DLA SMD-5962-89575 REV D-2013 MICROCIRCUIT DIGITAL CMOS REMOTE TERMINAL FOR STORES WITH 1K X 16 RAM MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R114-95. - LTG 95-04-13 Monica L. Poelking B Update boilerplate to the requirements of MIL-PRF-38535. Editorial changes throughout. TVN 01-05-25 Thomas M. Hess C Update boilerplate to current MIL-PRF-38535 requ
2、irements. CFS 07-06-12 Thomas M. Hess D Update boilerplate paragraphs to the current MIL-PRF-38535 requirements. - LTG 13-09-24 Thomas M. Hess REV SHEET REV D D D D D D D D D SHEET 15 16 17 18 19 20 21 22 23 REV STATUS REV D D D D D D D D D D D D D D OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14
3、PMIC N/A PREPARED BY Christopher A. Rauch DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A CHECKED BY Tim H. Noh APPROVED BY William
4、K. Heckman MICROCIRCUIT, DIGITAL, CMOS, REMOTE TERMINAL FOR STORES WITH 1K X 16 RAM, MONOLITHIC SILICON DRAWING APPROVAL DATE 90-04-27 REVISION LEVEL D SIZE A CAGE CODE 67268 5962-89575 SHEET 1 OF 23 DSCC FORM 2233 APR 97 5962-E576-13 Provided by IHSNot for ResaleNo reproduction or networking permit
5、ted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89575 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuit
6、s in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 5962-89575 01 X A Drawing number Device type (see 1.2.1) Case outline (see 1.2.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the
7、 circuit function as follows: Device type Generic number Circuit function 01 UT1760A RTS Remote terminal for stores with 1K x 16 RAM 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X CMGA15-P68
8、 68 Pin grid array Y CQCC2-J68 68 Unformed-lead chip carrier Z CQCC1-N68 68 Square leadless chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ Supply voltage range (VDD) -0.3 V dc minimum to +7.0 V dc maximum DC input/dc out
9、put voltage range (VIN) . -0.3 V dc minimum to 7.3 V dc maximum Maximum power dissipation (PD) . 300 mW 2/ Storage temperature range -65C to +150C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Lead temperature (soldering, 10 seconds) . +300C Maximum junction temperature (TJ) . +175C L
10、atchup immunity (ILU) 150 mA 1.4 Recommended operating conditions. Supply voltage range (VDD) 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) . 5.5 V dc Maximum low level input voltage (VIL) 0.0 V dc Case operating temperature range (TC) . -55C to +125C Operating frequenc
11、y (FO) . 12 MHz VSS. 0.0 V dc _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Must withstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNot for
12、 ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89575 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. T
13、he following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufac
14、turing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Mi
15、crocircuit Drawings. (Copies of these documents are available online at http:/quicksearch.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094). 2.2 Order of precedence. In the event of a conflict between the text of this drawing and t
16、he references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-
17、PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be pro
18、cessed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect
19、form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construc
20、tion, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Functional block diagram. The fu
21、nctional block diagram shall be as specified on figure 2. 3.2.4 Test circuit and switching waveforms. The test circuit and switching waveforms shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics
22、are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. Provided by IHSNot for ResaleN
23、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89575 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shal
24、l be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. 3.5.1 Certification/compli
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