and promotes economically advantageous life cycle costs. 3.10 Workmanship. In accordance with MIL-PRF-55681. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE SUPPLY CENTER, COLUMBUS COLUMBUS, OHIO SIZE A CODE IDENT NO. 037Z3 DWG NO

39、. 05007 REV F PAGE 6 4. VERIFICATION 4.1 Qualification inspection. Qualification inspection is not required. 4.2 Conformance inspection. 4.2.1 Inspection of product for delivery. Inspection of product for delivery shall consist of all tests specified in group A of MIL-PRF-55681. ESR testing and PPM

40、testing and calculation are not applicable. When optional group C testing is requested, terminal strength and series resonance are not applicable. In addition, the life test sample shall be 25 with one defective permitted. 5. PACKAGING 5.1 Packaging. For acquisition purposes, the packaging requireme

41、nts shall be as specified in the contract or order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging requirements are maintained by the In

42、ventory Control Points packaging activities within the Military Service or Defense Agency, or within the military services system commands. Packaging data retrieval is available from the managing Military Departments or Defense Agencys automated packaging files, CD-ROM products, or by contacting the

43、 responsible packaging activity. 6. NOTES (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.) 6.1 Intended use. Capacitors conforming to this drawing are intended for use when military specifications do not exist and qualified military de

44、vices that will perform the required function are not available for OEM application. This drawing is intended exclusively to prevent the proliferation of unnecessary duplicate specifications, drawings, and stock catalog listings. When a military specification exists and the product covered by this d

45、rawing has been qualified for listing, this drawing becomes obsolete and will not be used for new design. 6.2 Ordering data. The contract or purchase order should specify the following: a. Complete PIN (see 1.2). b. Requirements for delivery of one copy of the conformance inspection data or certific

46、ate of compliance that parts have passed conformance inspection with each shipment of parts by the manufacturer. c. Requirements for notification of change of product to acquiring activity, if applicable. d. Requirements for packaging and packing. 6.3 Replaceability. Capacitors covered by this drawi

47、ng will replace the same commercial device covered by a contractor-prepared specification or drawing. 6.4 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to y

48、ears after manufacture and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to inhibit the growth of tin wh

49、iskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification for Electrodeposited Coatings of Tin). 6.5 Users of record. Coordination of this document for future revisions is coordinated only with the approved sources of supply and the users of record of this document. Requests to be added as a recorded user of this drawing should be in writ