DLA SMD-5962-97536-1997 MICROCIRCUIT DIGITAL MULTICHIP MICROCIRCUIT MICROPROCESSOR WITH STATIC RAM SILICON《多片状微电路静态随机存储器微处理器硅单片电路数字微电路》.pdf

《DLA SMD-5962-97536-1997 MICROCIRCUIT DIGITAL MULTICHIP MICROCIRCUIT MICROPROCESSOR WITH STATIC RAM SILICON《多片状微电路静态随机存储器微处理器硅单片电路数字微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-97536-1997 MICROCIRCUIT DIGITAL MULTICHIP MICROCIRCUIT MICROPROCESSOR WITH STATIC RAM SILICON《多片状微电路静态随机存储器微处理器硅单片电路数字微电路》.pdf（24页珍藏版）》请在麦多课文档分享上搜索。

1、REVISIONSLTR DESCRIPTION DATE (YR-MO-DA) APPROVEDREV SHEETREVSHEET 15 16 17 18 19 20 21 22 23REV STATUSOF SHEETSREVSHEET 123456789101121314PMIC N/APREPARED BY Thomas M. Hess DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 STANDARDMICROCIRCUITDRAWINGTHIS DRAWING IS AVAILABLEFOR USE BY ALLDEPARTME

2、NTSAND AGENCIES OF THEDEPARTMENT OF DEFENSEAMSC N/A CHECKED BYThomas M. HessMICROCIRCUIT, DIGITAL, MULTICHIP MICROCIRCUIT, MICROPROCESSOR WITH STATIC RAM, SILICONAPPROVED BYThomas M. HessDRAWING APPROVAL DATE97-05-21SIZEACAGE CODE672685962-97536REVISION LEVELSHEET 1 OF 23DESC FORM 193JUL 94 5962-E18

3、8 -97DISTRIBUTION STATEMENT A . Approved for public release; distribution is unlimitedProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216SIZEA5962-97536REVISION LEVEL SHEET2DE

4、SC FORM 193AJUL 941. SCOPE1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part orIdentifying Number (

5、PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.1.2 PIN. The PIN is as shown in the following example:5962 - 97536 01 Q X X G0DG0D G0D G0D G0D G0DG0DG0D G0D G0D G0D G0DG0D G0D G0D G0D G0D G0D Federal RHA Device Device Case Lead stock class designa

6、tor type class outline finishdesignator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) / (see 1.2.3)/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and aremarked with the appropriate RHA designator. Device class

7、 M RHA marked devices meet the MIL-PRF-38535, appendix Aspecified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.1.2.2 Device type(s). The device type(s) identify the circuit function as follows:Device type Generic number Memory Operating frequen

8、cy Circuit function01 320MCM41 128K 40 MHz Digital signal processormultichip module02 320MCM41 128K 50 MHz Digital signal processormultichip module1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level asfollows:Device class Device requi

9、rements documentationM Vendor self-certification to the requirements for MIL-STD-883 compliant,non-JAN class level B microcircuits in accordance with MIL-PRF-38535,appendix AQ or V Certification and qualification to MIL-PRF-385351.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD

10、-1835 and as follows:Outline letter Descriptive designator Terminals Package styleX see figure 1 352 Ceramic Quad Flat Pack1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/S

11、upply voltage range (V ) -0.3 V dc to + 7.0 V dc 2/CCVoltage range on any pin (V ) -0.3 V dc to + 7.0 V dcINOutput voltage range (V ) . -0.3 V dc to + 7.0 V dcOUTStorage temperature range (T ) -65(C to + 150(CSTGMaximum allowed junction temperature (T) . 150 CJMaximum solder temperature (10s duratio

12、n). 260 CPower dissipation (P) .5.2 WDThermal impedance, Junction-to-case ( ). 1.3 C/WJCProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216SIZEA5962-97536REVISION LEVEL SHEET3

13、DESC FORM 193AJUL 941.4 Recommended operating conditions. 2/Supply voltage range (V ) +4.75 V V +5.25 VCC CCHigh level input voltage range (V ) 3/IHCLKIN, COMM . +2.6 V V V + 0.3 VIH CCC S T R B x, C R D Y x, C R E Q x, C A C K x . +2.2 V V V + 0.3 VIH CCAll other pins. +2.0 V V V + 0.3 VIH CCLow le

14、vel input voltage range (V) -0.3 V 0.8 V 3/IL IL High level output current (I ) -300 AOHLow level output current (I ) 2 mAOLCase operating temperature range (T) -55(C to 125(C CMaximum operating free-air temperature (T) +125 CA1.5 Digital logic testing for device classes Q and V. Fault coverage meas

