ASTM F458-2013 Standard Practice for Nondestructive Pull Testing of Wire Bonds1 2《金属丝连接的非破坏性抗拉试验的标准实施规范》.pdf

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1、Designation: F458 13Standard Practice forNondestructive Pull Testing of Wire Bonds1,2This standard is issued under the fixed designation F458; the number immediately following the designation indicates the year of originaladoption or, in the case of revision, the year of last revision.Anumber in par

2、entheses indicates the year of last reapproval.Asuperscriptepsilon () indicates an editorial change since the last revision or reapproval.This standard has been approved for use by agencies of the Department of Defense.1. Scope1.1 This practice covers nondestructive testing of individualwire bonds m

3、ade by either ultrasonic, thermal compression orthermosonic techniques. The test is intended to reveal (bybreaking) nonacceptable wire bonds but is designed to avoiddamage to acceptable wire bonds.NOTE 1Common usage at the present time considers the term “wirebond” to include the entire interconnect

4、ion: both welds and the interven-ing wire span.1.2 The practice covers wire bonds made with small-diameter (from 0.0007 to 0.003-in. (18 to 76-m) wire such asthe type used in integrated circuits and hybrid microcircuits,system in package, and so forth.1.3 This practice can be used only when the loop

5、 height ofthe wire bond is large enough to allow a suitable hook forpulling to be placed under the wire.1.4 While the procedure is applicable to wire of anycomposition and metallurgical state, criteria are given only forgold and aluminum wire.1.5 Adestructive pull test is used on wire bonds of the s

6、ametype and geometry to provide the basis for the determination ofthe nondestructive pulling force to be used in this practice. Thismay only be used if the sample standard deviation, s,ofthepulling forces required to destroy at least 25 of the same wirebonds tested by the destructive pull-test metho

7、d is less than orequal to 0.25 of the sample average, x.Ifs 0.25 x, thispractice may not be used.NOTE 2If s 0.25 x, some aspect of the bonding process is out ofcontrol. Following corrective action, the destructive pull-test measure-ments should be repeated to determine if the s 0.25 x criterion is m

8、et.1.6 The nondestructive wire-bond pull test is to be per-formed before any other treatment or screening followingbonding and at the same point in processing as the accompa-nying destructive test. Preferably, this is done immediatelyafter bonding.1.7 The procedure does not ensure against wire-bond

9、failuremodes induced after the test has been performed.1.8 The values stated in inch-pound units are to be regardedas standard. The values given in parentheses are mathematicalconversions to SI units that are provided for information onlyand are not considered standard.1.9 This standard does not pur

10、port to address all of thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:3F4

11、59 Test Methods for Measuring Pull Strength of Micro-electronic Wire Bonds2.2 Military Standard:4MIL-STD-883 Method 20233. Summary of Practice3.1 The use of nondestructive wire-bond pull tests is predi-cated on data obtained from destructive pull tests on typicalsamples selected from a lot. The maxi

12、mum safe nondestructivepull-force levels are determined as a function of the metallur-gical properties of the wire and from the calculated mean (x)and standard deviation (s) of the destructive pull-test datadetermined in accordance with Test Methods F459.3.2 In some cases, rather than use a calculat

13、ed nondestruc-tive pull force, a fixed pull force may be agreed upon by testparticipants. This value may be based upon industry practice,or some other accepted value, such as that in MIL STD 883,Method 2023. All other parts of the present ASTM standardwill apply.1This practice is under the jurisdict

14、ion of ASTM Committee F01 on Electronicsand is the direct responsibility of Subcommittee F01.07 on Wire Bonding, Flip Chip,and Tape Automated Bonding.Current edition approved Jan. 1, 2013. Published January 2013. Originallyapproved in 1976 as F458 76 T. Last previous edition approved in 2006 as F458

15、 06. DOI: 10.1520/F0458-13.2This procedure, with current status and limitations, was published in: Harman,G. G., Wire Bonding in Microelectronics, 3rd Edition, McGraw Hill, 2010,Appendix 4B.2.3For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at ser

16、viceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.4Available from Standardization Documents Order Desk, Bldg. 4 Section D, 700Robbins Ave., Philadelphia, PA 191115094, Attn: NPODS.Copyright ASTM International, 100 Barr

17、Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States13.3 The maximum safe nondestructive bond-pull force isthen applied as a screen for individual wire bonds to identify allbonds with pull strength below the predetermined level ofacceptability.4. Significance and Use4.1 The non

18、destructive wire-bond pull test provides a screenfor evaluating wire-bond quality and is capable of detectingweak or nonadherent bonds.4.2 The test is not destructive and does not damage accept-able wire bonds.4.3 This practice provides a procedure for identifying abonding situation that requires co

19、rrective action.4.4 The purpose of this practice is to identify wire bondsthat may fail during subsequent screening procedures or fieldoperation.4.5 The procedure is to be applied after bonding and beforeany further treatment.5. Interferences5.1 The same interferences apply as given in Test MethodsF

