DLA DSCC-DWG-88013 REV G-2009 DELAY LINES PASSIVE 3-PIN SIP.pdf
《DLA DSCC-DWG-88013 REV G-2009 DELAY LINES PASSIVE 3-PIN SIP.pdf》由会员分享,可在线阅读,更多相关《DLA DSCC-DWG-88013 REV G-2009 DELAY LINES PASSIVE 3-PIN SIP.pdf(9页珍藏版)》请在麦多课文档分享上搜索。
1、 REVISIONS LTR DESCRIPTION DATE APPROVED A Added two suggested sources of supply. Editorial changes throughout. 30 Aug 1988 Randy Larson B Relocated pin markings on figure 1. Changed 3.27. Added 3.28. Editorial changes throughout. 27 Sep 1990 Randy Larson C Changed 3.12. Changed several dimensions a
2、nd added standoffs. Added footnotes 4 and 5 on figure 1. Editorial changes throughout. 7 Oct 1991 D. Moore D Added note 6 to figure 1. Added vendor 22519 to 6.4. Editorial changes throughout. 17 Dec 1992 D. Moore E Added vendor 50965 to 6.4. Editorial changes throughout. 1 Oct 1999 James A. Crum F U
3、pdated references, sources of supply, and editorial corrections. 1 July 2005 Kendall A. Cottongim G Incorporate boilerplate updates, update approved sources of supply and incorporate pure tin prohibition guidance. 22 Dec 2009 Michael A. Radecki Prepared in accordance with ASME Y14.100 Source Control
4、 drawing REV STATUS OF PAGES REV G G G G G G G G G PAGES 1 2 3 4 5 6 7 8 9 PMIC N/A PREPARED BY James B. Walker Jr DESIGN ACTIVITY DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OH 45444-5000 Original date of drawing: 16 Dec 1987 CHECKED BY Dan McGrath TITLE DELAY LINES, PASSIVE, 3-PIN, SIP APPROVED BY R
5、andy Larson SIZE A CODE IDENT. NO. 14933 DWG NO. 88013 REV G PAGE 1 OF 9 AMSC N/A 5999-E220 CURRENT DESIGN ACTIVITY CAGE CODE 037Z3 DEFENSE LOGISTICS AGENCY DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 Provided by IHSNot for ResaleNo reproduction or networking permitted without license f
6、rom IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88013 REV G PAGE 2 1. SCOPE 1.1 Scope. This drawing describes the requirements for a family of 3-pin, single in-line package, passive delay lines. 1.2 Part or Identifying Number (PIN). The complete PIN sha
7、ll be as follows: 88013 -001 | | | | Drawing Dash number number (see table I) 2. APPLICABLE DOCUMENTS 2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include documents cited in other sections of this specification or re
8、commended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents in sections 3 and 4 of this specification, whether or not they are listed. 2.2 Gover
9、nment documents. 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT O
10、F DEFENSE SPECIFICATIONS MIL-STD-31000 - Technical Data Packages. MIL-DTL-19491 - Semiconductor Devices, Packaging of. MIL-PRF-55681 - Capacitor, Chip, Multiple Layer, Fixed, Ceramic Dielectric, Established Reliability and Non-Established Reliability, General Specification for. MIL-PRF-83531 - Delay
11、 Lines, Passive, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-202 - Test Methods for Electronic and Electrical Component Parts. MIL-STD-1285 - Marking of Electrical and Electronic Parts. DEPARTMENT OF DEFENSE HANDBOOK MIL-HDBK-454 - General Guidelines for Electronic Equipment.
12、(Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ of from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a confl
13、ict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. Provided by IHSNot for ResaleNo reproduction or networking p
14、ermitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO SIZE A CODE IDENT NO. 14933 DWG NO. 88013 REV G PAGE 3 3. REQUIREMENTS 3.1 Interface and physical dimensions. See figure 1. 3.2 Item requirements. This drawing shall be interpreted in accordance with MIL-STD-31000.
