ASTM F1709-1997(2008) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications《电子薄膜用高纯度钛溅射靶机的标准规范》.pdf

《ASTM F1709-1997(2008) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications《电子薄膜用高纯度钛溅射靶机的标准规范》.pdf》由会员分享，可在线阅读，更多相关《ASTM F1709-1997(2008) Standard Specification for High Purity Titanium Sputtering Targets for Electronic Thin Film Applications《电子薄膜用高纯度钛溅射靶机的标准规范》.pdf（3页珍藏版）》请在麦多课文档分享上搜索。

1、Designation: F 1709 97 (Reapproved 2008)Standard Specification forHigh Purity Titanium Sputtering Targets for Electronic ThinFilm Applications1This standard is issued under the fixed designation F 1709; the number immediately following the designation indicates the year oforiginal adoption or, in th

2、e case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This specification covers pure titanium sputtering tar-gets used as a raw material in

3、fabricating semiconductorelectronic devices.1.2 This standard sets purity grade levels, physical at-tributes, analytical methods, and packaging.1.2.1 The grade designation is a measure of total metallicimpurity content. The grade designation does not necessarilyindicate suitability for a particular

4、application because factorsother than total metallic impurity may influence performance.2. Referenced Documents2.1 ASTM Standards:2E112 Test Methods for Determining Average Grain Size3. Terminology3.1 Definitions of Terms Specific to This Standard:3.1.1 finished product, nfor the purposes of this st

5、andard,a “finished product” is a manufactured sputtering target, readyfor use.3.1.2 material lot, nfor the purpose of this standard,a“lot” is material melted into one ingot, and processed as onecontinuous batch in subsequent thermal-mechanical treat-ments.4. Classification4.1 Grades of titanium sput

6、tering targets are defined inTable 1, based upon total metallic impurity content of theelements listed in Table 2. Impurity contents are reported inparts per million by weight (wt ppm). Higher purity grades, forexample “5N5” and“ 6N”, may be provided, as agreed uponbetween the purchaser and the supp

7、lier.4.2 Purity grade and total metallic impurity levels are basedupon the suite of elements listed in Table 2.5. Ordering Information5.1 Orders for pure titanium sputtering targets shall includethe following:5.1.1 Grade (see 4.1),5.1.2 Special requirements concerning impurities, if re-quired (see 6

8、.1, 6.2, 6.3, 6.4),5.1.3 Grain size, if required (Section 7),5.1.4 Configuration (Section 8),5.1.5 Certification required (Section 12), and5.1.6 Whether or not a sample representative of the finishedproduct is required to be provided by the supplier to thepurchaser.6. Impurities6.1 The minimum suite

9、 of metallic impurity elements to beanalyzed is defined in Table 2. Acceptable analysis methodsand detection limits are specified in Section 11. Elements notdetected will be counted and reported as present at theminimum detection limit (“mdl”). Additional elements may beanalyzed and reported as agre

10、ed upon between the purchaserand the supplier, but these shall not be counted in defining thegrade designation.6.2 Cesium, chlorine, phosphorus, and tantalum presentparticular analysis problems. The limits, analysis method, andmdl may be as agreed upon between the purchaser and thesupplier.6.3 Nonme

11、tallic elements which shall be analyzed andreported are carbon, hydrogen, nitrogen, oxygen, and sulfur.1This specification is under the jurisdiction of ASTM Committee F01 onElectronics and is the direct responsibility of Subcommittee F01.17 on SputterMetallization.Current edition approved June 15, 2

12、008. Published July 2008. Originallyapproved in 1996. Last previous edition approved in 2002 as F 1709 97(2002).2For referenced ASTM standards, visit the ASTM website, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the

13、standards Document Summary page onthe ASTM website.TABLE 1 Titanium Sputtering Target GradesGrade Purity, % Maximum Total Metallic ImpurityContent, wt ppm4N 99.99 1004N5 99.995 505N 99.999 10TABLE 2 Suite of Metallic Elements to be Analyzed and Reportedaluminum iron silicon vanadiumchromium lead sil

14、ver zinccobalt lithium potassium sodiumzirconium copper magnesium thoriumboron manganese tin molybdenumtungsten nickel uranium1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States.Maximum limits for nonmetallic impurities shall be as agree

15、dupon between the purchaser and the supplier.6.4 Acceptable limits and analytical techniques for particu-lar elements in critical applications may be agreed uponbetween the purchaser and the supplier.7. Grain Size7.1 The average and the maximum grain size shall be asagreed upon between the purchaser

16、 and the supplier.7.2 Average grain size shall be measured and reported inaccordance with Test Methods E112, or other equivalentmethod.7.3 Maximum grain size shall be established by making anoptical or scanning electron micrograph of a polished andetched specimen typical of the finished product. The

