ASTM F458-2013(2018) Standard Practice for Nondestructive Pull Testing of Wire Bonds《引线接合无损拉拔试验的标准实施规程》.pdf

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1、Designation: F458 13 (Reapproved 2018)Standard Practice forNondestructive Pull Testing of Wire Bonds1,2This standard is issued under the fixed designation F458; the number immediately following the designation indicates the year of originaladoption or, in the case of revision, the year of last revis

2、ion.Anumber in parentheses indicates the year of last reapproval.Asuperscriptepsilon () indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the U.S. Department of Defense.1. Scope1.1 This practice covers nondestructive testing of

3、 individualwire bonds made by either ultrasonic, thermal compression orthermosonic techniques. The test is intended to reveal (bybreaking) nonacceptable wire bonds but is designed to avoiddamage to acceptable wire bonds.NOTE 1Common usage at the present time considers the term “wirebond” to include

4、the entire interconnection: both welds and the interven-ing wire span.1.2 The practice covers wire bonds made with small-diameter (from 0.0007 to 0.003-in. (18 to 76-m) wire such asthe type used in integrated circuits and hybrid microcircuits,system in package, and so forth.1.3 This practice can be

5、used only when the loop height ofthe wire bond is large enough to allow a suitable hook forpulling to be placed under the wire.1.4 While the procedure is applicable to wire of anycomposition and metallurgical state, criteria are given only forgold and aluminum wire.1.5 Adestructive pull test is used

6、 on wire bonds of the sametype and geometry to provide the basis for the determination ofthe nondestructive pulling force to be used in this practice.Thismay only be used if the sample standard deviation, s,ofthepulling forces required to destroy at least 25 of the same wirebonds tested by the destr

7、uctive pull-test method is less than orequal to 0.25 of the sample average, x.Ifs 0.25 x, thispractice may not be used.NOTE 2If s 0.25 x, some aspect of the bonding process is out ofcontrol. Following corrective action, the destructive pull-test measure-ments should be repeated to determine if the s

8、 0.25 x criterion is met.1.6 The nondestructive wire-bond pull test is to be per-formed before any other treatment or screening followingbonding and at the same point in processing as the accompa-nying destructive test. Preferably, this is done immediatelyafter bonding.1.7 The procedure does not ens

9、ure against wire-bond failuremodes induced after the test has been performed.1.8 The values stated in inch-pound units are to be regardedas standard. The values given in parentheses are mathematicalconversions to SI units that are provided for information onlyand are not considered standard.1.9 This

10、 standard does not purport to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety, health, and environmental practices and deter-mine the applicability of regulatory limitations prior to use.1.10 Th

11、is international standard was developed in accor-dance with internationally recognized principles on standard-ization established in the Decision on Principles for theDevelopment of International Standards, Guides and Recom-mendations issued by the World Trade Organization TechnicalBarriers to Trade

12、 (TBT) Committee.2. Referenced Documents2.1 ASTM Standards:3F459 Test Methods for Measuring Pull Strength of Micro-electronic Wire Bonds2.2 Military Standard:4MIL-STD-883 Method 20233. Summary of Practice3.1 The use of nondestructive wire-bond pull tests is predi-cated on data obtained from destruct

13、ive pull tests on typicalsamples selected from a lot. The maximum safe nondestructivepull-force levels are determined as a function of the metallur-gical properties of the wire and from the calculated mean (x)1This practice is under the jurisdiction of ASTM Committee F01 on Electronicsand is the dir

14、ect responsibility of Subcommittee F01.03 on Metallic Materials, WireBonding, and Flip Chip.Current edition approved March 1, 2018. Published April 2018. Originallyapproved in 1976 as F458 76 T. Last previous edition approved in 2013 as F458 13. DOI: 10.1520/F0458-13R18.2This procedure, with current

15、 status and limitations, was published in: Harman,G. G., Wire Bonding in Microelectronics, 3rd Edition, McGraw Hill, 2010,Appendix 4B.2.3For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume in

16、formation, refer to the standards Document Summary page onthe ASTM website.4Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700Robbins Ave., Philadelphia, PA 191115094, Attn: NPODS.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2

17、959. United StatesThis international standard was developed in accordance with internationally recognized principles on standardization established in the Decision on Principles for theDevelopment of International Standards, Guides and Recommendations issued by the World Trade Organization Technical

18、 Barriers to Trade (TBT) Committee.1and standard deviation (s) of the destructive pull-test datadetermined in accordance with Test Methods F459.3.2 In some cases, rather than use a calculated nondestruc-tive pull force, a fixed pull force may be agreed upon by testparticipants. This value may be bas

19、ed upon industry practice,or some other accepted value, such as that in MIL STD 883,Method 2023. All other parts of the present ASTM standardwill apply.3.3 The maximum safe nondestructive bond-pull force isthen applied as a screen for individual wire bonds to identify allbonds with pull strength bel

20、ow the predetermined level ofacceptability.4. Significance and Use4.1 The nondestructive wire-bond pull test provides a screenfor evaluating wire-bond quality and is capable of detectingweak or nonadherent bonds.4.2 The test is not destructive and does not damage accept-able wire bonds.4.3 This prac