15、3.3 Case material. Case material shall be nonmetallic, cast epoxy encapsulated, and be in accordance with MIL-PRF-83531. 3.4 Terminals. Terminal material and finish shall be in accordance with MIL-PRF-83531. 3.5 Temperature coefficient of delay. The temperature coefficient of delay shall be 70 ppm/C
16、 maximum. 3.6 Capacitors. Chip capacitors shall be items that have been tested and supplied in accordance with MIL-PRF-55681, when possible. 3.7 Impedance. See table I. 3.8 Total delay time. See table I. 3.9 Rise time. See table I. 3.10 Pulse attenuation. See table I. 3.11 Distortion. The maximum di
17、stortion shall be 10 percent on the output pulse, when measured with the input pulse rise time set to 5 1 nanoseconds. The rise time shall be measured from 10 percent to 90 percent of the pulse amplitude. 3.12 Thermal shock. Method 107, MIL-STD-202, test condition B, 5 minutes at temperature extreme
18、s and in accordance with MIL-PRF-83531. 3.13 Dielectric withstanding voltage at reduced barometric pressure. In accordance with MIL-PRF-83531, except that test condition D shall apply. 3.14 Insulation resistance. Insulation resistance shall be 10,000 megohms (minimum) at 50 V dc, ambient room temper
19、ature, between input and ground terminals. Insulation resistance shall be 10,000 megohms minimum at 500 V dc, ambient room temperature, when measured between all terminals tied together and the case. 3.15 Sealing. As specified in MIL-PRF-83531. 3.16 Terminal strength. Method 211a, MIL-STD-202, test
20、condition C and in accordance with MIL-PRF-83531, applied force 5 pounds. 3.17 Vibration. Method 204, test condition B, MIL-STD-202 and in accordance with MIL-PRF-83531. 3.18 Shock. Method 213, MIL-STD-202, test condition I and in accordance with MIL-PRF-83531. 3.19 Immersion. Method 104, test condi
21、tion A, MIL-STD-202 and in accordance with MIL-PRF-83531. Measurement ;insulation resistance. 3.20 Moisture resistance. As specified in MIL-PRF-83531. 3.21 Solderability. As specified in MIL-PRF-83531. Internal soldering should be in accordance with Guideline 5 of MIL-HDBK-454. 3.22 Resistance to so
22、lvents. Method 215, MIL-STD-202 and in accordance with MIL-PRF-83531. 3.23 Operating temperature. -55C to +125C. 3.24 Storage temperature. -65C to +130C. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-DEFENSE ELECTRONICS SUPPLY CENTER DAYTON, OHIO S
23、IZE A CODE IDENT NO. 14933 DWG NO. 88013 REV G PAGE 4 3.25 Altitude. Maximum altitude shall be 100,00 feet (operating and non-operating). 3.26 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable materials should be used to the maximum exte
24、nt possible, provided that the material meets or exceeds the operational and maintenance requirements, and promotes economically advantageous life cycle costs. 3.27 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on the MIL-PRF-835
- 1.请仔细阅读文档,确保文档完整性,对于不预览、不比对内容而直接下载带来的问题本站不予受理。
- 2.下载的文档,不会出现我们的网址水印。
- 3、该文档所得收入(下载+内容+预览)归上传者、原创作者;如果您是本文档原作者,请点此认领!既往收益都归您。
下载文档到电脑,查找使用更方便
10000 积分 0人已下载
下载 | 加入VIP,交流精品资源 |
- 配套讲稿:
如PPT文件的首页显示word图标,表示该PPT已包含配套word讲稿。双击word图标可打开word文档。
- 特殊限制:
部分文档作品中含有的国旗、国徽等图片,仅作为作品整体效果示例展示,禁止商用。设计者仅对作品中独创性部分享有著作权。
- 关 键 词:
- DLADSCCDWG88013REVG2009DELAYLINESPASSIVE3PINSIPPDF
链接地址:http://www.mydoc123.com/p-688880.html