SAE AMS-P-81728B-2015 Plating Tin-Lead (Electrodeposited).pdf

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1、_ SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising there

2、from, is the sole responsibility of the user.” SAE reviews each technical report at least every five years at which time it may be revised, reaffirmed, stabilized, or cancelled. SAE invites your written comments and suggestions. Copyright 2015 SAE International All rights reserved. No part of this p

3、ublication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of SAE. TO PLACE A DOCUMENT ORDER: Tel: 877-606-7323 (inside USA and Canada) Tel: +1 724-776-497

4、0 (outside USA) Fax: 724-776-0790 Email: CustomerServicesae.org SAE WEB ADDRESS: http:/www.sae.org SAE values your input. To provide feedback on this Technical Report, please visit http:/www.sae.org/technical/standards/AMSP81728B AEROSPACE MATERIAL SPECIFICATION AMS-P-81728 REV. B Issued 1998-06 Rea

5、ffirmed 2005-10 Revised 2015-12 Superseding AMS-P-81728A Plating, Tin-Lead (Electrodeposited) RATIONALE AMS-P-81728B was issued to correct an error by adding Table 3 that was inadvertently deleted in revision A. NOTICE The initial SAE publication of this document was taken directly from U.S. Militar

6、y Standard MIL-P-81728A, Amendment 1. This SAE Standard may retain the same part numbers established by the original military document. Any requirements associated with Qualified Products Lists (QPL) may continue to be mandatory for DoD contracts. Requirements relating to QPLs have not been adopted

7、by the SAE for this standard and are not part of this SAE document. 1. SCOPE 1.1 Scope This specification covers the requirements for electrodeposited tin-lead plating intended for use as a coating for corrosion protection and as a base for soldering. 2. APPLICABLE DOCUMENTS The issue of the followi

8、ng documents in effect on the date of the purchase order forms a part of this specification to the extent specified herein. The supplier may work to a subsequent revision of a document unless a specific document issue is specified. When the referenced document has been cancelled and no superseding d

9、ocument has been specified, the last published issue of that document shall apply. 2.1 SAE Publications Available from SAE International, 400 Commonwealth Drive, Warrendale, PA 15096-0001, Tel: 877-606-7323 (inside USA and Canada) or +1 724-776-4970 (outside USA), www.sae.org. AMS-QQ-N-290 Nickel Pl

10、ating (Electrodeposited) AMS2418 Plating, Copper AS2390 Chemical Process Test Specimen Material SAE INTERNATIONAL AMS-P-81728B Page 2 of 12 2.2 ANSI Publications Available from American National Standards Institute, 25 West 43rd Street, 4th Floor, New York, NY 10036, Tel: 212-642-4900, www.ansi.org.

11、 ANSI / ASQC Z1.4 Sampling Procedures and Tables for Inspection by Attributes 2.3 ASTM Publications Available from ASTM International, 100 Barr Harbor Drive, P.O. Box C700, West Conshohocken, PA 19428-2959, Tel: 610-832-9585, www.astm.org. ASTM A309 Weight and Composition of Coating on Terne Sheet b

12、y the Triple-Spot Method ASTM A630 Determination of Tin Coating Weights for Electrolytic Tin Plate ASTM B487 Measurement of Metal and Oxide Coating Thickness by Microscopic Examination of a Cross Section ASTM B499 Measurement of Coating Thicknesses by the Magnetic Method: Nonmagnetic Coatings on Mag

13、netic Basis Metal ASTM B504 Measurement of Thickness of Metallic Coatings by the Coulometric Method ASTM B567 Measurement of Coating Thickness by the Beta-Backscatter Method ASTM B568 Measurement of Coating Thickness by X-Ray Spectrometry ASTM F519 Mechanical Hydrogen Embrittlement Evaluation of Pla

14、ting/Coating Processes and Service Environments 2.4 U.S. Government Publications Copies of these documents are available online at http:/quicksearch.dla.mil. MIL-S-5002 Surface Treatments and Inorganic Coatings for Metal Surfaces of Weapons Systems MIL-STD-202 Test Methods for Electronic and Electri

15、c Component Parts 2.5 AIA Publications Available from Aerospace Industries Association, 1000 Wilson Boulevard, Suite 1700, Arlington, VA 22209-3928, Tel: 703-358-1000, www.aia-aerospace.org. NASM 1312-12 Thickness of Metallic Coatings 2.6 IPC-Association Connecting Electronics Industries Publication

16、s Available from IPC, 3000 Lakeside Drive, 309 S, Bannockburn, IL 60015, Tel: 847-615-7100, www.ipc.org. J-STD-004 Requirements for Soldering Fluxes J-STD-005 Requirements for Soldering Pastes J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Elect

