DLA SMD-5962-83020 REV G-2005 MICROCIRCUIT DIGITAL ADVANCED LOW POWER SCHOTTKY TTL FLIP-FLOPS MONOLITHIC SILICON《硅单片双稳多谐振荡器 TTL肖脱基高级小功率数字微型电路》.pdf

《DLA SMD-5962-83020 REV G-2005 MICROCIRCUIT DIGITAL ADVANCED LOW POWER SCHOTTKY TTL FLIP-FLOPS MONOLITHIC SILICON《硅单片双稳多谐振荡器 TTL肖脱基高级小功率数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-83020 REV G-2005 MICROCIRCUIT DIGITAL ADVANCED LOW POWER SCHOTTKY TTL FLIP-FLOPS MONOLITHIC SILICON《硅单片双稳多谐振荡器 TTL肖脱基高级小功率数字微型电路》.pdf（16页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED C Editorial changes throughout. Convert to military drawing format. Added vendor CAGE numbers 27014 and 18324. Table I, propagation delay changes. 88-05-03 Michael A. Frye D Changes in accordance with NOR 5962-R080-92. Changes to Table I and Figure

2、 4. 92-07-06 Monica L. Poelking E Changes in accordance with NOR 5962-R136-96. Changes to device type 02 adding suffix “A“ and Table 1. - les 96-06-05 Michael A. Frye F Editorial changes throughout. Table 1, propagation delay changes. -les 97-10-28 Raymond Monnin G Update to current requirements. Ed

3、itorial changes throughout. - gap 05-10-26 Raymond Monnin CURRENT CAGE CODE 67268 REV SHET REV G SHET 15 REV STATUS REV G G G G G G G G G G G G G G OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Christopher A. Rauch DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING

4、CHECKED BY David H. Johnson COLUMBUS, OHIO 43218-3990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Michael A. Frye MICROCIRCUIT, DIGITAL, ADVANCED LOW POWER SCHOTTKY TTL, FLIP-FLOPS, AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 84-03- 07

5、MONOLITHIC SILICON AMSC N/A REVISION LEVEL G SIZE A CAGE CODE 14933 83020 SHEET 1 OF 15 DSCC FORM 2233 APR 97 5962-E009-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83020 DEFENSE SUPPLY CENTER COLUMBUS COLUM

6、BUS, OHIO 43218-3990 REVISION LEVEL G SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as

7、 shown in the following example: 83020 01 R X Drawing number Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54ALS373 Octal, D-type, flip-flop with

8、transparent latch and 3-state outputs 02 54ALS374A Octal, D-type, edge-triggered, flip-flop with 3-state outputs 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or GDIP2-T20 20 Dual

9、-in-line S GDFP2-F20 or GDFP3-F20 20 Flat 2 CQCC1-N20 20 Square chip carrier 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range(VCC) . -0.5 V dc minimum to +7.0 V dc maximum Input voltage range(VI) . -1.5 V dc

10、at -18 mA to +7.0 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 4/: Device type 01 148.5 mW Device type 02 170.5 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) +175C 1.4 Recommende

11、d operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (VIH) . 2.0 V dc _ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance

12、 and affect reliability. 2/ Unless otherwise noted, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C to +125C. Unused inputs must be held high or low. 4/ Maximum power dissipation is

13、defined as VCCx ICCand must withstand the added PDdue to short-circuit test, e.g., IO. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83020 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL

14、G SHEET 3 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions. - continued. Maximum low level input voltage (VIL): TC= +125C. 0.7 V dc TC= -55C . 0.8 V dc TC= +25C. 0.8 V dc Case operating temperature range (TC) -55C to +125C Normalized fanout (each output): At low logic level 10 maximum At h

15、igh logic level. 20 maximum Minimum width of clock pulse (tp(clk): Device type 02 at +25C. 14 ns at -55C and +125C 16.5 ns Minimum width of Enable pulse (tp(Enable): Device type 01 . 12 ns Minimum setup time before clock (tsetup): Device type 02 . 10 ns Minimum hold time after clock (thold): Device

16、type 02 . 4 ns Minimum setup time before Enable (tsetup): Device type 01 . 10 ns Minimum hold time after Enable (thold): Device type 01 . 7 ns 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this dra

17、wing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-8

18、83 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http

19、:/assist.daps.dla.mil;quicksearch/ or www.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

20、this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83020 DEF

21、ENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 4 DSCC FORM 2234 APR 97 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built

22、to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying

23、 activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described

24、 herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.

