DLA SMD-5962-86088-1986 MICROCIRCUITS DIGITAL GRAPHICS DISPLAY CONTROLLER MONOLITHIC SILICON《硅单块 绘图显示控制器 数字微型电路》.pdf

《DLA SMD-5962-86088-1986 MICROCIRCUITS DIGITAL GRAPHICS DISPLAY CONTROLLER MONOLITHIC SILICON《硅单块 绘图显示控制器 数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-86088-1986 MICROCIRCUITS DIGITAL GRAPHICS DISPLAY CONTROLLER MONOLITHIC SILICON《硅单块 绘图显示控制器 数字微型电路》.pdf（24页珍藏版）》请在麦多课文档分享上搜索。

1、DESC-DWG-BbOBB 57 W 7777775 00059bB L m I i -1 -I Defense Electronics Supply Center Dayton, Ohio Original date of drawing: 27 October 1986 1 REVISIONS D ESC R i PTiO N I AMSC NIA REV PAGE 1 OF 24 I 5962-EO90 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. DESC FORM

2、193 MAY 6 - Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,- I- - DESC-DWG-BbOBB 57 II 7777775 0005?bS 3 M SIZE CODE IDENT. NO. MILITARY DRAWING A 14933 1. SCOPE 1.1 Scope. This drawing describes the device requirements for class 6 microcircuits in a

3、ccordance with 112,1 of MIL-STO-883, Provisions for the use of MIL-STO-883 in conjunction with compliant non-JAN devices“. 1.2 Part number. The complete part number shall be as shown in the following example: T I I I s 5962086088 o1 I 7 I I I I I I I I E- Lead finish Per (1.2.21 MIL-M-38510 1.2.1 De

4、vice type. The device type shall identify the circuit function as follows: Device type Generic number Circuit function o1 82720 Graphics display controller 1,2.2 Case outline The case outline shall be as designated in appendix C of MIL-M-38510, and as fol 1 ows: DWG NO. 5962-86088 Case outline Outli

5、ne letter Q 0-5 (4O-leadS 9/16“ X 2-1/6“1 dual -in-1 ine package DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO 1.3 Absolute maximum ratings. lJ Case temperature under bias - - - - - - - - - - - Storage temperature - - - - - - - - - - - - - - - Voltage on any pin with respect to ground - - - - Power

6、 dissipation (Po)- - - - - - - - - - - - - - Lead temperature- - - - - - - - - - - - - - - Thermal resistance, junction-to-case jc)- - - - Junction temperature (TJ) - - - - - - - - - - - - REV PAGE 2 1.4 Recommended operating condi tionc. Supply voltage (Vccl- - - - - - - - - - - - - - - Input volta

7、ge e - - - - - - - - - - - - - - - Input high voltage- - - - - - - - - - - - - - - - Input high voltage on DACK- - - - - - - - - - - - Clock input low voltage - - - - - - - - - - - - - Clock input high voltage- - - - - - - - - - - - - Case operating temperature (TC) - - - - - - - - Clock frequency -

8、 - - - - - - - - - - - - - - - -55C to +125“C -65C to +15OoC -0.5 v to 7 v 1.5 W +3OO0C _ - See MIL-M-38510, +20O0C appendix C 4.5 V dC to 5.5 V dC -0.5 V dC to 0.8 V dC 2.2 V dc to VCC +0.5 V dc 2.5 V dc ta V c t0.5 V dc -0.5 V dc to 6.6 V dc 3.5 V dc to V +0.5 V dc 0.5 MHz to 4 kkz -55C to +125“C

9、I I I I I I DECC FORM 193A FE6 66 I - - -a- Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DESC-DWG-6088 57 POB 7777775 0005770 T U MILITARY DRAWING DEFENSE ELECTRONICS SUPPLY CENTER 2. APPLICABLE DOCUMENTS 2.1 Government specification and standard,