17、ronic Soldering Applications SAE INTERNATIONAL AMS-P-81728B Page 3 of 12 3. REQUIREMENTS 3.1 Materials The materials used shall be such as to produce electrodeposited tin-lead coatings that meet the requirements of this specification. 3.1.1 Composition Unless otherwise specified, the coating composi

18、tion shall be as specified in Table 1. See 6.2 and 6.3. Table 1 - Coating composition Element Percent by Weight Tin (Sn) 50 to 70 Other metals and non-metallics 1.0 Maximum Lead (Pb) Remainder 3.2 General Requirements 3.2.1 High Tensile Strength Steel Parts Unless otherwise specified, steel parts ha

19、ving an ultimate tensile strength greater than 240000 pounds per square inch (psi) shall not be plated without specific approval of the procuring activity (see 6.2). 3.2.2 Stress Relief Treatment All steel parts having an ultimate tensile strength of 150000 pounds per square inch (psi) and above, th

20、at are machined, ground, cold formed or cold straightened, shall be given a heat treatment at a minimum of 375 F 25 F (191 C 14 C) for 3 hours or more prior to cleaning and plating for the relief of damaging residual tensile stresses. 3.2.3 Cleaning All steel parts shall be cleaned in accordance wit

21、h MIL-S-5002. Other basis metals shall be cleaned by methods that shall not damage the substrate and shall not interfere with adhesion of the deposit (see 6.6). 3.2.4 Plating Application Unless otherwise specified, the plating shall be applied after all basis metal heat treatments and mechanical ope

22、rations such as machining, brazing, welding, forming and perforating of the article have been completed (see 6.2). 3.2.5 Underplating Unless otherwise specified (6.2), tin-lead shall be deposited directly on the basis metal without a preliminary plating of other metal. When the basis metal is a copp

23、er alloy containing more than 15% by weight of zinc (such as Copper Alloy Numbers 268, 270, 752, etc.) or a beryllium copper alloy (such as Copper Alloy Numbers 170, 172, etc.) either a copper underplating, in accordance with AMS2418, or a nickel underplating, in accordance with AMS-QQ-N-290, shall

24、be applied to the basis metal in a thickness of 0.0001 inch (2.5 m) prior to the tin-lead plating. Nickel underplating shall not be deposited on a copper alloy part that will be flexed or bent during manufacture or use. 3.2.6 Coverage Unless otherwise specified, the plating shall cover all surfaces

25、including roots of threads, corners and recesses (see 6.2). SAE INTERNATIONAL AMS-P-81728B Page 4 of 12 3.2.7 Embrittlement Relief The plating process after baking shall not cause embrittlement in steel parts having a hardness of 40 HRC and over, determined in accordance with 4.5.6. All steel parts

26、having a hardness of 40 HRC and higher shall be baked at 340 F 10 F (171 C 6 C) for 23 hours or more, within 4 hours after plating, to provide hydrogen embrittlement relief. The baked parts, when tested in accordance with 4.5.6, shall not crack or fail by fracture (see 4.4.3.6). Plated springs and o

27、ther parts subject to flexure shall not be flexed prior to the hydrogen embrittlement relief treatment. 3.2.8 Luster Unless otherwise specified, either a matte or bright luster shall be acceptable (see 6.2). For printed circuitry parts and electronic components, only parts with a matte or a flow bri

28、ghtened (matte reflowed) finish shall be furnished. Such flow brightened parts shall have a maximum thickness of about 0.0003 inch (8 m) as thicker platings on flat surfaces tend to reflow more uneven (see 6.4). Flow-brightened (matte reflowed) finish is preferred so as to preclude any undesirable c

29、oating characteristics such as bubbles, voids and roughness. 3.3 Detail Requirements 3.3.1 Thickness of Plating Unless otherwise specified, the thickness of the tin-lead plating, except when applied to electronic components (3.3.1.1), shall be not less than 0.0003 inch (8 m) and shall not be greater

30、 than 0.0005 inch (13 m) on all visible surfaces that can be touched by a ball 0.75 inch in diameter. All other visible surfaces shall be not less than 0.0002 inch (5 m) minimum thickness. Unless otherwise specified, holes and other openings and internal threads from which the external environment i

31、s completely excluded and where a controlled deposit cannot be normally obtained, shall not be subject to a thickness requirement. 3.3.1.1 Electronic Components Unless otherwise specified, the thickness of tin-lead plating for electronic components (printed circuit boards, especially those plated-th

