ASTM F1709-1997(2016) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications《电子薄膜应用的高纯钛溅射靶的标准规格》.pdf

《ASTM F1709-1997(2016) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications《电子薄膜应用的高纯钛溅射靶的标准规格》.pdf》由会员分享，可在线阅读，更多相关《ASTM F1709-1997(2016) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications《电子薄膜应用的高纯钛溅射靶的标准规格》.pdf（3页珍藏版）》请在麦多课文档分享上搜索。

1、Designation: F1709 97 (Reapproved 2016)Standard Specification forHigh Purity Titanium Sputtering Targets for Electronic ThinFilm Applications1This standard is issued under the fixed designation F1709; the number immediately following the designation indicates the year oforiginal adoption or, in the

2、case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This specification covers pure titanium sputtering tar-gets used as a raw material in fa

3、bricating semiconductorelectronic devices.1.2 This standard sets purity grade levels, physicalattributes, analytical methods, and packaging.1.2.1 The grade designation is a measure of total metallicimpurity content. The grade designation does not necessarilyindicate suitability for a particular appl

4、ication because factorsother than total metallic impurity may influence performance.2. Referenced Documents2.1 ASTM Standards:2E112 Test Methods for Determining Average Grain Size3. Terminology3.1 Definitions of Terms Specific to This Standard:3.1.1 finished product, n for the purposes of this stand

5、ard,a “finished product” is a manufactured sputtering target, readyfor use.3.1.2 material lot, nfor the purpose of this standard,a“lot” is material melted into one ingot, and processed as onecontinuous batch in subsequent thermal-mechanical treat-ments.4. Classification4.1 Grades of titanium sputter

6、ing targets are defined inTable 1, based upon total metallic impurity content of theelements listed in Table 2. Impurity contents are reported inparts per million by weight (wt ppm). Higher purity grades, forexample “5N5” and“ 6N”, may be provided, as agreed uponbetween the purchaser and the supplie

7、r.4.2 Purity grade and total metallic impurity levels are basedupon the suite of elements listed in Table 2.5. Ordering Information5.1 Orders for pure titanium sputtering targets shall includethe following:5.1.1 Grade (see 4.1),5.1.2 Special requirements concerning impurities, if re-quired (see 6.1,

8、 6.2, 6.3, 6.4),5.1.3 Grain size, if required (Section 7),5.1.4 Configuration (Section 8),5.1.5 Certification required (Section 12), and5.1.6 Whether or not a sample representative of the finishedproduct is required to be provided by the supplier to thepurchaser.6. Impurities6.1 The minimum suite of

9、 metallic impurity elements to beanalyzed is defined in Table 2. Acceptable analysis methodsand detection limits are specified in Section 11. Elements notdetected will be counted and reported as present at theminimum detection limit (“mdl”). Additional elements may beanalyzed and reported as agreed

10、upon between the purchaserand the supplier, but these shall not be counted in defining thegrade designation.6.2 Cesium, chlorine, phosphorus, and tantalum presentparticular analysis problems. The limits, analysis method, andmdl may be as agreed upon between the purchaser and thesupplier.6.3 Nonmetal

11、lic elements which shall be analyzed andreported are carbon, hydrogen, nitrogen, oxygen, and sulfur.Maximum limits for nonmetallic impurities shall be as agreedupon between the purchaser and the supplier.6.4 Acceptable limits and analytical techniques for particu-lar elements in critical application

12、s may be agreed uponbetween the purchaser and the supplier.7. Grain Size7.1 The average and the maximum grain size shall be asagreed upon between the purchaser and the supplier.1This specification is under the jurisdiction of ASTM Committee F01 onElectronics and is the direct responsibility of Subco

13、mmittee F01.17 on SputterMetallization.Current edition approved May 1, 2016. Published May 2016. Originallyapproved in 1996. Last previous edition approved in 2008 as F1709 97(2008).DOI: 10.1520/F1709-97R16.2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer

14、 Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959. United States17.2 Average grain size shall be measured

15、 and reported inaccordance with Test Methods E112, or other equivalentmethod.7.3 Maximum grain size shall be established by making anoptical or scanning electron micrograph of a polished andetched specimen typical of the finished product. The magnifi-cation must be calibrated to 6 10 % of nominal us

16、ing anappropriate gage. At least 50 grains must be resolved in themicrograph. The maximum grain size is the diagonal measureof the largest titanium crystal visible in the field of view,divided by the magnification.7.4 Average grain size and maximum grain size can alter-natively be established using