10、 Unless otherwise specified, the following specification and standard, of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPEC IF I CATION MILITARY MIL-M-38510

11、 - Microcircuits, General Specification for. STANDARD MILITARY MIL-STO-883 - Test Methods and Procedures for Microelectronics. (Copies of the specification and standard required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as

12、directed by the contracting activity. 1 references cited herein, the text of this drawing shall take precedence. 2.2 Order of precedence. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of In the event of a conflict between the text of this d

13、rawing and the YIL-STD-883, “Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices“ and as specified herein. A 14933 5962-86088 I I 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-M-38510

14、and herein. DAYTON, OHIO I 3.2.1 Design documentation. The design documentation shall be in accordance with NIL-M-38510 and, unless otherwise specified in the contract or purchase order, shall be retained by the manufacturer but be available for review by the acquiring activity or contractor upon re

15、quest. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Block diagram. The block diagram shall be as specified on figure 2. 3.2.4 Switching waveforms. The switching waveforms shall be as specified on figure 3. 3.2.5 Case outline. The case outline shall be

16、 in accordance with 1.2.2 herein. 3.3 Electrical performance characteristics. Unless otherwise specified, the electrical performance charcteristics are as specified in table I and apply over the full recommended case operating temperature range. 3.4 Marking. Marking shall be in accordance with NIL-S

17、TD-883 (see 3.1 herein). narked with the part number listed in 1.2 herein. In addition, the manufacturers part may also be narked as listed in 6.4 herein. The part shall be REV PAGE 3 I SIZE I CODE IDENT. NO. I DWG NO. Provided by IHSNot for ResaleNo reproduction or networking permitted without lice

18、nse from IHS-,-,-TABLE I. El ectrf cal performance characteristics. I 1 I I I I -55C 5 TC +125“C I subgroups I ax I I vcc = 57 110% I I Min I M I I I I I I IIoL = 2*2 I I I I I 1,2s3 I I I Test I Symbol I Condi tions I Group A I Limits I I 1 I I 0.45 I V Output low voltage IVOL I I I k Output high v

19、oltage /VOH /IOH I -400 NA i 1,2,3 I 2.4 I IV I I I I 0.8 I v input low voltage VIL I I 1 I I I I I I I I I I I I I I I I I I 1,2,3 1-0.5 I 0.6 I V t 1 I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I I ITc = +25“C I I I I I I I I I I I I I I l ITc i: +25C I I I I IInput high voltage /VIH

20、 I L 1,2,3 I 2.2 I IV I I I I I Input high voltage IVIH I I 1,2,3 I 2.5 I IV on DACK I(OACI0 I IVCL I t I I I 1 I I I 3*5 Clock input low vol tage I I vol tage I IV Clock input high (VCH I I 13 Output leakage currentlI0Z IVss t0.45 V1 Vcc I 1,2,3 10 I +lo I 4 Input leakage current IILC IVss Y1 Vcc I

21、 1,2,3 1-10 +lo i UA vcc suppty current Ilcc I I 1,2,3 1 I 300 I mA Input capacitance Ci“ IVcc = GND O V, Fc L 1 MHz, I 4 I I 10 I pF ISee 4.3.1 i/O capacitance !CIO IVCC I GND = O Y, Fc = 1 MHz, I 4 I I 20 I pF I I I I Pee 4*3*1c 1 I I I I I Output capacitance /COUT iVcc = GND = O Y, FC = 1 MHz, I

22、4 I i 20 I pF ITc = +25“C I I I I I ISee 4.3.1 I I I I SIZE CORE IDENT. NO. DWG NO. MILITARY DRAWING A 14933 5962-86088 DAYTON, OHIO REV PAGE 4 DEFENSE ELECTRONICS SUPPLY CENTER DECC FORM 193A FEB 86 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DE

23、SC-DWG-6084 57 iiS 7777775 0005772 3 W I I See footnote at end of table. SIZE CODE IDENT. NO. MILITARY DRAWING A 14933 DWG NO. 5962-86088 DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO REV PAGE 5 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-TABLE

