DLA SMD-5962-95543-1995 MICROCIRCUIT DIGITAL FUTUREBUS ARBITRATION CONTROLLER MONOLITHIC SILICON《未来母线公断控制器硅单片电路线型微电路》.pdf

《DLA SMD-5962-95543-1995 MICROCIRCUIT DIGITAL FUTUREBUS ARBITRATION CONTROLLER MONOLITHIC SILICON《未来母线公断控制器硅单片电路线型微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-95543-1995 MICROCIRCUIT DIGITAL FUTUREBUS ARBITRATION CONTROLLER MONOLITHIC SILICON《未来母线公断控制器硅单片电路线型微电路》.pdf（35页珍藏版）》请在麦多课文档分享上搜索。

1、 SMD-5762-95543 9999996 0071839 O41 = FEVISICh6 lwm/ED (YR-MO- DA 1 LTR IrniCN FEV 3-EET RN sFEr 111 W STAX OF S-EETS 567 RVIIC N/A STANMRD MI CROC IRUJI T mNG THIS DRAUING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC NIA _I DESC FORM 193 JUL 94 5962-E109-95

2、 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. REVISION LEVEL EFBVSE ELlXlKNIG -PLY CBVIER PREPARED BY Larry T. Gauder wm, CHIO 45444 CHECKED BY Thomas M. Hess IzE A 67268 5962-95543 MICROCIRCUIT, DIGITAL, FUTUREBUS ARBITRATION CONTROLLER, MONOLITHIC APPROVED BY M

3、onica L. Poelking I SILICON DRAWING APPROVAL DATE 95-03-1 5 I I SHEET 1 OF 34 I Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- SMD-5962-75543 ei 9999996 00711840 8b3 STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444

4、 1. SCOPE 1.1 Scope. This drawing forms a part of a one part - one part Mmber docmentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes P and M) and space application (device class V), and a choice of case outlines and lead finishes a

5、re available and are reflected in the Part or Identifying Nunber (PIN). 1.2.1 of MIL-STD-883, olProvisions for the use of MIL-STD-883 in conjunction uith conpliant non-JAN devicesla. available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. Device class M microcircui

6、ts represent non-JAN class B microcircuits in accordance with Uhen 1.2 m. The PIN shall be as shown in the following exenple: 5r I 95543 i i Federal RHA Devi ce Device Case Lead stock class designator type c 1 ass outline finish designator (see 1.2.1) (see 1.2.2) designator (see 1.2.4) (see 1.2.5) L

7、 / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device class M RHA marked devices shalt meet the MIL-1-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. MIL-1-38535 specified RHA levels and shall be marked with the appropriate RHA designator. non-RH

8、A device. Device classes P and V RHA marked devices shall meet the A dash (-) indicates a 1.2.2 Device type(s1. The device type(s) shall identify the circuit function as follows: SIZE 5962-95543 A fwISICNLEEL SEET 2 Device type o1 Generic nunber DS3875 Circuit function futurebus arbitration controll

9、er 1.2.3 Device class designator. lhe device class designator shall be a single letter identifying the product sssurance level as follows: Device class Device requirements docunentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance uith 1.2.1 of MIL-

10、STD-883 P or V Certification and qualification to MIL-1.38535 1.2.4 Case outline(s). lhe case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X see figure 1 68 flat pack 1.2.5 Lead finish. The lead finish shall be as spe

11、cified in MIL-STD-883 (see 3.1 herein) for class M or YIL-1-38535 for classes P and V. designation is for use in specifications when lead finishes A, 6, and C are considered acceptable and interchangeable without preference. Finish letter llX1l shall not be marked on the microcircuit or its packagin

12、g. The “X“ Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-5962-95543 II b 007LB4L 7TT II STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 1.3 Absolute maximum ratings. I/ SIZE 5962-95543 A FEVISICNLML S-EET 3 Su

13、pply voltage (VDD) - - - - - - - - - - - - Control input voltage - - - - - - - - - - - - Storage tenperature range (TSTG) - - - - - - Maximum power dissipation (PD) - - - - - - Lead tenyierature (soldering,lO seconds) - - - Junction temperature (TJ) - - - - - - - - - Thermal resistance, junction-to-

14、case (8JC) - Thermal resistance, junction-to-dient (BJA) 1.4 Recomnended operating conditions. Supply voltage range (VDDI Ambient operating temperature range (TA) 1.5 Digital loqic testing for device classes CI and V. - - - - - - - - - - - - - - - - - - - - - - - - - Fault coverage measurement of ma

15、nufacturing Logic tests (MIL-STO-883, test method 5012) - - - - - - 2. APPLICABLE DOCUMENTS 6.5 V 5.5 v -65C to +150C 3.9 u +26OoC +175“C 3.4“C/U 38C/U +4.5 V dc to +5.5 V dc -55C to +125“C I/ XX percent 2.1 Govermient wecification. standards, bulletin, and handbook. Unless otherwise specified, the

