ECA 213-1958 Test Point Locations for Printed Wiring Assemblies《印制电路组件的测试点定位》.pdf

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1、a Cu) iu 8 H Test Y Printed a u _ EIA 233 58 m 3234600 O063273 5 m r ElA STANDARD Point Locatism for RS-213 Wihg A8sembZe.a (Reaffirmed March 1972) September 1958 Engneerng Department ELECTRON IC INDUSTRIES ASSOCIATION NOTICE EIA engineering standards are designed to serve the public interest throug

2、h eliminating mis- understandings between manufacturers and purchasers, facilitating interchangeability and improve- ment of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such standards shall not in any re

3、spect pre- clude any member or non-member of EIA from manufacturing or selling products not conforming to such standards, nor shall the existence of such standards preclude their voluntary use by those other than EIA members whether the standard is to be used either domestically or internationally.

4、Recommended standards are adopted by EIA without regard to whether or not their adoption may involve patents on articles, materials, or processes. By such action, EIA does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the recommended sta

5、ndards. Published by ELECTRON IC I N DUSTRI ES ASSOCIATI ON Engineering Department 2001 Eye Street, N.W., Washington, D. C. 20006 0 Electronic Industries Association 1966 Ali rights reserved Price $1.00 - I ?- Ir EIA 213 58 9 3234600 00b3273 i 9 RS-213 Page 1 TEST POINT LOCATIONS FOR PRINTED WIRING

6、ASSEMBLIES e (From Standards Proposal No. 5 70 Formulated under the Cognizance of EIA Working Group P- 7.6 on Printed Wiring Boards) 1. INTRODUCTION This standard establishes systems of preferred locations for test points on printed wiring assemblies. It is to serve as a guide in the coordination of

7、 equipment design and is to be used in the design of printed wiring boards, test connectors, and testing equipment. 2. SCOPE 2.1 All test points shall be compatible in ali respects with the latest issue of EIA Standard RS-188, Standard Dimensional System for Automation Requirements. 2.2 All test poi

8、nts shall be brought out to any three edges of the printed wiring board whenever possible. 2.3 There are two preferred test-point location systems, A and B. A third system, C, can be used when it is impractical to bring the test points to the edge of the board. 3. TEST-POINT SYSTEM A 3.1 For test-po

9、int system A, the preferred multiple of the basic 0.025” (.635 mm) module shall be 8. This spacing of 0.200” (5.08 mm) shall be used to form a coordinated grid of lines separated by 0.200” (5.08 mm). 3.2 Test points shall be located on, or near, any three edges of the printed wiring board and fall o

10、n the intersections of the lines of the 0.200” (5.08 mm) grid. 3.3 If the O. 100” (2.54 mm) grid system of EL4 Standard RS-188 is used for locating mounting holes for components, the lines of the 0.200” (5.08 mm) test point grid will coincide with alternate lines of this 0.100 (2.54 mm) grid. If the

11、 0.025” (2.54 mm) grid system of RS-188 is used for locating mounting holes for components, the lines of the 0.200” (5.08 mm) test point grid will coincide with every eighth line of this 0.025” (.635 mm) grid. I 4. TEST-POINT SYSTEM B 4.1 For test point system B, the preferred multiple of the basic

12、0.025” (.635 mm) module shall be 4. This spacing of 0.100 (2.54 mm) shall be used to form a coordinated grid of lines separated by O. 100” (2.54 mm). , os I EIA 213 58 m 3234b00 00b3274 O m RS-213 Page 2 o 4.2 Test points shall be located on or near any three edges of the printed wiring board and fa

13、ll on the intersections of the lines of the 0.100 (2.54 mm) grid. 4.3 If the O. 100” (2.54 mm) grid system of EIA Standard RS-188 is used for locating mounting holes for components, the lines of the test point grid will coincide with the lines of this 0.100 (2.54 mm) component mounting hole grid. If

14、 the 0.025” (.635 mm) grid system of RS-188 is used for locating mounting holes for components, the lines of the 0.100 (2.54 mm) test point grid will coincide with every fourth line of this 0.025” (.635 mm) grid. 5. TEST POINT SYSTEM C 5.1 When it is impractical to bring test points to the edges of

15、the printed wiring bohey shall be located on the intersections of the lines of a 0.100 (2.54 mm) grid system anywhere on the board. 5.2 If the 0.100 (2.54 mm) grid system of EIA Standard RS-188 is used for locating mounting holes for components, the lines of the test point grid system will coincide with the lines of this 0.100 (2.54 mm) component mounting hole grid. If the 0.025” (-635 mm) grid system of RS-188 is used for locating mounting holes for components, the lines of the 0.100 (2.54 mm) test point grid will coincide with every fourth line of this 0.025” (.635 mm) grid.