DLA DSCC-VID-V62 14604-2013 MICROCIRCUIT DIGITAL DUAL BUS BUFFER GATE WITH 3 STATE OUTPUTS MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE APPROVED Prepared in accordance with ASME Y14.24 Vendor item drawing REV PAGE REV PAGE REV STATUS OF PAGES REV PAGE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil/ Or
2、iginal date of drawing YY-MM-DD CHECKED BY RAJESH PITHADIA TITLE MICROCIRCUIT, DIGITAL, DUAL BUS BUFFER GATE WITH 3 STATE OUTPUTS, MONOLITHIC SILICON 13-12-18 APPROVED BY CHARLES F. SAFFLE SIZE A CODE IDENT. NO. 16236 DWG NO. V62/14604 REV PAGE 1 OF 14 AMSC N/A 5962-V015-14 Provided by IHSNot for Re
3、saleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/14604 REV PAGE 2 1. SCOPE 1.1 Scope. This drawing documents the general requirements of a high performance dual bus buffer gate with 3 state outputs m
4、icrocircuit, with an operating temperature range of -55C to +125C. 1.2 Vendor Item Drawing Administrative Control Number. The manufacturers PIN is the item of identification. The vendor item drawing establishes an administrative control number for identifying the item on the engineering documentatio
5、n: V62/14604 - 01 X E Drawing Device type Case outline Lead finish number (See 1.2.1) (See 1.2.2) (See 1.2.3) 1.2.1 Device type(s). Device type Generic Circuit function 01 SN74LVC2G126-EP Dual bus buffer gate with 3 state outputs 1.2.2 Case outline(s). The case outline(s) are as specified herein. Ou
6、tline letter Number of pins JEDEC PUB 95 Package style X 8 MO-187-CA Plastic small outline 1.2.3 Lead finishes. The lead finishes are as specified below or other lead finishes as provided by the device manufacturer: Finish designator Material A Hot solder dip B Tin-lead plate C Gold plate D Palladiu
7、m E Gold flash palladium Z Other Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/14604 REV PAGE 3 1.3 Absolute maximum ratings. 1/ Supply voltage range (VCC) . -0.5 V to 6.5
8、 V Input voltage range (VI) -0.5 V to 6.5 V 2/ Voltage range applied to any output in the high impedance or power off state (VO) -0.5 V to 6.5 V 2/ Voltage range applied to any output in the high or low state (VO) -0.5 V to VCC+ 0.5 V 2/ 3/ Input clamp current (IIK) (VI 0) -50 mA maximum Output clam
9、p current (IOK) (VO 0) . -50 mA maximum Continuous output current 50 mA maximum Continuous current through VCCor GND . 100 mA maximum Absolute maximum junction temperature range (TJ) -55C to +150C Storage temperature range (TSTG) -65C to +150C 1.4 Recommended operating conditions. 4/ 5/ Supply volta
10、ge range (VCC) Operating . 1.65 V to 5.5 V Data retention only . 1.5 V minimum High level input voltage (VIH): VCC= 1.65 V to 1.95 V 0.65 V x VCCminimum VCC= 2.3 V to 2.7 V 1.7 V minimum VCC= 3 V to 3.6 V . 2 V minimum VCC= 4.5 V to 5.5 V 0.7 V x VCCminimum Low level input voltage (VIL): VCC= 1.65 V
11、 to 1.95 V 0.35 V x VCCmaximum VCC= 2.3 V to 2.7 V 0.7 V maximum VCC= 3 V to 3.6 V . 0.8 V maximum VCC= 4.5 V to 5.5 V 0.3 V x VCCmaximum Input voltage range (VI) 0 V to 5.5 V Output voltage range (VO): High or low state 0 V to VCC3 - state 0 V to 5.5 V 1/ Stresses beyond those listed under “absolut
12、e maximum rating” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extende
13、d periods may affect device reliability. 2/ The input negative voltage and output voltage ratings may be exceeded if the input and output clamp current ratings are observed. 3/ The value of VCCis provided in the recommended operating conditions table. 4/ All unused inputs of the device must be held
14、at VCCor GND to ensure proper device operation. 5/ Use of this product beyond the manufacturers design rules or stated parameters is done at the users risk. The manufacturer and/or distributor maintain no responsibility or liability for product used beyond the stated limits. Provided by IHSNot for R
15、esaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/14604 REV PAGE 4 1.4 Recommended operating conditions - continued. 4/ 5/ High level output current (IOH): VCC= 1.65 V . -4 mA maximum VCC= 2.3 V -8 m
16、A maximum VCC= 3 V . -16 mA maximum -24 mA maximum VCC= 4.5 V -32 mA maximum Low level output current (IOL): VCC= 1.65 V . 4 mA maximum VCC= 2.3 V 8 mA maximum VCC= 3 V . 16 mA maximum 24 mA maximum VCC= 4.5 V 32 mA maximum Input transition rise or fall rate (t/V): VCC= 1.8 V 0.15 V, 2.5 V 0.2 V . 2
17、0 ns/V maximum VCC= 3.3 V 0.3 V . 10 ns/V maximum VCC= 5 V 0.5 V 5 ns/V maximum Operating virtual junction temperature range (TJ) -55C to +125C 1.5 Thermal characteristics. Thermal metric Symbol Case X Unit Thermal resistance, junction-to-ambient 6/ JA204.3 C/W Thermal resistance, junction-to-case (
18、top) 7/ JC(TOP)78 C/W Thermal resistance, junction-to-board 8/ JB83 C/W Characterization parameter, junction-to-top 9/ JT7.6 C/W Characterization parameter, junction-to-board 10/ JB82.6 C/W _ 6/ The thermal resistance, junction-to-ambient under natural convection is obtained in a simulation on a JED
19、EC standard, high-K board, as specified in JESD51-7, in an environment described in JESD51-2a. 7/ The thermal resistance, junction-to-case (top) is obtained by simulating a cold plate test on the package top. No specific JEDEC standard test exists, but a close description can be found in the ANSI SE
20、MI standard G30-88. 8/ The thermal resistance, junction-to-board is obtained by simulating in an environment with a ring cold plate fixture to control the printed circuit board (PCB) temperature, as described in JESD51-8. 9/ Characterization parameter, junction-to-top (JT) estimates the junction tem
21、perature of a device in a real system and is extracted from the simulation data for obtaining JA, using a procedure described in JESD51-2a (sections 6 and 7). 10/ Characterization parameter, junction-to-board (JB) estimates the junction temperature of a device in a real system and is extracted from
22、the simulation data for obtaining JA, using a procedure described in JESD51-2a (sections 6 and 7). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DLA LAND AND MARITIME COLUMBUS, OHIO SIZE A CODE IDENT NO. 16236 DWG NO. V62/14604 REV PAGE 5 2. APPLIC
23、ABLE DOCUMENTS JEDEC Solid State Technology Association EIA/JESD 51-2a - Integrated Circuits Thermal Test Method Environment Conditions Natural Convection (Still Air) EIA/JEDEC 51-7 - High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages EIA/JESD 51-8 - Integrated Circuits
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