EN 16603-50-14-2014 en Space engineering - Spacecraft discrete interfaces《航天工程 航天器分散接口》.pdf
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1、BSI Standards PublicationBS EN 16603-50-14:2014Space engineering Spacecraft discrete interfacesBS EN 16603-50-14:2014 BRITISH STANDARDNational forewordThis British Standard is the UK implementation ofEN 16603-50-14:2014.The UK participation in its preparation was entrusted to Technical Committee ACE
2、/68, Space systems and operations.A list of organizations represented on this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. The British Standards Instit
3、ution 2014.Published by BSI Standards Limited 2014ISBN 978 0 580 84191 0 ICS 49.140 Compliance with a British Standard cannot confer immunity from legal obligations.This British Standard was published under the authority of the Standards Policy and Strategy Committee on 30 September 2014.Amendments/
4、corrigenda issued since publicationDate T e x t a f f e c t e dEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 16603-50-14 September 2014 ICS 49.140 English version Space engineering - Spacecraft discrete interfaces Ingnierie spatiale - Interfaces lectriques discrtes pour satellites Raumfahrtte
5、chnik - Diskrete Schnittstellen in Raumfahrzeugen This European Standard was approved by CEN on 1 March 2014. CEN and CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard witho
6、ut any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the CEN-CENELEC Management Centre or to any CEN and CENELEC member. This European Standard exists in three official versions (English, French, German). A version in
7、 any other language made by translation under the responsibility of a CEN and CENELEC member into its own language and notified to the CEN-CENELEC Management Centre has the same status as the official versions. CEN and CENELEC members are the national standards bodies and national electrotechnical c
8、ommittees of Austria, Belgium, Bulgaria, Croatia, Cyprus, Czech Republic, Denmark, Estonia, Finland, Former Yugoslav Republic of Macedonia, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slove
9、nia, Spain, Sweden, Switzerland, Turkey and United Kingdom. CEN-CENELEC Management Centre: Avenue Marnix 17, B-1000 Brussels 2014 CEN/CENELEC All rights of exploitation in any form and by any means reserved worldwide for CEN national Members and for CENELEC Members. Ref. No. EN 16603-50-14:2014 EBS
10、EN 16603-50-14:2014Table of contents Foreword 6 1 Scope . 7 2 Normative references . 8 3 Terms, definitions and abbreviated terms 9 3.1 Terms from other standards 9 3.2 Terms specific to the present standard . 9 3.3 Abbreviated terms. 10 3.4 Conventions 11 3.4.1 Bit numbering convention 11 3.4.2 Tim
11、ing diagram conventions . 11 3.4.3 Signal and signal event naming convention 12 3.4.4 Signal timing and measurement references 13 4 General 14 4.1 Introduction . 14 4.2 Architectural concepts 14 4.2.1 Overview . 14 4.2.2 General failure tolerance . 15 4.2.3 Interface control during power cycling . 1
12、6 4.2.4 Cross-strapping . 17 4.2.5 Harness cross-strapping . 18 4.2.6 Cable capacitance. 21 5 Analogue signal interfaces 22 5.1 Overview 22 5.2 Analogue signal monitor (ASM) interface 22 5.2.1 General . 22 5.2.2 Analogue signal monitor interface . 24 5.3 Temperature sensors monitor (TSM) interface 2
13、6 5.3.1 Overview . 26 5.3.2 TSM acquisition layout 27 5.3.3 TSM acquisition resolution 27 5.3.4 TSM wire configuration . 27 EN 16603-50-14:2014BS EN 16603-50-14:20145.3.5 TSM electrical characteristics 28 6 Bi-level discrete input interfaces 36 6.1 Bi-level discrete monitor (BDM) interface 36 6.1.1
14、Overview . 36 6.1.2 Bi-level discrete monitor interface . 36 6.2 Bi-level switch monitor (BSM) interface . 38 6.2.1 General principles . 38 6.2.2 Bi-level switch monitor interface 39 7 Pulsed command interfaces 41 7.1 High power command (HPC) interfaces 41 7.1.1 General principles . 41 7.1.2 High po
15、wer command interface . 41 7.1.3 Low voltage high power command (LV-HPC) electrical characteristics . 42 7.1.4 High voltage high power command (HV-HPC) electrical characteristics . 44 7.1.5 High current high power command (HC-HPC) electrical characteristics . 45 7.1.6 Wiring type 46 7.1.7 High power
16、 command interface arrangement 46 7.2 Low power command (LPC) interface . 47 7.2.1 General . 47 7.2.2 Low power command interface . 47 7.2.3 LPC electrical characteristics 48 7.2.4 Wiring type 49 7.2.5 Interface arrangement . 49 8 Serial digital interfaces 50 8.1 Foreword 50 8.2 General principles o
17、f serial digital interfaces . 50 8.2.1 Overview . 50 8.2.2 General requirements . 51 8.3 16-bit input serial digital (ISD) interface 52 8.3.1 16-bit input serial digital interface description 52 8.3.2 Signals skew . 52 8.3.3 ISD interface timing specification 52 8.3.4 16-bit input serial digital int
18、erface: signal description . 55 8.4 16-bit output serial digital (OSD) interface description 57 8.4.1 16-bit output serial digital interface description 57 EN 16603-50-14:2014BS EN 16603-50-14:20148.4.2 Signals skew . 57 8.4.3 OSD interface timing specification . 58 8.4.4 16-bit output serial digita
19、l interface signal description 59 8.5 16-bit bi-directional serial digital (BSD) interface description . 61 8.6 Serial digital interface electrical circuits description . 62 8.7 Balanced differential serial digital interface signals . 63 8.7.1 Balanced differential serial digital interface - GATE_WR
20、ITE circuits . 63 8.7.2 Balanced differential serial digital interface - DATA_CLK_OUT circuits . 63 8.7.3 Balanced differential serial digital interface - DATA_OUT circuits 63 8.7.4 Balanced differential serial digital interface - DATA_IN circuits . 64 8.7.5 Balanced differential serial digital inte
21、rface - GATE_READ circuits . 64 8.8 Serial digital interface circuit electrical characteristics . 64 8.8.1 Introduction . 64 8.8.2 Provisions . 64 Annex A (informative) Tailoring guidelines . 68 Bibliography . 69 Figures Figure 3-1: Bit numbering convention . 11 Figure 3-2: Timing diagram convention
22、s . 12 Figure 3-3: Signal timing and measurement references 13 Figure 4-1: Architectural context of interfaces defined in this standard . 15 Figure 4-2: General scheme of redundant units cross-strapping 17 Figure 4-3: Example scheme for Single source Dual receiver cross-strapping 19 Figure 4-4: Exam
23、ple scheme for Dual source Single receiver cross-strapping 20 Figure 4-5: Cable capacitance definitions . 21 Figure 5-1: Analogue signal monitor (single ended source) interface arrangement 26 Figure 5-2: Analogue signal monitor (differential source) interface arrangement . 26 Figure 5-3: TSM1 refere
24、nce model . 29 Figure 5-4: Requirement for Rth/Rthas a function of RNORMand Rth. x = 0,01 . 29 Figure 5-5: TSM1 interface arrangement 31 Figure 5-6: TSM2 interface arrangement 33 Figure 5-7: Example TSM1 and 4K3A354 thermistor 34 Figure 5-8: Example TSM1 and YSI44907 thermistor . 34 Figure 5-9: Exam
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