15、urement of manufacturinglogic tests (MIL-STD-883, test method 5012) XX percent 4/2. APPLICABLE DOCUMENTS2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a partof this drawing to the extent specified herein. Unless otherwise specified,

16、 the issues of these documents are those listed in theissue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in thesolicitation.SPECIFICATIONMILITARYMIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.MIL-PRF-38534 -

17、Hybrid Microcircuits, General Specification for.STANDARDSMILITARYMIL-STD-883 - Test Methods and Procedures for Microelectronics.MIL-STD-973 - Configuration Management.MIL-STD-1835 - Microcircuit Case Outlines.HANDBOOKSMILITARYMIL-HDBK-103 - List of Standard Microcircuit Drawings (SMDs).MIL-HDBK-780

18、- Standard Microcircuit Drawings.(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the StandardizationDocument Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)1/ Stresses above the absolute maximum rating may cause permane

19、nt damage to the device. Extended operation at themaximum levels may degrade performance and affect reliability.2/ All voltage values are with respect to V .SS3/ Maximum V levels and minimum V levels are characterized but not tested.IH IL4/ Values will be added when they become available.Provided by

20、 IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216SIZEA5962-97536REVISION LEVEL SHEET4DESC FORM 193AJUL 942.2 Order of precedence. In the event of a conflict between the text of this dr

21、awing and the references cited herein, the text ofthis drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless aspecific exemption has been obtained.3. REQUIREMENTS3.1 Item requirements. The individual item requirements for device classes Q and

22、V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. Theelement evaluation for passive components shall be in accordance with MIL-PRF-38534 and as specified herein. Themodification in the QM plan shall not affect

23、 the form, fit, or function as described herein. The individual item requirements fordevice class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specifiedherein.3.2 Design, construction, and physical dimensions. The design, construction, and physical

24、 dimensions shall be as specified inMIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein and Figure 1.3.2.2 Terminal connections. The terminal connections shall be

25、as specified on Figure 2.3.2.3 Block diagram. The block diagram shall be as specified on Figure 3.3.2.4 Boundry scan codes. The boundry scan codes shall be specified on Figure 4.3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as specified when available.3.3 Electrical perfo

26、rmance characteristics and postirradiation parameter limits. Unless otherwise specified herein, theelectrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the fullcase operating temperature range.3.4 Electrical test requirements. T

27、he electrical test requirements shall be the subgroups specified in table II. The electricaltests for each subgroup are defined in table I.3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also bemarked as listed in MIL-HDBK-103. For pack

28、ages where marking of the entire SMD PIN number is not feasible due to spacelimitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, theRHA designator shall still be marked. Marking for device classes Q and V shall be in accordance wit

29、h MIL-PRF-38535. Markingfor device class M shall be in accordance with MIL-PRF-38535, appendix A.3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required inMIL-PRF-38535. The compliance mark for device class M shall be a “C“ as requir

30、ed in MIL-PRF-38535, appendix A.3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate ofcompliance shall

31、 be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for thisdrawing shall affirm that the manufacturers product meets, for device

32、classes Q and V, the requirements of MIL-PRF-38535 andherein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, ap

33、pendix A shall be provided with each lot of microcircuits delivered tothis drawing.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216SIZEA5962-97536REVISION LEVEL SHEET5DESC

34、FORM 193AJUL 94TABLE I. Electrical performance characteristics.Test andMIL-STD-883test method Symbol Test conditions-55(C T +125(CC+4.75 V V +5.25 VCCunless otherwise specifiedDevicetypesGroup AsubgroupsLimits UnitMin MaxDC ElectricalsHigh-level outputvoltage 1/ VOHV = MIN, I = MAXCC OHAll 1,2,3 2.4

35、 VLow-level outputvoltage 1/ VOLV = MIN, I = MAXCC OLAll 1,2,3 0.6 VThree-state current1/2/IZV = V to VI SS CCAll 1,2,3 -20 20 AInput current 1/IIV = V to VI SS CCAll 1,2,3 -10 10 AInput current,internal pullup 1/2/ 3/IIPUV = V to VI SS CCAll 1,2,3 -400 30 AInput current, internal pulldown 1/2/ 3/ 4

36、/IIPDV = V to VI SS CCAll 1,2,3 -20 400 AInput current,CLKIN 1/2/IICV = V to VI SS CCAll 1,2,3 -50 50 ASupply current 1/ICCV = MAXCCAll 1, 2, 3 0.6 AInput capacitance 5/CISee 4.5.1c All 4 40 pFOutput capacitance 5/COSee 4.5.1c All 4 40 pFFunctional testing See 4.5.1b All 7,8AC testing 6/ All 9,10,11

