DLA SMD-5962-77050 REV F-2012 MICROCIRCUIT LINEAR PHASE-LOCKED LOOP SYSTEM MONOLITHIC SILICON.pdf

《DLA SMD-5962-77050 REV F-2012 MICROCIRCUIT LINEAR PHASE-LOCKED LOOP SYSTEM MONOLITHIC SILICON.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-77050 REV F-2012 MICROCIRCUIT LINEAR PHASE-LOCKED LOOP SYSTEM MONOLITHIC SILICON.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes to military drawing format. Sole source Raytheon requires electrical changes in order to supply part. 87-10-02 R. P. EVANS B Changes in accordance with NOR 5962-R046-93. 93-01-19 M. A. FRYE C Changes in accordance with NOR 5962-R192-93. 9

2、3-07-23 M. A. FRYE D Updated drawing to reflect current requirements. Redrawn. - rrp 03-11-24 R. MONNIN E Make correction to the Marking paragraph 3.5. - ro 05-05-17 R. MONNIN F Update boilerplate to current MIL-PRF-38535 requirements. -rrp 12-02-14 C. SAFFLE CURRENT CAGE CODE 67268 THE ORIGINAL FIR

3、ST SHEET OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV F F F F F F F F F F OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 PMIC N/A PREPARED BY A. J. FOLEY DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVA

4、ILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY C.R. JACKSON APPROVED BY N. A. HAUCK MICROCIRCUIT, LINEAR, PHASE-LOCKED LOOP SYSTEM, MONOLITHIC SILICON DRAWING APPROVAL DATE 77-12-14 AMSC N/A REVISION LEVEL F SIZE A CAGE CODE 14933 77050 SHEET 1 OF 10 DSCC FORM

5、 2233 APR 97 5962-E189-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77050 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing descr

6、ibes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 77050 01 C A Drawing number Device type (see 1.2.1) Case outline (see 1.2

7、.2) Lead finish (see 1.2.3) 1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 2211 Phase-locked loop system 1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Desc

8、riptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maximum ratings. Supply voltage range 4.5 V to 20 V Input signal level . 3 V rms Storage temperature range . -65C to +150C

9、 Maximum power dissipation (PD) 750 mW 1/ Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Junction temperature (TJ) . +175C 1.4 Recommended operating conditions. Ambient operating temperature range (TA) -55C to +125C 1/ For TA +25C, derate

10、linearly 6 mW/C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77050 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 3 DSCC FORM 2234 APR 97 2. APPLICABLE DOCUMENTS 2.1 Government specific

11、ation, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38

12、535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Dr

13、awings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a

14、 conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual it

15、em requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transi

16、tional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make modifications to the requiremen

17、ts herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used. 3.2 Design, constructio

18、n, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outline. The case outline shall be in accordance with 1.2.2 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on fi

19、gure 1. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be

20、 the subgroups specified in table II. The electrical tests for each subgroup are described in table I. 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1

21、Certification/compliance mark. A compliance indicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow opti

22、on is used. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77050 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Tes

23、t Symbol Conditions +VCC= +12 V, RO= 30 k, CO= 0.033 F, Group A subgroups Device type Limits Unit -55C TA +125C unless otherwise specified Min Max OSCILLATOR Supply current ICCRO 10 k 1 01 9 mA 2, 3 12 Frequency accuracy fOSCDeviation from 4 01 3 % fO= 1/ROCO5, 6 8 Frequency 1/ stability temperature

24、 coefficient f / ( t(min) t(max) ) RO= 500 k, CO= 2.0 nF 4, 5, 6 01 50 ppm/C Power supply rejection ratio PSRR V+ = 12 1 V, see figure 3 4 01 0.01 0.5 %/V 5, 6 2.0 Upper frequency limit fOSC(max)RO= 8.2 k, CO= 400 pF 7 01 100 1 x 103kHz Lowest operating frequency fOSC(min)RO= 2 M, CO= 50 F 7 01 0.01

