ASTM D3808-2001(2007) Standard Test Method for Qualitative Determination of Adhesion of Adhesives to Substrates by Spot Adhesion《用点粘试验法定性测定胶粘剂与基底间粘性的标准试验方法》.pdf
《ASTM D3808-2001(2007) Standard Test Method for Qualitative Determination of Adhesion of Adhesives to Substrates by Spot Adhesion《用点粘试验法定性测定胶粘剂与基底间粘性的标准试验方法》.pdf》由会员分享,可在线阅读,更多相关《ASTM D3808-2001(2007) Standard Test Method for Qualitative Determination of Adhesion of Adhesives to Substrates by Spot Adhesion《用点粘试验法定性测定胶粘剂与基底间粘性的标准试验方法》.pdf(2页珍藏版)》请在麦多课文档分享上搜索。
1、Designation: D 3808 01 (Reapproved 2007)Standard Test Method forQualitative Determination of Adhesion of Adhesives toSubstrates by Spot Adhesion1This standard is issued under the fixed designation D 3808; the number immediately following the designation indicates the year oforiginal adoption or, in
2、the case of revision, the year of last revision. A number in parentheses indicates the year of last reapproval. Asuperscript epsilon (e) indicates an editorial change since the last revision or reapproval.1. Scope1.1 This test method covers a simple qualitative procedurefor quickly screening whether
3、 an adhesive will, under recom-mended application conditions, bond to a given substratewithout actually making bonded assemblies.1.2 The values stated in SI units are to be regarded as thestandard. The values in parentheses are for information only.1.3 This standard does not purport to address all o
4、f thesafety concerns, if any, associated with its use. It is theresponsibility of the user of this standard to establish appro-priate safety and health practices and determine the applica-bility of regulatory limitations prior to use.2. Referenced Documents2.1 ASTM Standards:2D 907 Terminology of Ad
5、hesivesE 171 Specification for Atmospheres for Conditioning andTesting Flexible Barrier Materials3. Terminology3.1 DefinitionsMany of the terms used in this test methodare defined in Terminology D 907.3.1.1 spot adhesion, na qualitative method of determiningadhesion by attempting to pry a “spot” of
6、cured adhesive froma substrate.4. Summary of Test Method4.1 Spots of adhesive (size can vary, but generally about 6mm (14 in.) in diameter) are placed onto a substrate using theapplication procedure and curing conditions acceptable to bothuser and supplier of the adhesive.4.2 The substrate preparati
7、on and environmental exposureof the spot of adhesive after cure or setting can be varied asdesired.4.3 The determination of whether an adhesive bonds to thesubstrate is made by simply trying to pry the spot of adhesivefrom the substrate.4.4 The mode of failure is readily evident by examiningwhether
8、the bond separated adhesively or cohesively, either inthe adhesive or substrate.5. Significance and Use5.1 This is a quick, simple, and inexpensive test method forqualitatively determining, without the need to prepare bondedtest specimens, whether the adhesive under consideration willbond to a parti
9、cular substrate. If the results are acceptable, thenstandard quantitative adhesive test procedures can be used toobtain quantitative measurements of the adhesives perfor-mance.5.2 This test method can also be used to compare relativeadhesion of several adhesives to given substrates.5.3 It can be use
10、d to determine whether an adhesive willcontinue to adhere to the substrate under specified environmen-tal conditions.5.4 It can be used to evaluate adhesion of a particularadhesive to a variety of substrates.5.5 It can be used to obtain “subjective” comparative databetween several adhesives on a giv
11、en substrate by noting therelative ease of inducing failure between the adhesives tested.5.6 It should be most applicable to adhesives that cure or setwhen exposed to “air” (ambient, heated, etc.) and could beused for anaerobic adhesives if testing is carried out in anoxygen-free atmosphere.6. Appar
12、atus6.1 No special equipment is needed for application of theadhesive to the test substrate(s). When using hot-melt adhe-sives, for example, it would be desirable to have a hand-gunapplicator or equivalent apparatus to allow deposition of thehot-melt at a recommended application temperature. The use
13、 ofsuch equipment is not mandatory as a hot plate can be used tomelt a quantity of the hot melt to the application temperature ina deformable container such as an aluminum weighing dish.Upon reaching proper temperature, the hot melt can be pouredonto the substrate after forming a pouring spout in th
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