24、I. Electrical performance characteristics - Continued, 1 I I I I I r I 1 I I I I I I I I I I I I I 9,10,11 I o I I ns I I I I I IOata setup to Itoc I y I I I I I l I I 2XWCLK+ I I I I I ns I IData hold time I 9,10911 I I 120 I ns I I I I I I I I2XWCLK .) to ALE f ItCAH 1 I 9,10911 I 30 I 125 I ns I

25、I I I I I I I2XWCLK .+ to ALE .+ IQAL 1 I 9,10,11 I 15 I I ns I l I I I I I I I I I 9,10911 Itcyf30 I I ns I IALE low time I 9910911 ItCH-20 I I ns I IALE high tine I 9910,ll I I 150 I nc I I I I I I IVideo signal delay Itco I I I I I I I from ZXWCLK f I I I I I ns I I I I I I I I I I I I I IAddress

26、 valid hold ItLLAX I I from ALE j. I 9,10,11 I 20 I I ns I I I I I 1 I IAddress val id I I I before ALE .+ I I I I I 9,10,11 I 30 I I ns I I I I I I I I I I I I setup to 2XWCLK1 I I I I I I 9,10,11 py I I ns I I I I I ILPEN or VSYNC input Itpp I I I I I I I I I I I pulse width I I I I I orilK.+ I I

27、I I I I I ns I I I I I :mn?r hold from + ItCAC I I orlR4 I I I I See footnote at end of table. Test I Symbol I Condi tianc I Group A I Limits I subgroups I -55C i TC +125C I vcc = 571 *lo% I I Min I Y ax I I I I I ItCD I 11 I I I I I I I I I IAL I 11 I I I I I I IAH I I I I I I I I 1 I AVAL I I ILPE

28、N or VSYNC input Itpc I I “K setup to R6 .c ItACC I I 9,10911 I o I I I I I I I I SIZE CODE IDENT. NO. MILITARY DRAWING A 14933 DWG NO. 5952-96098 I c- DEFENSE ELECTRONICS. SUPPLY CENTER DAYTON, OHIO REV PAGE 6 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

29、 IHS-,-,-TABLE I. Electrical performance characteristics - Continued. A I I I I I I I 14933 5962-86088 i Test i Symbol i Conditions I Group A I Limits I Units i 1 -55C TC +125“C I subgroups I I I i Max I I I I vc- = 57 *lo% I I I I I I I I I I I I I I 9,10,11 ltRD120 I I ns I I I I I I IRIT pulse wi

30、dth IRRI I I I I I I I I I I R +to data out ftRD1 IcL = 50 PF L/ I 9,10,11 I 11.5 I ns I I delay I I I It100 I I l I I I I I I I Min I I I I I I I I I LXWCLK 4 to DREQ ItKq I I 9,10,11 I I 150 I ns I I I I I I I I I I I I I I I I I I I ns I I I I I I I I I I I I I I 9,10,11 Itcy I I ns I I I I I I I

31、 I I 9,10,11 /4tCY I I ns I 1 I I I I I I I I I 9,10,11 15tcy I - I ns I I I I I XK cycle tiine, ItAK2 I I I I I I I I I I L I C1 ock frequency I2XWCLK I I 9,10,11 I I 4 I MHz I I I I I I I I I 9,10,11 I 105 I i ns T I I I I C1 ock high time itcn I I I I I I I ns I I I I I 1 I T I I 9,10,11 I I ns I

32、 I I l I I I I 20 I ns I I I 9,10,11 I I I I I I I I I I 9,10,11 14tcy I I I I I im recovery time ItRV I I del ay I I I I I I I 1 I ns !:!Eo I I OACK + to DREQ + ItAKRQ ICL = 50 PF L/ I 9,10,11 I DREQ Setup to DACK + tRQAK I L/ I 9,10,11 I o I I I l - del ay I I I TKR high time AKH I L/ word mode j1