25、 Hz TIMING RESISTOR, ROSee figure 4 Operating range R01See figures 2 and 3 7 01 5 2000 k Recommended 1/ range R02See figures 2 and 3 7 01 15 100 k LOOP PHASE DETECTOR Peak output current IOPMeasured at pin 11 1 01 150 300 A 2, 3 100 350 Maximum swing VOReferenced to pin 10 1 01 4 V 2, 3 3.5 QUADRATU

26、RE PHASE DETECTOR Peak output current IOPMeasured at pin 3 1 01 100 750 A Maximum swing VO1 01 5 12 VPPSee footnote at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77050 DLA LAND AND MARITIME COLU

27、MBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics Continued. Test Symbol Conditions +VCC= +12 V, RO= 30 k, CO= 0.033 F, Group A subgroups Device type Limits Unit -55C TA +125C unless otherwise specified Min Max INPUT PREAMP Input sig

28、nal (voltage required to cause limiting) VIN(MAX)1 01 0.1 10 mV(rms) VOLTAGE COMPARATOR Voltage gain 1/ AVORL= 5.1 k 1 01 55 100 dB Output leakage current ILOUTVO= 12 V 1 01 0.001 0.1 A Output voltage low VOUT(min)IC= 1.2 mA 1 01 50 500 mV INTERNAL REFERENCE Voltage level VREFMeasured at pin 10 1 01

29、 4.9 5.7 V 2,3 4.75 5.85 1/ Guaranteed, if not tested to the limits specified herein. 3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance

30、 submitted to DLA Land and Maritime -VA prior to listing as an approved source of supply shall affirm that the manufacturers product meets the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38

31、535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of change to DLA Land and Maritime -VA shall be required for any change that affects this drawing. 3.9 Verification and review. DLA Land and Maritime, DLA Land and Mar

32、itimes agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. Provided by IHSNot for ResaleNo reproduction or networking permitted without li

33、cense from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77050 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 6 DSCC FORM 2234 APR 97 Device type 01 Case outline C Terminal number Terminal symbol 1 +VCC2 INPUT 3 LOCK DETECT FILTER 4 GND 5 LOCK DETECT OUTPUT Q 6 LOCK DETECT OUT

34、PUT Q 7 DATA OUTPUT 8 FSK COMP INPUT 9 NC 10 REF VOLTAGE OUT 11 LOOP DET OUT 12 TIMING RESISTOR 13 TIMING CAPACITOR 14 TIMING CAPACITOR NC = No connect FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRC

35、UIT DRAWING SIZE A 77050 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 7 DSCC FORM 2234 APR 97 FIGURE 2. Typical center frequency drift vs temperature. FIGURE 3. Typical fOvs power supply characteristics. Provided by IHSNot for ResaleNo reproduction or networking permitted w

36、ithout license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77050 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 8 DSCC FORM 2234 APR 97 FIGURE 4. VCO frequency vs timing resistor. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from

37、IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77050 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 9 DSCC FORM 2234 APR 97 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Scre

38、ening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A or C. The test circuit shall be maintained by

39、the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-

40、883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection sha

41、ll be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The following additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 8, 9, 10, and 11 in table I, method 5005 of MIL-STD-883 shall be o

42、mitted. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A or C. The test circuit shall be maintained by the manufacturer under document revision level c

43、ontrol and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration:

44、1,000 hours, except as permitted by method 1005 of MIL-STD-883. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 77050 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL F SHEET 10 DSCC FORM 2234 APR 97

45、 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - Final electrical test parameters (method 5004) 1*, 2, 3, 4, 5, 6 Group A test requirements (method 5005) 1, 2, 3, 4, 5

46、, 6, 7 Groups C and D end-point electrical parameters (method 5005) 1 * PDA applies to subgroup 1. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are in

47、tended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prepared specification or drawing. 6.3 Configuration contr

48、ol of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.4 Record of users. Military and industrial users shall inform DLA Land and Maritime when a system application requires configuration control and the applicable SMD to that system. DLA Land and Maritime will maintain a record of users and this list wil