32、rough-hole interconnections, terminals and eyelets) shall be a minimum average of 0.0003 inch (8 m) thickness when measured at four points at least 0.10 inch apart. Walls of holes such as plated-through-holes in circuit boards shall have a plating with a minimum average of 0.0003 inch (8 m) thicknes

33、s. No single measurement shall be less than 0.0002 inch (5 m) minimum thickness. 3.3.1.2 Underplating The thickness of any underplate (3.2.5) shall not be used in the determination of the tin-lead plating thickness as specified herein. 3.3.2 Adhesion 3.3.2.1 Shear or Bend The adhesion of the plating

34、 shall be such that when examined at a magnification of approximately 4 diameters, the plating shall not show separation from the basis metal or from any underplate at the interface, nor shall any underplate show separation from the basis metal at the interface, when subjected to the shear or bend t

35、est described in 4.5.3.1. The interface between the tin-lead and either the basis metal or the underplate is the surface before plating. The interface between the underplate and the basis metal is the surface before underplating. The formation of cracks in the plate caused by rupture of the basis me

36、tal, the underplate or combination of both which does not result in flaking, peeling or blistering of the plate shall not be considered as nonconformance to this requirement. 3.3.2.2 Quench The adhesion of the plating shall be such that when examined at magnification of approximately 4 diameters, th

37、e plating shall show no evidence of flaking, peeling or blistering and shall be free from bubbles, cracks and other defects when subjected to the quench test described in 4.5.3.2. SAE INTERNATIONAL AMS-P-81728B Page 5 of 12 3.3.2.3 Reflow The adhesion of the plating shall be such that when examined

38、at a magnification of approximately 4 diameters, the plating shall show no evidence of bubbling, foaming, blistering, flaking, peeling, or uneven flow resulting in voids and roughness when subjected to the reflow test described in 4.5.3.3. 3.3.3 Porosity Tin-lead plating on ferrous metals shall show

39、 no basis metal corrosion products when tested for porosity in accordance with 4.5.4. The appearance of corrosion products, visible to the unaided eye at normal reading distance shall be cause for rejection. 3.3.4 Solderability Plated specimens or parts shall be easily and completely coated with sol

40、der when tested as specified in 4.5.5. The solder shall be deposited uniformly without lumps or peaks and shall be essentially free from evidence of bubbling, foaming, voids and other defects. The solder shall firmly adhere to the plating and the plating shall be firmly adherent to the basis metal o

41、r to any underplate. There shall be no separation at the solder-plating interface, the plating-basis metal interface, the plating-underplate interface, or at the undercoat-basis metal interface, so that they cannot be lifted when a sharp-edge instrument is applied. 3.4 Workmanship 3.4.1 Basis Metal

42、The basis metal shall be free from visible defects that will be detrimental to the appearance or protective value of the plating. The basis metal shall be subjected to such cleaning and plating procedures as necessary to yield deposits as herein specified. 3.4.2 Plating The tin-lead plating shall be

43、 smooth, fine grained, adherent, continuous, free from visible blisters, pits, nodules, indications of burning, excessive build-up, staining and other defects. The size and number of contact marks shall be at a minimum consistent with good practice. The location of contact marks shall be in areas of

44、 minimum exposure to service environmental conditions where important to the function of the part. Superficial staining that has been demonstrated as resulting from rinsing, or slight discoloration resulting from baking operations to relieve embrittlement, as specified above (3.2.7), shall not be ca

45、use for rejection. Flow brightened or reflowed matte plating shall be free from any material used as the heating media for the treatment and such plating shall be free from untreated areas. All details of workmanship shall conform to the best practice for high quality plating. 4. QUALITY ASSURANCE P

46、ROVISIONS 4.1 Responsibility for Inspection Unless otherwise specified in the contract or purchase order, the supplier is responsible for the performance of all inspection requirements as specified herein. Except as otherwise specified in the contract or order, the supplier may use his own or any ot

47、her facilities suitable for the performance of the inspection requirements specified herein, unless disapproved by the Government. The Government reserves the right to perform any of the inspections set forth in the specification where such inspections are deemed necessary to assure that supplies an

48、d services conform to prescribed requirements. 4.2 Classification of Inspection The inspection requirements specified herein are classified as follows: 1 - Production control inspection (see 4.3). 2 - Quality conformance inspection (see 4.4). SAE INTERNATIONAL AMS-P-81728B Page 6 of 12 4.3 Productio

49、n Control Inspection 4.3.1 Control Records When specified in the contract or order (6.2), the supplier shall maintain a record of each processing bath, showing all additional chemicals or treatment solutions to the unit, the results of all analyses performed and the quantity of parts plated during operation. Upon request of the procuring activity, such records shall be made available. These records shall be mainta