ASTM D3808-2001(2013) Standard Test Method for Qualitative Determination of Adhesion of Adhesives to Substrates by Spot Adhesion《用点粘试验法定性测定胶粘剂与基底间粘性的标准试验方法》.pdf
《ASTM D3808-2001(2013) Standard Test Method for Qualitative Determination of Adhesion of Adhesives to Substrates by Spot Adhesion《用点粘试验法定性测定胶粘剂与基底间粘性的标准试验方法》.pdf》由会员分享,可在线阅读,更多相关《ASTM D3808-2001(2013) Standard Test Method for Qualitative Determination of Adhesion of Adhesives to Substrates by Spot Adhesion《用点粘试验法定性测定胶粘剂与基底间粘性的标准试验方法》.pdf(2页珍藏版)》请在麦多课文档分享上搜索。
1、Designation: D3808 01 (Reapproved 2013)Standard Test Method forQualitative Determination of Adhesion of Adhesives toSubstrates by Spot Adhesion1This standard is issued under the fixed designation D3808; the number immediately following the designation indicates the year oforiginal adoption or, in th
2、e case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon () indicates an editorial change since the last revision or reapproval.1. Scope1.1 This test method covers a simple qualitative procedurefor quickly screening whether an
3、 adhesive will, under recom-mended application conditions, bond to a given substratewithout actually making bonded assemblies.1.2 The values stated in SI units are to be regarded as thestandard. The values in parentheses are for information only.1.3 This standard does not purport to address all of t
4、hesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2D907 Terminology of Adhesi
5、vesE171 Practice for Conditioning and Testing Flexible BarrierPackaging3. Terminology3.1 DefinitionsMany of the terms used in this test methodare defined in Terminology D907.3.1.1 spot adhesion, na qualitative method of determiningadhesion by attempting to pry a “spot” of cured adhesive froma substr
6、ate.4. Summary of Test Method4.1 Spots of adhesive (size can vary, but generally about 6mm (14 in.) in diameter) are placed onto a substrate using theapplication procedure and curing conditions acceptable to bothuser and supplier of the adhesive.4.2 The substrate preparation and environmental exposu
7、reof the spot of adhesive after cure or setting can be varied asdesired.4.3 The determination of whether an adhesive bonds to thesubstrate is made by simply trying to pry the spot of adhesivefrom the substrate.4.4 The mode of failure is readily evident by examiningwhether the bond separated adhesive
8、ly or cohesively, either inthe adhesive or substrate.5. Significance and Use5.1 This is a quick, simple, and inexpensive test method forqualitatively determining, without the need to prepare bondedtest specimens, whether the adhesive under consideration willbond to a particular substrate. If the res
9、ults are acceptable, thenstandard quantitative adhesive test procedures can be used toobtain quantitative measurements of the adhesives perfor-mance.5.2 This test method can also be used to compare relativeadhesion of several adhesives to given substrates.5.3 It can be used to determine whether an a
10、dhesive willcontinue to adhere to the substrate under specified environmen-tal conditions.5.4 It can be used to evaluate adhesion of a particularadhesive to a variety of substrates.5.5 It can be used to obtain “subjective” comparative databetween several adhesives on a given substrate by noting ther
11、elative ease of inducing failure between the adhesives tested.5.6 It should be most applicable to adhesives that cure or setwhen exposed to “air” (ambient, heated, etc.) and could beused for anaerobic adhesives if testing is carried out in anoxygen-free atmosphere.6. Apparatus6.1 No special equipmen
12、t is needed for application of theadhesive to the test substrate(s). When using hot-meltadhesives, for example, it would be desirable to have ahand-gun applicator or equivalent apparatus to allow deposi-tion of the hot-melt at a recommended application temperature.The use of such equipment is not ma
13、ndatory as a hot plate can1This test method is under the jurisdiction of ASTM Committee D14 onAdhesives and is the direct responsibility of Subcommittee D14.40 on Adhesives forPlastics.Current edition approved July 1, 2013. Published July 2013. Originally approvedin 1979. Last previous edition appro
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