DLA SMD-5962-95605-1995 MICROCIRCUIT LINEAR 28 VOLT SOLID STATE POWER CONTROLLER HYBRID《28伏特固态混合功率控制器线型微电路》.pdf
《DLA SMD-5962-95605-1995 MICROCIRCUIT LINEAR 28 VOLT SOLID STATE POWER CONTROLLER HYBRID《28伏特固态混合功率控制器线型微电路》.pdf》由会员分享,可在线阅读,更多相关《DLA SMD-5962-95605-1995 MICROCIRCUIT LINEAR 28 VOLT SOLID STATE POWER CONTROLLER HYBRID《28伏特固态混合功率控制器线型微电路》.pdf(14页珍藏版)》请在麦多课文档分享上搜索。
1、SMD-5962-95605 W 9999996 0079775 42T LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV I I I REV STATUS OF SHEETS PMIC N/A STANDARD MICROCIRCUiT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DESC FORM 193 PREPAREDBY Gary Zahn CHECKED BY Mi
2、chael C. Jones APPROVEDBY Kendall A. Cottongim DRAWING APPROVAL DATE 95-09-14 REVISION LEVEL DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 MICROCIRCUIT, LINEAR, 28 VOLT, SOLID STATE POWER CONTROLLER, HYBRID I 5962-95605 SIZE A SHEET 1 OF 13 JUL 94 DISTRIBUTION STATEMENT A Approved for public
3、release, distribution IS unlimited 5962-E298-95 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-95605 W 9999996 0079776 366 - STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE A 5962-95605 REVISION LEVEL
4、 SHEET 2 1. SCOPE 1.1 -. This drawing forms a part of a one part - one part number docunentation system (see 6.6 herein). Thi! drawing describes device requirements for hybrid microcircuits to be processed in accordance with MIL-H-38534. product assurance classes, military high reliability (device c
5、lass H) and space application (device class K) and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Nunber (PIN). Uhen available, a choice of radiation hardness assurance levels are reflected in the PIN. Two 1.2 u. The PIN shall be as shown in th
6、e following example: Federal RHA Litt Devi ce Device Case Lead i$ 1 95605 stock class designator tw class out l ine finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) u; (see 1.2.3) i/ Drawing nunber 1.2.1 wiation hard- assurance CBII&, desisnata . Device classes H and K RH
7、A marked devices shall meet the A dash (-1 indicates a MIL-H-38534 specified RHA levels and shall be marked with the appropriate RHA designator. non-RHA device. 1.2.2 Device tvoe(a . The device type(s1 shall identify the circuit function as follows: Device ta? Generic QUIUIZX ircuit funcu lkuhxl o1
8、02 03 04 05 06 07 RP-21002DO RP-2100500 RP-21007DO RP-2101ODO RP-21015DO RP-2102000 RP-21025DO 28 V dc, solid state power controller 2 Anps 28 V dc, solid state power controller 28 V dc, solid state power controller 28 V dc, solid state power controller 5 ms 7 AW 10 ARPS 28 V dc, solid state power c
9、ontroller 28 V dc, solid state power controller 28 V dc, solid state power controller 15 Anps 20 Anps 25 Amps 1.2.3 Device class desianato: . This device class designator shall be a single letter identifying the product assurance level as follows: Device cla Device reauirementstatioil H or K Certifi
10、cation and qualification to MIL-H-38534 1.2.4 outlinNs1 . The case outline(s1 shall be as designated in MIL-STD-1835 and as follows: ine letter Desc r 1 Dt i ve des i anat or fh&auuk . X See figure 1 10 Flange package . 1.2.5 pad finish The lead finish shall be as specified in MIL-H-38534 for classe
11、s H and K. Finish letter aaXaa shall not be marked on the microcircuit or its packaging. finishes A, 6, and C are considered acceptable and interchangeable without preference. The “Xaa designation is for use in specifications when lead Provided by IHSNot for ResaleNo reproduction or networking permi
12、tted without license from IHS-,-,-SMD-S9b2-SbOS 999b 0079777 ZTZ 1.3 molute maximJm rat in=. 1/ Power input to power ground . Control input to signal ground . Power ground to signal ground Pin to case Storage tenperature range VBIAS“ Lead tenperature (soldering) Junction tenprature (TJ) 1.4 p. Power
13、 input to power ground . vBIAs“ Case operating temperature range (TC) Control input to signal ground . Power ground to signal ground 50 V dc continuous (100 V, 50 ms transient) + 0.5 V V dc to +lo0 V dc -0.5 V dc to +7.0 V dc -1000 V dc to +lo00 V dc -6% to +150C +3OPC +150C +9.0V dc to +40.0 Vdc +4
14、.5 V dc to +5.5 V dc -55C to +125C 2. APPLICABLE DOCUMENTS . 2.1 uvermient swcification. s-rds. and handbook . Unless otherwise specified, the fol lowing specification, standards, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specif
15、ied in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION MILITARY MIL-H-38534 - Hybrid Microcircuits, General Specification for. STANDARDS MI LI TARY MIL-STD-883 - Test Methods and Procedures for Microeiectronics. MIL-STD-973 - Configuration Management. MIL-
16、STD-1835 - Microcircuit Case Outlines. HANDBOOK MIL i TARY MIL-HDBK-780 - Standardized Military Drawings. (Copies of the specification, standards, and.handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed
17、by the contracting activity.) 2.2 Qrder of mec-. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 1/ Stresses above the absolute maxim rating may cause permanent damage to the device. maxim levels may degrade
18、 performance and affect reliability. Extended operation at the 596245605 REVISION LEVEL SHEET STAN DARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 DESC FORM 193A JUL 94 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-3.
19、 REWIREMENTS 3.1 Item reauirm . The individual item requirements shall be in accordance with MIL-H-38534 and as specified The design, construction, and physical dimensions shall be as herein. 3.2 mian. construction. and phvsical dimensions . 1 specified in MIL-H-38534 and herein. 3.2.1 Caseoutlinew
20、. 3.2.2 m-nal cmuections . . Unless otherwise specified herein, the electrical performance 3.3 Elect rica1 wrf or-rist i ca The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. The terminal connections shall be as specified on figure 2. characteristics are as specified in table
21、 I and shall apply over the full specified operating temperature range. 3.4 Electric71 test reauir- . The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 w. Marking shall be in accordance with MIL-H-38534
22、. The part shall be marked with the PIN listed in 1. herein. In addition, the manufacturers PIN may also be marked as listed in ML-38534. lity. In addition to the general requirements of MIL-H-38534, the manufacturer of the par ._ described herein shall maintain the electrical test data (variables f
23、ormat) from the initial quality conformance inspection group A lot sanple, produced on the certified line, for each device tVpe listed herein. also include a sumiary of all parameters manually tested, and for those which, if any, are guaranteed. shall be maintained under docwnt revision level contro
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