DLA SMD-5962-76004 REV H-2005 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL POSITIVE NAND GATES MONOLITHIC SILICON《硅单片与非门正肖脱基小功率TTL数字微型电路》.pdf

《DLA SMD-5962-76004 REV H-2005 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL POSITIVE NAND GATES MONOLITHIC SILICON《硅单片与非门正肖脱基小功率TTL数字微型电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-76004 REV H-2005 MICROCIRCUIT DIGITAL LOW-POWER SCHOTTKY TTL POSITIVE NAND GATES MONOLITHIC SILICON《硅单片与非门正肖脱基小功率TTL数字微型电路》.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED D Device 01 inactive for new design. Add vendor, FSCM 04713. 85-09-17 N. A. Hauck E Remove vendor FSCM 18324. Delete minimum limits from propagation delay times. Hysteresis shall be guaranteed if not tested to specified limits. Editorial changes th

2、roughout. 86-01-23 N. A. Hauck F Added approved source of supply. Updated boilerplate. 95-03-24 M. L. Poelking G Update to reflect latest changes in format and requirements. Editorial changes throughout. - les 02-11-19 R. Monnin H Make correction to paragraph 3.5. - ro 05-11-15 R. Monnin CURRENT CAG

3、E CODE 67268 THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHET REV SHET REV STATUS REV H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY W. Q. Denick DEFENSE SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY R. F. Gonzales COLUMBUS, OHIO 43218-3

4、990 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY N. A. Hauck AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 76-03-18 MICROCIRCUIT, DIGITAL, LOW-POWER SCHOTTKY TTL, POSITIVE NAND GATES, MONOLITHIC SILICON AMSC N/A REVISION LEVEL H SIZE A CAG

5、E CODE 14933 76004 SHEET 1 OF 9 DSCC FORM 2233 APR 97 5962-E049-06 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM

6、2234 APR 97 1. SCOPE 1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A. 1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example: 76004 01 C X Drawing nu

7、mber Device type (see 1.2.1) Case outline(see 1.2.2) Lead finish(see 1.2.3)1.2.1 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 54LS132 Quadruple, 2-input Schmitt-Trigger positive NAND gates 1.2.2 Case outline(s). The case

8、outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style C GDIP1-T14 or CDIP2-T14 14 Dual-in-line D GDFP1-F14 or CDFP2-F14 14 Flat pack 1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A. 1.3 Absolute maxi

9、mum ratings. Supply voltage . -0.5 V dc to +7.0 V dc Input voltage range -1.5 V dc at -18 mA to +5.5 V dc Storage temperature range -65C to +150C Maximum power dissipation (PD) 1/ 77 mW Lead temperature (soldering, 10 seconds) +300C Thermal resistance, junction-to-case (JC) . See MIL-STD-1835 Juncti

10、on temperature (TJ) +175C 1.4 Recommended operating conditions. Supply voltage range (VCC) . 4.5 V dc minimum to 5.5 V dc maximum Minimum high level input voltage (VIH) 1.9 V dc Maximum low level input voltage (VIL) . 0.5 V dc Case operating temperature range (TC) -55C to +125C _ 1/ Must withstand t

11、he added PDdue to short circuit test; (e.g., IOS). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 2. A

12、PPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEP

13、ARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-

14、HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or http:/assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, P

15、hiladelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has

16、been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer Listing (QML) certified a

17、nd qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity approval in accordance with MIL-PRF-38535. This QML flow as documented in th

18、e Quality Management (QM) plan may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These modifications shall not affect the PIN as described herein. A “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 is require

19、d to identify when the QML flow option is used. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535, appendix A and herein. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein. 3.2.2 T

20、erminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logic diagram. The logic diagram shall be as specified on figure 3. 3.3 Electrical performance characteristics. Unless otherwise specified here

21、in, the electrical performance characteristics are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are descr

22、ibed in table I. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 TABLE I. Electrical performance charac

23、teristics. Test Symbol Conditions -55C TC +125C unless otherwise specified Group A subgroupsDevice type Limits Unit Min Max High level output voltage VOH VCC= 4.5 V, IOH= -400 A, VIN= 0.5 V or 1.9 V 1, 2, 3 All 2.5 V Low level output voltage VOL VCC= 4.5 V, IOL= 4 mA, VIN= 0.5 V or 1.9 V 1, 2, 3 All

24、 0.4 V Input clamp voltage VIC VCC= 4.5 V, IIN= -18 mA, TC= +25C 1 All -1.5 V High level input current IIH1 VCC= 5.5 V, VIH= 2.7 V 1, 2, 3 All 20 A IIH2 VCC= 5.5 V, VIH= 5.5 V 1, 2, 3 All 100 A Low level input current IIL VCC= 5.5 V, VIL= 0.4 V 1, 2, 3 All -400 A Short-circuit output current IOS VCC