21、tice provides a procedure for identifying abonding situation that requires corrective action.4.4 The purpose of this practice is to identify wire bondsthat may fail during subsequent screening procedures or fieldoperation.4.5 The procedure is to be applied after bonding and beforeany further treatme

22、nt.5. Interferences5.1 The same interferences apply as given in Test MethodsF459 (Section 6, Interferences); in addition this test cannot beused on multi-tiered devices.6. Apparatus6.1 The apparatus used for the procedure is identical to thatused in Test Methods F459 except that the lifting mechanis

23、mshall have the capability of stressing the wire bond up to apredetermined level. As this predetermined level may changein accordance with the results of a successive series of testsusing Test Methods F459, as well as to accommodate changesin wire composition and metallurgy, the lifting mechanismmus

24、t be capable of applying an adjustable maximum force.7. Sampling7.1 As the test is nondestructive. As such it may be used asa 100 % production line screen so that sampling is not required.7.2 The test may be used as a lot acceptance test with thesampling scheme agreed to by the participating parties

25、.8. Calibration and Standardization8.1 Calibrate the nondestructive stressing device in the samemanner as is used in calibrating the destructive wire-bondpull-test apparatus as specified in Test Methods F459.8.2 Carry out the destructive wire-bond pull test in accor-dance with either Method A or B o

26、f Test Methods F459,whichever is appropriate to the particular wire bond beingtested. Use a rate of force application within the range from 1to 30 gf/s (10 to 290 mN/s) inclusive. Record the force requiredto break the wire bond, as well as identifying the wire bond, thedevice, and whether Method A o

27、r B was used.8.2.1 For noncontinuous use of a particular bondingmachine, apply either Method A or Method B (whichever isappropriate) of Test Methods F459 to a minimum sample of atleast 25 of the same wire bonds once the bonding machine hasbeen turned on, thermally stabilized, and set up by themanufa

28、cturers procedure.8.2.2 For continuous use of a particular bonding machine,apply either Method A or B (whichever is appropriate) of TestMethods F459 to a sample of approximately 0.1 % (at least 25bonds) of the particular wire bond under study after every 2-hperiod of bonding.8.3 Given a set of n obs

29、erved values of the destructivewire-bond pull strength xi, i = 1, ., n, calculate the mean, x,and the standard deviation, s, of the destructive wire-bond pulltest in accordance with the following:8.3.1 Calculate the average wire-bond pull strength, x, asfollows:x 51n(i51nxi8.3.2 Calculate the standa

30、rd deviation for the sample, s,byeither of the following:s 5H1n 2 1(i51nxi2 x!2J1/2,or (equivalently)s 5H1n 2 1F(i51nxi22 nx!2GJ1/ 28.4 Using Table 1, select the wire composition and elonga-tion (obtainable from the wire manufacturer), and the relationbetween x and s appropriate to the wire bond to

31、be tested anddetermine the recommended maximum safe nondestructivepull (NDP) force from the corresponding entry in the lastcolumn.9. Procedure9.1 Mount the specimen to be tested and set the lifting(pulling) mechanism to apply the force level determined in 8.4.9.2 Carefully place the hook under the c

32、enter of the wire-bond loop, as in the previously performed destructive wire-bond pull test.TABLE 1 Recommended Maximum Safe Nondestructive PullForce for Aluminum and Gold WireNOTE 1s 0.25 x is inapplicableWire Relation Between xand s on the Wire-Bond Pull TestRecommendedMaximumSafe NDP ForceComposi

33、tion Elongation, %Aluminum 20 s # 0.25x (x 3s)/3Gold all 0.15x s 0.25x 0.7 (x 3s)Gold all s # 0.15x 0.7 (x 4s)F458 13 (2018)29.3 Set the rate of force application at the same as that usedin the destructive test.9.4 Actuate the lifting mechanism to stress the wire bond.9.5 Observe whether the bond br

34、eaks. (Some modern pulltesters can automatically determine/record breaks.)9.5.1 If the bond breaks, record the identification of thebond and the device containing the bond.9.5.2 If the bond does not break, accept it as satisfactory.9.6 Repeat 9.1 through 9.5 for all bonds to be tested.9.7 Record the

35、 total number of wire bonds that fail whensubjected to the predetermined stress.9.8 Record the number of devices that failed the test.10. Report10.1 Report the following information:10.1.1 Name of the person performing the test,10.1.2 Date of the test,10.1.3 Identification of the microelectronic spe

36、cimen/device,10.1.4 Identification of the specific wire bond tested,10.1.5 Identification of wire by spool and lot,10.1.6 Identification of bonding machine and pull tester,10.1.7 Mean and standard deviation of the destructivewire-bond pull tests, as well as the total number of wire bondsso tested,10

37、.1.8 Percentage of wire bonds that failed upon applicationof the predetermined safe maximum NDP force.NOTE 3Information pertaining to the failure modes observed duringthe nondestructive test may be useful in failure analysis studies.11. Keywords11.1 nondestructive pull test; wire bondsASTM Internati

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41、s, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org). Permission rights to photocopy the standard may also be secured from the Copyright Clearance Center, 222Rosewood Drive, Danvers, MA 01923, Tel: (978) 646-2600; http:/ 13 (2018)3