25、2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 2. 3.2.4 Logic diagram(s). The logic diagram(s) shall be

26、 as specified on figure 3. 3.2.5 Switching waveform(s) and test circuit. The switching waveform(s) and test circuit shall be as specified on figure 4. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I

27、 and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-

28、38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The complianc

29、e indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supp

30、ly in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A cert

31、ificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSC

32、Cs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without licens

33、e from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83020 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. 1/ Conditions Limits Test Symbol -55C TC +125C Device Group A Unit unless otherwise speci

34、fied type subgroups Min Max Data input = 2.0 V, High level output VOHOC input 0.7 V , IOH= -0.4 mA All 1, 2, 3 2.5 V voltage VCC= 4.5 V, VIH= 2.0 V ILat: 2/ +125C = 0.7 V dc -55C = 0.8 V dc IOH = -1.0 mA 2.4 +25C = 0.8 V dc Data input = 0.7 V, OC input 0.7 V Low level output VOLVCC= 4.5 V, IOL= 12 m

35、A, VIH= 2.0 V All 1, 2, 3 0.4 V voltage VILat: 2/ +125C = 0.7 V -55C = 0.8 V +25C = 0.8 V Input clamp VICVCC= 4.5 V, IIN= -18 mA All 1, 2, 3 -1.5 V voltage Low level input IILVIN= 0.4 V, 01 1, 2, 3 -100 A current VCC= 5.5 V, All other inputs = 4.5 V 02 -200 High level input IIH1VCC= 5.5 V, VIN= 2.7

36、V, All 1, 2, 3 20 A current All other inputs = 0.0 V IIH2VCC= 5.5 V, VIN= 7.0 V, 0.1 mA All other inputs = 0.0 V Output current IOVCC= 5.5 V, All 1, 2, 3 -20 -112 mA OUT= 2.25 V 3/ Off-state output IOZHVCC= 5.5 V, VOUT= 2.7 V All 1, 2, 3 20 A current IOZLVCC= 5.5 V, VOUT= 0.4 V All 1, 2, 3 -20 A Sup

37、ply current, ICCHVIN 4.5 V, VCC= 5.5 V 01 1, 2, 3 16 mA outputs high 02 21 Supply current, ICCLVIN 0.4 V, VCC= 5.5 V 01 1, 2, 3 25 mA outputs low 02 28 Supply current, ICCZ VCC= 5.5 V 01 1, 2, 3 27 mA outputs disabled 02 31 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction

38、or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83020 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. 1/ Conditions Limits Test Symbol -55C T

39、C +125C Device Group A Unit unless otherwise specified type subgroups Min Max Functional tests See 4.3.1c 4/ All 7, 8 Maximum clock frequency fMAXVCC= 4.5 V to 5.5 V, 02 9, 10, 11 30 MHz CL= 50 pF 10%, Propagation delay time, tPLH1R1= 500 5%, 5/ 02 9, 10, 11 3 14 ns CLK to Q R2= 500 5%, tPHL1 See fi

40、gure 4 02 9, 10, 11 5 17 ns Propagation delay time, D to Q tPLH201 9, 10, 11 2 14 ns tPHL2 01 9, 10, 11 1 17 ns Propagation delay time, G to Q tPLH301 9, 10, 11 6 26 ns tPHL3 01 9, 10, 11 1 23 ns Enable time, from tPZH01 9, 10, 11 3 18.5 ns OC to Q 02 3 18 tPZL01 9, 10, 11 3 20.5 ns 02 5 21 Disable

41、time, from tPHZ01 9, 10, 11 2 13.5 ns OC to Q 02 1 11 tPLZ01 9, 10, 11 2 20 ns 02 2 19 1/ Unused inputs that do not directly control the pin under test must be put 2.5 V or 0.4 V, and shall not exceed 5.5 V or go less than 0.0 V. No inputs shall be floated. 2/ All outputs must be tested. In the case

42、 where only one input at VILmaximum or VIHminimum produces the proper output state, the test must be performed with each input being selected as the VILmaximum or VIHminimum input. 3/ The output conditions have been chosen to produce a current that closely approximates one half of the true short-cir

43、cuit output current, IOS. Not more than one output will be tested at a time and the duration of the test condition shall not exceed one second. 4/ Functional tests shall be conducted at input test conditions of 0.0 V VIL VOLand VOH VIH VCC. 5/ The propagation delay limits are based on single output

44、switching. Unused inputs = 3.5 V or 0.3 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83020 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 7 DSCC FORM 2234 APR 97 Device type

45、01 FIGURE 1. Terminal connections (top views). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83020 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 8 DSCC FORM 2234 APR 97 Device t

46、ype 02 FIGURE 1. Terminal connections (top views) - Continued. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83020 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET 9 DSCC FORM 2234

47、 APR 97 Device type 01 Input Output OC G D Q L H H H L H L L L L X Q0H X X Z Device type 02 Input Output OC CLKD Q L H H L L L L L X Q0H X X Z L = Low level H = High level X = Irrelevant = Transition from low to high level Z = Off state of three-state output Q0= Level of Q before the steady-state input conditions were established FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 83020 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL G SHEET