25、= 5.5 V 1/ 1, 2, 3 All -6 -130 mA Supply current ICCHVCC= 5.5 V, VIL= 0 V 1, 2, 3 All 11 mA ICCLVCC= 5.5 V, VIH= 5.5 V 1, 2, 3 All 14 mA Positive going threshold voltage VT+ VCC= 5.0 V 1, 2, 3 All 1.4 1.9 V Negative going threshold voltage VT- VCC= 5.0 V 1, 2, 3 All 0.5 1.0 V Hysteresis 2/ (VT+ - VT

26、-) VCC= 5.0 V 1, 2, 3 All 0.4 V Functional tests See 4.3.1c 7 All tPHL9 All 22 ns VCC= 5.0 V, RL= 2 k 5% CL= 15 pF 10% 10, 11 All 31 ns 9 27 Propagation delay time, high-to-low-level, 3/ CL= 50 pF 10% 10, 11 All 38 ns tPLH9 All 22 ns CL= 15 pF 10% 10, 11 All 31 ns 9 27 Propagation delay time, low-to

27、-high-level, 3/ CL= 50 pF 10% 10, 11 All 38 ns 1/ Not more than one output should be shorted at a time, and the duration of the short-circuit condition should not exceed one second. 2/ Hysteresis, if not tested, shall be guaranteed to the specified limits. 3/ Propagation delay time testing may be pe

28、rformed using either CL= 15 pF or CL= 50 pF. However, the manufacturer must certify and guarantee that the microcircuits meet the switching test limits specified for a 50 pF load. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT

29、DRAWING SIZE A 76004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 5 DSCC FORM 2234 APR 97 Device type 01 Case outlines C, D Terminal number Terminal symbols 1 1A 2 1B 3 1Y 4 2A 5 2B 6 2Y 7 GND 8 3Y 9 3A 10 3B 11 4Y 12 4A 13 4B 14 VCCPositive logic: Y = AB FIGURE 1.

30、 Terminal connections. Truth table each gate INPUTS OUTPUT A B Y L L H H L H L H H H H L H = High level. L = Low level. FIGURE 2. Truth table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76004 DEFENSE SUPPLY C

31、ENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 6 DSCC FORM 2234 APR 97 FIGURE 3. Logic diagram. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO

32、43218-3990 REVISION LEVEL H SHEET 7 DSCC FORM 2234 APR 97 3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. 3.5.1 Certification/compliance mark. A compliance i

33、ndicator “C” shall be marked on all non-JAN devices built in compliance to MIL-PRF-38535, appendix A. The compliance indicator “C” shall be replaced with a “Q“ or “QML“ certification mark in accordance with MIL-PRF-38535 to identify when the QML flow option is used. 3.6 Certificate of compliance. A

34、certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply shall affirm that the manufacturers product meet

35、s the requirements of MIL-PRF-38535, appendix A and the requirements herein. 3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change. Notification of c

36、hange to DSCC-VA shall be required for any change that affects this drawing. 3.9 Verification and review. DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore

37、 at the option of the reviewer. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quali

38、ty conformance inspection. The following additional criteria shall apply: a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acqu

39、iring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA= +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table

40、 II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD-883 including groups A, B, C, and D inspections. The follow

41、ing additional criteria shall apply. 4.3.1 Group A inspection. a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, and 8 in table I, method 5005 of MIL-STD-883 shall be omitted. c. Subgroup 7 shall include verification of the truth table. Provided by IHSNot for ResaleNo reproduc

42、tion or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 8 DSCC FORM 2234 APR 97 TABLE II. Electrical test requirements. MIL-STD-883 test requirements Subgroups (in accordance

43、with MIL-STD-883, method 5005, table I) Interim electrical parameters (method 5004) - Final electrical test parameters (method 5004) 1*,2,3,9 Group A test requirements (method 5005) 1,2,3,7,9 Groups C and D end-point electrical parameters (method 5005) 1,2,3,10*,11* * PDA applies to subgroup 1. * Su

44、bgroups 10 and 11, if not tested, shall be guaranteed to the specified limits in table I. 4.3.2 Groups C and D inspections. a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test conditions, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D.

45、 The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the in

46、tent specified in method 1005 of MIL-STD-883. (2) TA= +125C, minimum. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A. 6. NOTES 6.1 Intende

47、d use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-prep

48、ared specification or drawing. 6.3 Configuration control of SMDs. All proposed changes to existing SMDs will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 76004 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 9 DSCC FORM 2234 APR 97 6.4 Record of users. Military and