37、1/ These parameters are guaranteed but not tested. 2/ Electrical characteristics are calculated algebraically from SMD 5962-94669 limits.3/ Pins with internal pullup devices TDI, TDK, TMS.4/ Applies to signal T R S T.5/ This paramater is guaranteed by simulation and not tested.6/ Electrical paramete

38、rs for the microprocessor die shall be per SMD 5962-94669. Electrical parameters for the SRAM die shallbe per 5962-89598 with the following exceptions: I max = 40 mA, data retention test is not performed on the modulesCC2SRAMs. The placement of die into the module will not add more than 1 ns to the

39、propagations delay limits, this limit will begauranteed, but no tested.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216SIZEA5962-97536REVISION LEVEL SHEET6DESC FORM 193AJUL

40、 94FIGURE 1. Case outline.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216SIZEA5962-97536REVISION LEVEL SHEET7DESC FORM 193AJUL 94SymbolMillimeters InchesMin Max Min MaxA 4

41、.55 0.179A1 4.00 0.157A2 0.05 0.35 0.002 0.013b2 0.18 0.25 0.007 0.010c 0.10 0.20 0.004 0.008D1/E1 47.52 48.48 1.870 1.908D2/E2 43.50 BSC 1.712 BSCe 0.50 0.019G 1.45 1.55 0.057 0.061L 74.85 76.40 2.946 3.007L1 74.60 75.40 2.937 2.968L2 55.60 57.00 2.189 2.244Q1 70.00 2.755K 0.50 0.019J 0.75 1.05 0.0

42、29 0.041G 1.45 1.55 0.057 0.061P 2.50 2.60 0.098 0.102FIGURE 1. Case outline. - ContinuedProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216SIZEA5962-97536REVISION LEVEL SHEET

43、8DESC FORM 193AJUL 94Notes:1. Capacitors are physically located near the microprocessor die.2. Capacitors are physically located near the SRAM die.FIGURE 1. Case outline. - ContinuedProvided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT

44、 DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216SIZEA5962-97536REVISION LEVEL SHEET9DESC FORM 193AJUL 94Case XTerminal Terminal symbol Terminal Terminal symbol Terminal Terminal symbol123456789101112131415161718192021222324252627282930313233343536373839404142434445464748D31D30D29D28D27D26G

45、DDVDD 1/D25D24D23D22D21D20D19D18D17D16CVSS 2/CVSS 2/IVSS 2/GDDVDD 1/GDDVDD 1/DVSS 3/DVSS 3/D15D14D13D12D11D10D9D8D7D6D5GDDVDD 1/D4D3D2D1D0CE1RDY1DVSS 3/DVSS 3/CVSS2/CVSS2/LOCK4950515253545556575859606162636465666768697071727374757677787980 81828384858687888990919293949596VDDL 4/VSSL 5/CE0RDY0DETCKTD

46、OTDITMSTRSTEMU0EMU1DVSS 3/DVSS 3/DVDD1/PAGE1R/W1STRB1STAT0STAT1IVSS2/STAT2STAT3PAGE0R/W0STRB0AERESETLOC1DVDD 1/RESETLOC0RESETCRDY5CSTRB5CACK5CREQ5CRDY4CSTRB4CACK4CREQ4CVSS 2/DVSS 3/DVSS 3/DVDD 1/C5D7C5D6C5D5C5D4C5D39798991001011021031041051061071081091101111121131141151161171181191201211221231241251

47、26127128129130131132133134135136137138139140141142143144C5D2C5D1C5D0DVDD 1/C4D7C4D6C4D5C4D4C4D3C4D2C4D1C4D0CVSS 2/DVSS 3/DVSS 3/DVDD 1/C3D7C3D6C3D5C3D4C3D3C3D2C3D1C3D0DVDD 1/IVSS 2/IVSS 2/C2D7C2D6C2D5C2D4C2D3C2D2C2D1C2D0CVSS 2/DVSS 3/DVSS 3/DVDD 1/CRDY3CSTRB3CACK3CREQ3VDDL 4/VSSL 5/CRDY2CSTRB2CACK2F

48、IGURE 2. Terminal connections.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARDMICROCIRCUIT DRAWINGDEFENSE SUPPLY CENTER COLUMBUSCOLUMBUS, OHIO 43216SIZEA5962-97536REVISION LEVEL SHEET10DESC FORM 193AJUL 94Case XTerminal Terminal symbol Terminal Terminal symbol Terminal Terminal symbol1451461471481491501511521531541551561571581591601611621631641651661671681691701711721731741751761771781791801811821831841