ASTM D5127-2007 Standard Guide for Ultra-Pure Water Used in the Electronics and Semiconductor Industries《电子学和半导体工业用超纯水标准指南》.pdf

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1、Designation: D 5127 07Standard Guide forUltra-Pure Water Used in the Electronics andSemiconductor Industries1This standard is issued under the fixed designation D 5127; the number immediately following the designation indicates the year oforiginal adoption or, in the case of revision, the year of la

2、st revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope1.1 This guide provides recommendations for water qualityrelated to electronics and semiconductor-industry manufactur-ing.

3、Six classifications of water are described, including waterfor line widths as low as 0.09 micron. In all cases, therecommendations are for water at the point of distribution(POD).1.2 Water is used for washing and rinsing of semiconductorcomponents during manufacture. Water is also used for clean-ing

4、 and etching operations, making steam for oxidation ofsilicon surfaces, preparing photomasks, and depositing lumi-nescent materials. Other applications are in the developmentand fabrication of solid-state devices, thin-film devices, com-munication lasers, light-emitting diodes, photo-detectors,print

5、ed circuits, memory devices, vacuum-tube devices, orelectrolytic devices.1.3 Users needing water qualities different from those de-scribed here should consult other water standards, such asSpecification D 1193 and Guide D 5196.1.4 This standard does not purport to address all of thesafety concerns,

6、if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2D 1129 Terminology Relating to WaterD 1193 Sp

7、ecification for Reagent WaterD 1976 Test Method for Elements in Water by Inductively-Coupled Argon Plasma Atomic Emission SpectroscopyD 2791 Test Method for On-line Determination of Sodiumin WaterD 3919 Practice for Measuring Trace Elements in Water byGraphite Furnace Atomic Absorption Spectrophotom

8、etryD 4191 Test Method for Sodium in Water by AtomicAbsorption SpectrophotometryD 4192 Test Method for Potassium in Water by AtomicAbsorption SpectrophotometryD 4327 Test Method for Anions in Water by ChemicallySuppressed Ion ChromatographyD 4453 Practice for Handling of Ultra-Pure Water SamplesD 45

9、17 Test Method for Low-Level Total Silica in High-Purity Water by Flameless Atomic Absorption Spectros-copyD 5173 Test Method for On-Line Monitoring of CarbonCompounds in Water by Chemical Oxidation, by UV LightOxidation, by Both, or by High Temperature CombustionFollowed by Gas Phase NDIR or by Ele

10、ctrolytic Conduc-tivityD 5196 Guide for Bio-Applications Grade WaterD 5391 Test Method for Electrical Conductivity and Resis-tivity of a Flowing High Purity Water SampleD 5462 Test Method for On-Line Measurement of Low-Level Dissolved Oxygen in WaterD 5542 Test Methods for TraceAnions in High Purity

11、 Waterby Ion ChromatographyD 5544 Test Method for On-Line Measurement of ResidueAfter Evaporation of High-Purity WaterD 5673 Test Method for Elements in Water by InductivelyCoupled PlasmaMass SpectrometryD 5996 Test Method for Measuring Anionic Contaminantsin High-Purity Water by On-Line Ion Chromat

12、ographyD 5997 Test Method for On-Line Monitoring of Total Car-bon, Inorganic Carbon in Water by Ultraviolet, PersulfateOxidation, and Membrane Conductivity DetectionF 1094 Test Methods for Microbiological Monitoring ofWater Used for Processing Electron and MicroelectronicDevices by Direct Pressure T

13、ap Sampling Valve and by thePresterilized Plastic Bag Method3. Terminology3.1 DefinitionsFor definitions of terms used in this guiderefer to Terminology D 1129.3.2 Definitions of Terms Specific to This Standard:1This guide is under the jurisdiction of ASTM Committee D19 on Water and isthe direct res

14、ponsibility of Subcommittee D19.02 on General Specifications,Technical Resources, and Statistical Methods.Current edition approved April 15, 2007. Published May 2007. Originallyapproved in 1990. Last previous edition approved in 1999 as D 5127 99.2For referenced ASTM standards, visit the ASTM websit

15、e, www.astm.org, orcontact ASTM Customer Service at serviceastm.org. For Annual Book of ASTMStandards volume information, refer to the standards Document Summary page onthe ASTM website.1Copyright ASTM International, 100 Barr Harbor Drive, PO Box C700, West Conshohocken, PA 19428-2959, United States

16、.3.2.1 total bacterial counts, ntotal number of cultureablemicroorganisms present in the named sample, excluding obli-gate anaerobic organisms, determined in accordance with TestMethods F 1094.3.2.2 total organic carbon (TOC), ncarbon measuredafter inorganic-carbon response has been eliminated by on

17、e ofthe prescribed ASTM test methods.4. Significance and Use4.1 This guide recommends the water quality required forthe electronics and microelectronics industries. High-puritywater is required to prevent contamination of products duringmanufacture, since contamination can lead to an unacceptable,lo