17、 magnifi-cation must be calibrated to 6 10 % of nominal using anappropriate gage. At least 50 grains must be resolved in themicrograph. The maximum grain size is the diagonal measureof the largest titanium crystal visible in the field of view,divided by the magnification.7.4 Average grain size and m

18、aximum grain size can alter-natively be established using computer-assisted image analysismethods. If image analysis methods are used, then the averagegrain size is defined as the mean value obtained from the graindiameter distribution data. The maximum grain size is definedas the largest grain diam

19、eter recorded in the grain sizedistribution data set. At least 50 grains must be included in theimage analysis data set.8. Configuration8.1 Each product shall conform to an appropriate engineer-ing drawing, agreed upon between the purchaser and thesupplier.8.2 Nominal dimensions, tolerances, and oth

20、er attributesshall be agreed upon between the purchaser and the supplier.9. Workmanship, Finish, Appearance9.1 Workmanship, finish, and appearance shall be agreedupon between the purchaser and the supplier.9.2 Surfaces must be free of any contaminates such as dirtor oils that could adversely effect

21、the performance of thematerial, as agreed upon between the purchaser and thesupplier.10. Sampling10.1 Analysis for impurities and gasses shall be performedon samples that are representative of the finished sputteringtarget.10.1.1 Unless otherwise agreed upon between the purchaserand the supplier, im

22、purity analyses for metallic and nonmetal-lic impurities shall be made by the supplier for one or moresample specimens that are representative of the production lot.These data shall be averaged to establish conformance with thegrade designation (4.1), other metallic impurity limits (6.1, 6.2,6.4), a

23、nd the agreed upon limits for nonmetallic content (6.3).11. Analytical Methods11.1 Analysis for impurities listed in Section 6 and Table 2shall be performed as follows:11.1.1 Trace Metallic ImpuritiesBy glow discharge massspectrometer (GDMS) with a nominal mdl#0.05 weight ppm.NOTE 1The mdl for some

24、metallic species by GDMS is 0.05 weightppm, as limited by interferences.11.1.2 Carbon, Oxygen, SulfurBy fusion and gasextraction/infrared spectroscopy3with an mdl of #10 weightppm.11.1.3 NitrogenBy fusion and gas extraction with an mdlof #10 weight ppm.11.1.4 HydrogenBy fusion and gas extraction wit

25、h an mdlof #3 weight ppm.11.1.5 Other analytical techniques may be used providedthey can be proved equivalent to the methods specified andhave mdl less than or equal to the specified methods.12. Certification12.1 When required by the purchaser a certificate ofanalysis/compliance that documents the f

26、inished target shall beprovided by the supplier.12.2 The certificate of analysis/compliance shall state themanufacturers or suppliers name, the suppliers lot number,the grade level (Section 4), impurity levels (Section 6), methodof analysis (Section 11), and any other information as agreedupon betwe

27、en the purchaser and the supplier.12.2.1 Impurities Reporting Option 1:If agreed upon between the purchaser and the supplier,impurity levels may be reported using actual analytical resultsfor the material lot from which the sputtering target is made(10.1.1).All impurity levels, except thorium and ur

28、anium, shallbe reported in weight ppm. Thorium and uranium are generallycontrolled at very low levels in this material and may bereported in parts per billion by weight (weight ppb). Nonde-tected trace impurities (Section 6) shall be reported as presentat the mdl concentration (Section 11).12.2.2 Im

29、purities Reporting Option 2:If agreed upon between the purchaser and the supplier,impurity levels may be reported by citing typical results basedupon historical data for the same process.13. Packaging13.1 Each piece shall be enclosed in packaging that insuresfreedom from contamination in handling an

30、d shipping. Eachpiece shall be packed for shipment in a shipping container thatinsures product integrity during transport.14. Keywords14.1 coating; sputtering; target; thin film; titanium3Analytical equipment manufactured by Leco Corporation, St. Joseph, MI hasbeen found satisfactory for making fusi

31、on and gas extraction analyses for carbon,oxygen, sulfur, nitrogen, and hydrogen at the required mdls.F 1709 97 (2008)2ASTM International takes no position respecting the validity of any patent rights asserted in connection with any item mentionedin this standard. Users of this standard are expressl

32、y advised that determination of the validity of any such patent rights, and the riskof infringement of such rights, are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years andif not revised, e

33、ither reapproved or withdrawn. Your comments are invited either for revision of this standard or for additional standardsand should be addressed to ASTM International Headquarters. Your comments will receive careful consideration at a meeting of theresponsible technical committee, which you may atte

34、nd. If you feel that your comments have not received a fair hearing you shouldmake your views known to the ASTM Committee on Standards, at the address shown below.This standard is copyrighted by ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959,United States. Individual reprints (single or multiple copies) of this standard may be obtained by contacting ASTM at the aboveaddress or at 610-832-9585 (phone), 610-832-9555 (fax), or serviceastm.org (e-mail); or through the ASTM website(www.astm.org).F 1709 97 (2008)3