DLA SMD-5962-89476 REV A-2011 MICROCIRCUIT MEMORY DIGITAL CMOS UV ERASABALE PROGRAMMABLE LOGIC DEVICE MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Updated boilerplate for 5 year review. - lhl 11-05-09 Charles F. Saffle REV SHET REV SHET REV STATUS REV A A A A A A A A A A A A A A OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Kenneth Rice DLA LAND AND MARITIME COLUMBUS
2、, OHIO 43218-3990 http:/www.dscc.dla.mil STANDARD MICROCIRCUIT DRAWING CHECKED BY Kenneth Rice THIS DRAWING IS AVAILAALE FOR USE AY ALL DEPARTMENTS APPROVED BY Mike Frye MICROCIRCUIT, MEMORY, DIGITAL, CMOS, UV ERASABALE PROGRAMMABLE LOGIC DEVICE, MONOLITHIC SILICON AND AGENCIES OF THE DEPARTMENT OF
3、DEFENSE DRAWING APPROVAL DATE 92-11-17 AMSC N/A REVISION LEVEL A SIZE A CAGE CODE 67268 5962-89476 SHEET 1 OF 14 DSCC FORM 2233 APR 97 5962-E310-11 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89476 DLA LA
4、ND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). T
5、he complete PIN shall be as shown in the following example: 5962-89476 01 L A _ _ _ _ _ _ _ _ Drawing number Device type Case outline Lead finish (see 1.2.1) (see 1.2.2) (see 1.2.3) 1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number 1/
6、 Circuit function Propagation delay 01 16-Macrocell EPLD 35 ns 02 16-Macrocell EPLD 25 ns03 16-Macrocell EPLD 15 ns 1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style L GDIP3-T24, CDIP4-T24 2
7、4 Dual-in-line package 2/ X GQCC1-J28 28 “J“ lead chip carrier 2/ 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 3/ Supply voltage range (VCC).-2.0 V dc to +7.0 V dc Programming supply voltage range (VPP).-2.0 V dc to +13.5 V dc 4/ DC i
8、nput voltage range-2.0 V dc to +7.0 V dc 4/ Maximum power dissipation1.0 W 5/ Lead temperature (soldering, 10 seconds)+260C Thermal resistance, junction-to-case (JC): Case outlines L and X.See MIL-STD-1835 Junction temperature (TJ).+175C Storage temperature range-65C to +150C Temperature under bias
9、range-55C to +125C Endurance25 erase/write cycles (minimum) Data retention10 years (minimum) _ 1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and will also be listed in MIL-HDBK-103. 2/ Lid shall be transparent to permit ultrav
10、iolet light erasure. 3/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 4/ Minimum dc input voltage is -0.5 V. During transitions, inputs may undershoot to -2.0 V for periods
11、 less than 20 ns. Maximum dc voltage on output pins is VCC+ 0.5 V, which may overshoot to +7.0 V for periods less than 20 ns under no load conditions. 5/ Must withstand the added PDdue to short circuit test (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without lic
12、ense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-89476 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL A SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. Supply voltage range (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13、. +4.5 V dc to +5.5 V dc Ground voltage (GND) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 V dc Input high voltage (VIH) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.0 V dc minimum Input low voltage (VIL) . . . . . . .
14、 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8 V dc maximum Case operating temperature range (TC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to +125C 6/ Input rise time (tR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
15、. . . . . . . . . 50 ns maximum Input fall time (tF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 ns maximum 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks for
16、m a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE
17、 STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are avai
18、lable online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of thi
19、s drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class lev
20、el B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with th
21、e manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
22、 modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as s
23、pecified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2. _
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