16、following specification, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION MILITARY MIL-1-38535 - Integrated C

17、ircuits, Manufacturing, General Specification for. STANDARDS MI L ITARY MIL-STD-883 - Test Methods and Procedures for Microelectronics. MIL-STD-973 - Configuration Management. MIL-STD-1835 - Microcircuit Case Outlines. BULLET IN MILITARY MIL-BUL-i03 - List of Standardized Military Drawings (SMDs). H

18、ANDBOOK MILITARY MIL-HDBK-780 - Standardized Military Drawings. (Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity.) -

19、Stresses above the absolute maximum rating may cause permanent damage to the device. the maximm levels may degrade performance and affect reliability. Derate at 11.5 mU/C above 25C. Values wi l 1 be added when they become avai lable. Extended operation at 31 Provided by IHSNot for ResaleNo reproduct

20、ion or networking permitted without license from IHS-,-,-SMD-5962-95543 I 9999996 0073842 636 I 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. 3. REQUIREMENTS 3.1 Item requirements.

21、 The individual item requirements for device class M shall be in accordance with 1.2.1 of MIL-STD-883, I1Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devicesn1 and as specified herein. The individuel item requirements for device classes P and V shall be in accordance w

22、ith MIL-1-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not effect the form, fit, or function as described herein. specified in MIL-STD-883 (see 3.1 herein) for device class M and MIL-1-38535 for device cl

23、asses P and V and herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as 3.2.1 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Logic diagram. 3.3 Electrical performance characteristics and

24、 postirradiation parameter limits. Unless otherwise specified Case outline(s1. The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. The logic diagram shall be as specified on figure 3. herein, the electrical performance characteristics and postirradiation parameter limits are a

25、s specified in table I and shall apply over the full ambient operating temperature range. The electrical tests for each subgroup are defined in table 1. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. 3.5 Marking. The part shall be mar

26、ked with the PIN listed in 1.2 herein. Marking for device class M shall be in accordance with MIL-STD-883 (see 3.1 herein). MIL-BUL-103. In addition, the manufacturers PIN may also be marked as listed in Marking for device classes P and V shall be in accordance with MIL-1-38535. 3.5.1 Certification/

27、cmliance mark. The compliance mark for device class M shall be a V2I as required in MIL-STO-883 (see 3.1 herein). in MIL-1-38535. The certification mark for device classes Q and V shall be a WML1I or iiQ1i as required 3.6 Certificate of compliance. For device class M, a certificate of compliance sha

28、ll be required from a manufacturer in order to be listed as an approved source of supply in MIL-BUL-103 (see 6.7.2 herein). classes P and V, a certificate of conpliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.7.1 herein). T

29、he certificate of compliance submitted to DESC-EC prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device class M, the requirements of MIL-STO-883 (see 3.1 herein), or for device classes P and V, the requirements of MIL-1-38535

30、and the requirements herein. 3.1 herein) or for device classes Q and V in MIL-1-38535 shall be provided with each lot of microcircuits delivered to this drawing. For device 3.7 Certificate of conformance. A certificate of conformance as required for device class M in MIL-CTD-883 (see 3.8 Notificatio

31、n of chanse for device class M. For device class M, notification to DESC-EC of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change as defined in MIL-STD-973. 3.9 Verification and review for device class M. For device class M, DESC, DESCs agent, an

32、d the acquiring activity Offshore documentation retain the option to review the manufacturers facility and applicable required docmentation. shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assigrnent for device class M. Device class M devices covered by this dr

33、awing shall be in microcircuit group nwrber 100 (see MIL-1-38535, appendix A). 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device class M, sampling and inspection procedures shall be in accordance with For device classes Q and V, sapling and inspection procedures shall be in acc

34、ordance MIL-STD-883 (see 3.1 herein). with MIL-1.38535 or as modified in the device manufacturers Quality Management (PM) plan. plan shall not effect the form, fit, or function as described herein. The modification in the QM STANDARD 5962-95543 MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER

35、DAYTON, OHIO 45444 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SND-5 962-95.5 43 999b 0071843 572 STANDARD SIZE MICROCIRCUIT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 fEVISIcNLML 5962-95543 S-EET 5 TABLE I. Electrical perform

36、ance characteristics. Test Conditions -55C 5 TA 5 +125“C vcc = 5 v i10% I/ unless otherwise specified Group A IDevice I Limits Unit Max V Logical 1 input voltage VIH Logical O input voltage VIL 0.75 V Logical O output voltage VOL 0.7 V Logical 1 output voltage VOH V Input leakage diode current ILA 3

37、 vcc = 5.5 v VIN = VDD or Vss vcc 5.5 v input at standby vcc = 5.5 v II Icc IDD 30 m4 Static supply current 1 O0 Dynamic supply current Functional test cc = 4.5 v, 5.5 v cc = 4.5 v ee 4.4.lb ee figure 4 36 ns - BRQ asserted to Bgrant asserted t2 30 ns Aqi negated to AcOo, Ac10 Aqi negated to Apo ass