20、459 (Section 6, Interferences); in addition this test cannot beused on multi-tiered devices.6. Apparatus6.1 The apparatus used for the procedure is identical to thatused in Test Methods F459 except that the lifting mechanismshall have the capability of stressing the wire bond up to apredetermined le

21、vel. As this predetermined level may changein accordance with the results of a successive series of testsusing Test Methods F459, as well as to accommodate changesin wire composition and metallurgy, the lifting mechanismmust be capable of applying an adjustable maximum force.7. Sampling7.1 As the te

22、st is nondestructive. As such it may be used asa 100 % production line screen so that sampling is not required.7.2 The test may be used as a lot acceptance test with thesampling scheme agreed to by the participating parties.8. Calibration and Standardization8.1 Calibrate the nondestructive stressing

23、 device in the samemanner as is used in calibrating the destructive wire-bondpull-test apparatus as specified in Test Methods F459.8.2 Carry out the destructive wire-bond pull test in accor-dance with either Method A or B of Test Methods F459,whichever is appropriate to the particular wire bond bein

24、gtested. Use a rate of force application within the range from 1to 30 gf/s (10 to 290 mN/s) inclusive. Record the force requiredto break the wire bond, as well as identifying the wire bond, thedevice, and whether Method A or B was used.8.2.1 For noncontinuous use of a particular bondingmachine, appl

25、y either Method A or Method B (whichever isappropriate) of Test Methods F459 to a minimum sample of atleast 25 of the same wire bonds once the bonding machine hasbeen turned on, thermally stabilized, and set up by themanufacturers procedure.8.2.2 For continuous use of a particular bonding machine,ap

26、ply either Method A or B (whichever is appropriate) of TestMethods F459 to a sample of approximately 0.1 % (at least 25bonds) of the particular wire bond under study after every 2-hperiod of bonding.8.3 Given a set of n observed values of the destructivewire-bond pull strength xi, i = 1, ., n, calcu

27、late the mean, x,and the standard deviation, s, of the destructive wire-bond pulltest in accordance with the following:8.3.1 Calculate the average wire-bond pull strength, x, asfollows:x 51n(i51nxi8.3.2 Calculate the standard deviation for the sample, s,byeither of the following:s 5H1n 2 1(i51nxi2 x

28、!2J1/2,or (equivalently)s 5H1n 2 1F(i51nxi22 nx!2GJ1/ 28.4 Using Table 1, select the wire composition and elonga-tion (obtainable from the wire manufacturer), and the relationbetween x and s appropriate to the wire bond to be tested anddetermine the recommended maximum safe nondestructivepull (NDP)

29、force from the corresponding entry in the lastcolumn.9. Procedure9.1 Mount the specimen to be tested and set the lifting(pulling) mechanism to apply the force level determined in 8.4.9.2 Carefully place the hook under the center of the wire-bond loop, as in the previously performed destructive wire-

30、bond pull test.9.3 Set the rate of force application at the same as that usedin the destructive test.9.4 Actuate the lifting mechanism to stress the wire bond.9.5 Observe whether the bond breaks. (Some modern pulltesters can automatically determine/record breaks.)9.5.1 If the bond breaks, record the

31、 identification of thebond and the device containing the bond.TABLE 1 Recommended Maximum Safe Nondestructive PullForce for Aluminum and Gold WireNOTE 1s 0.25 x is inapplicableWire Relation Between xand s on the Wire-Bond Pull TestRecommendedMaximumSafe NDP ForceComposition Elongation, %Aluminum 20

32、s # 0.25x (x 3s)/3Gold all 0.15x s 0.25x 0.7 (x 3s)Gold all s # 0.15x 0.7 (x 4s)F458 1329.5.2 If the bond does not break, accept it as satisfactory.9.6 Repeat 9.1 through 9.5 for all bonds to be tested.9.7 Record the total number of wire bonds that fail whensubjected to the predetermined stress.9.8

33、Record the number of devices that failed the test.10. Report10.1 Report the following information:10.1.1 Name of the person performing the test,10.1.2 Date of the test,10.1.3 Identification of the microelectronic specimen/device,10.1.4 Identification of the specific wire bond tested,10.1.5 Identific

34、ation of wire by spool and lot,10.1.6 Identification of bonding machine and pull tester,10.1.7 Mean and standard deviation of the destructivewire-bond pull tests, as well as the total number of wire bondsso tested,10.1.8 Percentage of wire bonds that failed upon applicationof the predetermined safe

35、maximum NDP force.NOTE 3Information pertaining to the failure modes observed duringthe nondestructive test may be useful in failure analysis studies.11. Keywords11.1 nondestructive pull test; wire bondsASTM International takes no position respecting the validity of any patent rights asserted in conn

36、ection with any item mentionedin this standard. Users of this standard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the respons

37、ible technical committee and must be reviewed every five years andif not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments will receive careful c

38、onsideration at a meeting of theresponsible technical committee, which you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 10

39、0 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org). Permission rights to photocopy the standard may also be secured from the ASTM website (www.astm.org/COPYRIGHT/).F458 133