33、4K1 I I I I I ITRCR cycle time , byte mode I I Clock low time (tCL I I 9,10,11 I 105 Ri se time I tR Fall time i tF i/ See figure 3. Timing measurement reference levels (except 2XWCLK) 0.8 V to 2.0 V. Timing measurement reference levels 0.6 V to 3.5 V (2XWCLK). MILITARY DRAWING DEFENSE ELECTRONICS S

34、UPPLY CENTER DAYTON, OHIO IESC FORM 193A FEB 86 SIZE I CODEIDENT.NO. I DWGNO. I REV I PAGE t Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-2XWCLK I VC c SIZE CODE IDENT. O. MILITARY DRAWING A 149i33 7 DBIN HSYNC V/EXT SYNC BLANK RAS (ALE) DRQ - DAC

35、K rn AO D0 -O DB-1 OB -2 DB -3 DB-4 DB-5 DB-6 08-7 - RD GN D DWG NO. 5962-86088 FIGURE 1. Teminal connections. DEFENCE ELECTRONICS SUPPLY CENTER DAYTON, OHIO REV PAGE 8 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-b DESC-DWG-86088 59 7777775 00059

36、76 O * - O HSYNC O BLANK c- -V/EXT SYNC VIDEO SYNC - GENERATOR -t DREQ - DMA DACK CONTROL - DB-O to 7 A-O RD WR - INTERFACE STATUS REG. DATA READ REG. -r BUFFER 16 x 9 COMMAND PROCESSOR WITH CONTROL ROM 128 x 14 =;ay (+125-c) I I electrical parameters I I (method 5005) I I I I I I IAdditional electr

37、ical subgroups I I for group C periodic I I I inspections I I I I I i/ * PDA applies to subgroup 1, see 4.2. F/ - * subgroups 7 and 8 may be omitted if functionality is tested in subgroups 9, 10 and 11. - 3/ Any or all subgroups may be combined when using a high-speed tester. 5. PACKAGING 5.1 Packag

38、ing requirements, The requirements for packaging shall be in accordance with MIL-M-38510. 5962-86088 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required functi

39、on are not available for OEM application. this drawing has been qualified for listing on QPL-38510, the- specified herein will be inactivated and will not be used for new design. The QPL-38510 product shall be the preferred item for all applications. When a military specification exists and the prod

40、uct covered by 6.2 Replaceabil ity. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. I SIZE I CODE IDENT. NO. I DWG NO. I REV I PAGE 23 I DAYTON, OHIO I I I DESC FORM 193A FEB 86 Provided by IHSNot for ResaleNo repr

41、oduction or networking permitted without license from IHS-,-,- DESC-DUG-b0 59 H 9999995 0005993 7 M MILITARY DRAWING DEFENSEELECTRONICSSUPPLYCENTER 6a3 Comnents. Comments on this drawing should be directed to DESC-ECS, Dayton, Ohio 45444, or telephone 513-296-5375, A 14933 5962-86084 I 6.4 Approved

42、source of supply, An approved source of supply is listed herein. Additional sources Mi11 be added as they become available. The vendor listed herein has agreed to this drawing and a :ertificate of compliance (see 3.5) has been submitted to DESC-ECS. DAYTON, OHIO I I I Vendor I Vendor I Rep1 acement

43、I I Military drawing I CAGE I similar part Imilitary specificationi I part number I number I number L/ I part number I I I I I I I I I I I 1 I 5962-8608801QX I34649 I ?1882720/8 I I I I I REV PAGE 24 i i i i I i/ Caution. 00 not use this number for item acquistion. - Items acquired to this number ma

44、y not satisfy the performance requirement of thls drawing. Vendor CAGE number 34649 Vendor name and address Intel Corporation 5000 W. Williams Field Road Chandler, AZ 85224 I SIZE I CODE IbENT. NO. I DWG NO. , Y- Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-