38、erted t3 31 ns t4 38 ns - MGRP or BRa asserted to Apo asserted - ENDT asserted to Apo asserted (dumr/ cycle) t5 ns ns - BRP asserted to Apo asserted (consecutive bus request) t6 34 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-95543 W 9999

39、796 0073844 409 W STANDARD SIZE MICROCIRCUIT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 WlSlcNLML TABLE 1. Electrical wrformance characteristics. - continued 5962-95543 SET 6 Test Conditions -55C 5 TA 5 +125“C vcc = 5 v *IO% I/ unless otherwise specified Unit )evice type Limits G

40、roup A subgroups Min Max t7 ICC = 4.5 v see figure 4 9, IO, 11 28 ns Halt negated to Apo asserted o1 o1 Max CN-E negated to ARO negated E100 9, IO, 11 4+ (0-25) ns CN-E width o1 t101 9, IO, 11 18 28 ns CN port setup time 9, IO, 11 o1 23 t102 ns Iba-= asserted to Aro negated. (determined by programbl

41、e value IBA mode) t104 9, IO, 11 o1 20+ (0-25) ns - CMPT asserted to Aro programble value) negated. (determined by 9, IO, 11 20+ (0-25) t105 ns o1 o1 o1 9, IO, 11 1 8+ (0-25) t106 ns AC00 asserted to Aro negated. (determined by programble value stow mode) APO asserted to CN-E asserted. CTRL3 (O), it

42、go“ bit is set 9, 10, 11 ns 32 :I 07 9, IO, 11 24 ns APOmerted to CMPT asserted APO asserted to IBA-CMPT asserted APO asserted to AC00 asserted slou mode o1 o1 o1 o1 108 :lo9 t110 200 9, 10, 11 22 ns 9, 10, 11 32 ns ns 9, 10, 11 62 hRI nested to AB-RE asserted Provided by IHSNot for ResaleNo reprodu

43、ction or networking permitted without license from IHS-,-,-SND-5762-755q3 W 99b 0073845 345 = Condi ti ons -55C 5 TA 5 +125“C unless otherwise specified vcc = 5 v *lo% I/ TABLE I. Electrical Derformance characteristics. - continued Group A Device subgroups type Test Unit Limits Min Max Icc 4.5 v iee

44、 figure 4 40 IBAhserted to BGRNT asserted IBA de :202 ns - UIN-GT asserted to Aqo asserted after TA expi red 35 ns :203 t204 9, 10, 11 o1 Il 24 ns AQI asserted to AQO asserted AR1 negated to ABO asserted t205 9, 10, 11 o1 II 30+TA ns IBA-; asserted to AO0 asserted 9,10,111 9, 10, 11 9, 10, 11 35 ns

45、:207 ns AC10 asserted to APO negated 29 :300 I301 27 ns AS-Cancel negated to APO negated APO negated to AB-RE negated 9, 10, 11 o1 II 10 :310 ns AQO asserted to AC10 asserted 9, 10, 11 o1 II 13 :320 ns AC11 asserted to APO negated 9, 10, 11 o1 II 21 ns :32 1 5 t322 21 ns 5 AS-Cancel asserted to APO

46、negated AC11 asserted to APO negated 24 ns :330 I I STANDARD MICROCIRCUIT DRAWING DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 45444 SIZE 1 IA 5962-95543 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-SMD-59b2-95543 W 9999996 0073846 281 = . TABLE

47、 I. Electrical Derformance characteristics. - continued Test - MGRQ or BRP negated to ACOO, AC10 asserted APO asserted to AC00 negated AQOserted to ERIT asserted AP Inega ted to CMPT negated AC11 asserted to ARO asserted - AS-Cancel asserted to AC10 asserted AR1 asserted to ARO asserted - ENDT asser

48、ted to ARO asserted ARO-rted to BGRNT asserted - BGRNT, MGTX, UNLK or any interrupt asserted to APO negated AROBerted to FSTR negated ARO assed to IBACMPT negated ARO-erted to e, UNLK or any interrupt asserted STANDARD SIZE 5962-95543 MICROCIRCUIT DRAWING A DEFENSE ELECTRONICS SUPPLY CENTER DAYTON,

49、OHIO 45444 FWISICNLEVEL SEET 8 Conditions -55OC 5 TA 5 +125“C vcc = 5 v i10% I/ unless otherwise specified Group A subgroups ievice type Limits Unit Min Max t340 9, 10, 11 o1 40 ns ycc = 4.5 v See figure 4 t341 9, IO, 11 o1 4 ns 9, IO, 11 o1 23 ns t342 t400 401 t403 9, IO, 11 34 ns o1 o1 o1 o1 9, 10, 11 26 ns 9, 10, 11 24 ns 7 t405 9, 10, 11 25 ns t407 9, 10, 11 o1 32 ns 9, 10, 11 12 ns o