18、w yield of electronic devices.4.2 The range of water purity is defined in accordance withthe manufacturing process. The types of ultra-pure water aredefined with respect to device line width. In all cases, thewater-quality recommendations apply at the point of distribu-tion.4.3 The limits on the imp

19、urities are related to currentcontamination specifications and to available analytical meth-ods (either performed in a suitable clean laboratory or byon-line instrumentation). On-line and off-line methods are usedin accordance with current industry practice. Concentration ofthe sample may be require

20、d to measure the impurities at thelevels indicated in Table 1.5. Classification5.1 Six types of electronic-grade water are described in thisguide. In all cases, the water-quality recommendations apply atthe point of distribution.5.1.1 Type E-1This water is classified as microelectronicwater to be us

21、ed in the production of devices having linewidths between 0.5 and 1.0 m.5.1.2 Type E-1.1This water is classified as microelec-tronic water to be used in the production of devices having linewidths between 0.25 and 0.35 m.TABLE 1 Requirements for Water at the Point of Distribution in the Electronics

22、and Semiconductor IndustriesAParameter Type E-1 Type E-1.1 Type E-1.2 Type E-2 Type E-3 Type E-4Linewidth (microns) 1.00.5 0.350.25 0.180.09 5.01.0 5.0 Resistivity, 25C (On-line) 18.1 18.2 18.2 16.5 12 0.5TOC (g/L) (on-line for 10 ppb) 5 2 1 50 300 1000On-line dissolved oxygen (g/L) 25 10 3 On-Line

23、Residue after evaporation (g/L) 1 0.5 0.1 On-line particles/L (micron range)0.050.1 1000 200 0.10.2 1000 350 100 0.20.5 500 100 10 0.5-1.0 200 50 5 1.0 100 20 1 SEM particles/L (micron range)0.10.2 1000 700 250 0.20.5 500 400 100 3000 0.51 100 50 30 10 000 10 50 30 10 100 000Bacteria in CFU/Volume10

24、0 mL Sample 5 3 1 10 50 1001 L Sample 10Silica total (g/L) 5 3 1 10 50 1000Silica dissolved (g/L) 3 1 0.5 Anions and Ammonium by IC (g/L)Ammonium 0.1 0.10 0.05 Bromide 0.1 0.05 0.02 Chloride 0.1 0.05 0.02 1 10 1000Fluoride 0.1 0.05 0.03 Nitrate 0.1 0.05 0.02 1 5 500Nitrite 0.1 0.05 0.02 Phosphate 0.

25、1 0.05 0.02 1 5 500Sulfate 0.1 0.05 0.02 1 5 500Metals by ICP/MS (g/L)Aluminum 0.05 0.02 0.005 Barium 0.05 0.02 0.001 BoronB0.3 0.1 0.05 Calcium 0.05 0.02 0.002 Chromium 0.05 0.02 0.002 Copper 0.05 0.02 0.002 1 2 500Iron 0.05 0.02 0.002 Lead 0.05 0.02 0.005 Lithium 0.05 0.02 0.003 Magnesium 0.05 0.0

26、2 0.002 Manganese 0.05 0.02 0.002 Nickel 0.05 0.02 0.002 1 2 500Potassium 0.05 0.02 0.005 2 5 500Sodium 0.05 0.02 0.005 1 5 1000Strontium 0.05 0.02 0.001 Zinc 0.05 0.02 0.002 1 5 500AThe user should be advised that analytical data often are instrument dependent and technique dependent. Thus, the num

27、bers in Table 1 are only guidelines.BBoron is monitored only as an operational parameter for monitoring the ion-exchange beds.D51270725.1.3 Type E-1.2This water is classified as microelec-tronic water to be used in the production of devices having linewidths between 0.09 and 0.18 m. It is the water

28、of ultimatepractical purity produced in large volumes, and is intended forthe most critical uses.5.1.4 Type E-2This water is classified as microelectronicwater to be used in the production of devices that havedimensions between 1 and 5 m.5.1.5 Type E-3This grade of water is classified as macro-elect

29、ronic water to be used in the production of devices havingdimensions larger than 5 m. This grade may be used toproduce larger components and some small components notaffected by trace amounts of impurities.5.1.6 Type E-4This grade may be classified as water usedin preparation of plating solutions an

30、d for other applicationswhere the water being used can be of lesser quality.5.2 Components of the water system for producingelectronic-grade water shall be grouped into five generalprocess sections for the purpose of simplifying the organizationof the components of the systems. These processes are d

31、e-scribed in 5.2.1-5.2.5.5.2.1 PretreatmentThe processes in this category includethe addition of various types of coagulants, precipitatingagents, clarifiers, sedimentation tanks, and particulate-filtrationsystems (including sand filters, disposable filter elements,ultrafilter membranes, and other p