17、computer-assisted image analysismethods. If image analysis methods are used, then the averagegrain size is defined as the mean value obtained from the graindiameter distribution data. The maximum grain size is definedas the largest grain diameter recorded in the grain sizedistribution data set. At l

18、east 50 grains must be included in theimage analysis data set.8. Configuration8.1 Each product shall conform to an appropriate engineer-ing drawing, agreed upon between the purchaser and thesupplier.8.2 Nominal dimensions, tolerances, and other attributesshall be agreed upon between the purchaser an

19、d the supplier.9. Workmanship, Finish, Appearance9.1 Workmanship, finish, and appearance shall be agreedupon between the purchaser and the supplier.9.2 Surfaces must be free of any contaminates such as dirtor oils that could adversely effect the performance of thematerial, as agreed upon between the

20、 purchaser and thesupplier.10. Sampling10.1 Analysis for impurities and gasses shall be performedon samples that are representative of the finished sputteringtarget.10.1.1 Unless otherwise agreed upon between the purchaserand the supplier, impurity analyses for metallic and nonmetal-lic impurities s

21、hall be made by the supplier for one or moresample specimens that are representative of the production lot.These data shall be averaged to establish conformance with thegrade designation (4.1), other metallic impurity limits (6.1, 6.2,6.4), and the agreed upon limits for nonmetallic content (6.3).11

22、. Analytical Methods11.1 Analysis for impurities listed in Section 6 and Table 2shall be performed as follows:11.1.1 Trace Metallic ImpuritiesBy glow discharge massspectrometer (GDMS) with a nominal mdl 0.05 weight ppm.NOTE 1The mdl for some metallic species by GDMS is 0.05 weightppm, as limited by

23、interferences.11.1.2 Carbon, Oxygen, SulfurBy fusion and gasextraction/infrared spectroscopy3with an mdl of 10 weightppm.11.1.3 NitrogenBy fusion and gas extraction with an mdlof 10 weight ppm.11.1.4 HydrogenBy fusion and gas extraction with an mdlof 3 weight ppm.11.1.5 Other analytical techniques m

24、ay be used providedthey can be proved equivalent to the methods specified andhave mdl less than or equal to the specified methods.12. Certification12.1 When required by the purchaser a certificate ofanalysis/compliance that documents the finished target shall beprovided by the supplier.12.2 The cert

25、ificate of analysis/compliance shall state themanufacturers or suppliers name, the suppliers lot number,the grade level (Section 4), impurity levels (Section 6), methodof analysis (Section 11), and any other information as agreedupon between the purchaser and the supplier.12.2.1 Impurities Reporting

26、 Option 1: If agreed upon be-tween the purchaser and the supplier, impurity levels may bereported using actual analytical results for the material lot fromwhich the sputtering target is made (10.1.1). All impuritylevels, except thorium and uranium, shall be reported in weightppm. Thorium and uranium

27、 are generally controlled at verylow levels in this material and may be reported in parts perbillion by weight (weight ppb). Nondetected trace impurities(Section 6) shall be reported as present at the mdl concentration(Section 11).12.2.2 Impurities Reporting Option 2: If agreed upon be-tween the pur

28、chaser and the supplier, impurity levels may bereported by citing typical results based upon historical data forthe same process.13. Packaging13.1 Each piece shall be enclosed in packaging that insuresfreedom from contamination in handling and shipping. Eachpiece shall be packed for shipment in a sh

29、ipping container thatinsures product integrity during transport.3Analytical equipment manufactured by Leco Corporation, St. Joseph, MI hasbeen found satisfactory for making fusion and gas extraction analyses for carbon,oxygen, sulfur, nitrogen, and hydrogen at the required mdls.TABLE 1 Titanium Sput

30、tering Target GradesGrade Purity, % Maximum Total Metallic ImpurityContent, wt ppm4N 99.99 1004N5 99.995 505N 99.999 10TABLE 2 Suite of Metallic Elements to be Analyzed and Reportedaluminum iron silicon vanadiumchromium lead silver zinccobalt lithium potassium sodiumzirconium copper magnesium thoriu

31、mboron manganese tin molybdenumtungsten nickel uraniumF1709 97 (2016)214. Keywords14.1 coating; sputtering; target; thin film; titaniumASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this stand

32、ard are expressly advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years andi

33、f not revised, either reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical committee, wh

34、ich you may attend. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,

35、United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org). Permission rights to photocopy the standard may also be secured from the Copyright Clearance Center, 222Rosewood Drive, Danvers, MA 01923, Tel: (978) 646-2600; http:/ 97 (2016)3