32、article-removing systems).Adsorbent or entrapment beds may include greensand, acti-vated carbon, and various synthetic materials specific forcertain organic and inorganic impurities.5.2.2 DesalinationThis process is fundamental to theproduction of ultra-pure water of all grades, and may includemore

33、than one of the processes of ion exchange, reverseosmosis, electrodialysis, continuous electrodeionization, or allof the above. The size of the system governs the choice of thecombination of desalination processes. Various configurationsof the different processes should be considered, includingtwo-b

34、ed and mixed-bed demineralization, multi-stage reverseosmosis employing various types of membranes, electrodeion-ization, and electrodialysis.5.2.3 Organic and Biological Removal SystemsRemovalof biological and organic contaminants is an important adjunctto any system used to prepare ultra-pure wate

35、r. Dissolvedorganic compounds can accumulate in the system during theprocess as well as being present in the original water. Methodsof minimizing biological contamination include the addition ofhydrogen peroxide and ozone. Ultraviolet irradiation at the 185nm wavelength provides intense energy for b

36、reaking chemicalbonds and produces traces of ozone. The 185 nm light lysesbacteria and breaks down organic compounds to organic acidsand carbon dioxide. With the destruction of organics, TOC willbe reduced. Therefore, 185 nm light should only be usedupstream of the final ion-exchange component. Ultr

37、avioletirradiation at 254 nm significantly reduces the growth oforganisms by dislocating the DNA base pairs. This processprevents the bacteria from replicating. Membrane filters (in-cluding reverse osmosis and ultrafilters) may also removebiological impurities as well as organic molecules. Synthetic

38、adsorbent columns ranging from porous resins to activatedcarbon may be effective in removing organics.5.2.4 Particulate RemovalParticulate removal in the pro-duction of ultra-pure water is differentiated from pretreatmentthat removes gross suspended substances. Particles of all types(biological, org

39、anic, or inorganic) significantly interfere withthe production of electronic components. Processes used toremove particulate matter generally consist of the use of amicroporous membrane structure of flat, cylindrical, or pleatedconfiguration. The Final Filters are preceded by a bank ofPrefilters wit

40、h a 23 larger pore size. Ultrafilters and reverse-osmosis units may also be used for final filtration. The choiceof the particular membrane depends in part upon the pore size,characteristics of that membrane, and the size of particle to beremoved.As a general rule, particles should be removed if the

41、yare larger than 10 % of the minimum dimension of the devicebeing produced.5.2.5 Storage and Distribution SystemThe storage ofelectronic-grade water during production is very important,because impurities are added to the water in proportion to thesolubility of the impurities, the area of contact, an

42、d time ofcontact between the water, the air, the materials of contain-ment, or combinations thereof. Because it is important tominimize the contact of the water with the storage container,the volume of storage should also be minimized. A loop-distribution design is preferred to an antenna-distributi

43、ondesign, the latter of which can constitute dead legs duringperiods of non-use. Particular emphasis must be placed uponthe atmosphere above the water, since those gases maycontaminate the water with biological, organic, inorganic, andparticulate impurities. High-purity nitrogen ($99.999 % pure)shou

44、ld be used to blanket the atmosphere above the storedwater. The storage of E-1, E-1.1, E-1.2, E-2, and E-3 waters isimpossible (if expecting to maintain purity as described inTable 1); therefore, all storage should be before the tertiarysection (see 5.3.3 for a discussion of “tertiary section”).5.2.

45、5.1 The distribution systems also present a large area ofcontact between the water and pipe or tubing and, therefore,must be of a pure, insoluble substance. Once again, the degreeof contamination depends upon the solubility of the materialsof contact, as well as the time of contact. For these reason

46、s andbecause biological impurities tend to accumulate in stagnantwater, the flow of water through the distribution system mustbe maintained on a continuous 24-h basis. The flow rate shouldbe at least 3 ft/s, and 5 to 7 ft/s is recommended; this flow rateis particularly applicable through large pipes

47、 (that is, above 50mm in diameter) that have a small surface-to-volume ratio. Tomaintain E-1, E-1.1, or E-1.2 specifications, a fluorinated-polymer piping such as PVDF is required.5.2.5.2 Polymer material should be installed with care andwithout the use of oils of any kind. Generally, cleaning prior

48、 touse is best accomplished by rinsing for several days with purewater. If the system has been idle for a period of time or wasnot clean when installed, a system sanitization using hydrogenperoxide or ozone might be required. The distribution outletsmust also be of non-contaminating design and mater

49、ials;particular care must be given to minimizing the possibility ofback contamination of the system from the faucet or valveD5127073outlet. To maintain E-1, E-1.1, or E-1.2 specifications, afluorinated-polymer piping such as PVDF is required.5.3 Component Sections:5.3.1 Primary SectionThis section of the water systemperforms the primary purification of the input water. Theprimary section should utilize one or mor