DLA A-A-55164-1995 CONNECTORS ELECTRICAL SOCKETS SINGLE IN LINE MEMORY MODULE SINGLE AND DUAL ANGLED LOW PROFILE TYPE 30 OR 60 CONTACTS《30或60触点成角薄断面型单列直插存贮模块插座电气连接器》.pdf
《DLA A-A-55164-1995 CONNECTORS ELECTRICAL SOCKETS SINGLE IN LINE MEMORY MODULE SINGLE AND DUAL ANGLED LOW PROFILE TYPE 30 OR 60 CONTACTS《30或60触点成角薄断面型单列直插存贮模块插座电气连接器》.pdf》由会员分享,可在线阅读,更多相关《DLA A-A-55164-1995 CONNECTORS ELECTRICAL SOCKETS SINGLE IN LINE MEMORY MODULE SINGLE AND DUAL ANGLED LOW PROFILE TYPE 30 OR 60 CONTACTS《30或60触点成角薄断面型单列直插存贮模块插座电气连接器》.pdf(5页珍藏版)》请在麦多课文档分享上搜索。
1、A-A-5.5164 9999974 OLb8l107 93T H METRICI A-A-55164 23 June 1995 COHMERCIAL ITEM DESCRIPTION CONNECTORS, ELECTRICAL, SOCKETS SINGLE IN LINE MEMORY MODULE, SINGLE AND DUAL, ANGLED LOW PROFILE TYPE, 30 OR 60 CONTACTS The General Services Administration has authorized the use of this comnercial item de
2、scription (CID), for all federal agencies. 1. SCOPE. This CID covers the general requirements for a single or dual, angled low profile inline memory module connector with 30 or 60 contacts. This connector provides the user with convenient low insertion and easy extraction of high density memory modu
3、les which conform to JEDEC specifications for SIMM modules. Connectors covered by this CID are intended for comnercial/industrial applications. 2. CLASSIFICATION. This CID uses a classification system which is included in the Part or Identification Nunber (PIN) as shown in the following example (see
4、 7.1). AA55164 o1 S I I I l CID NUMBER CONTACT PLATING S - SINGLE ROW TYPE D - DUAL ROW - .500 3. Salient characteristics. 3.1 Design, construction and dimensions. Design, construction and dimensions shall be as specified in accordance with figure 1, table I and shall accwrnodate JEDEC configured SI
5、MM memory modules. 3.2 Contacts. Code G contacts (dash nunber -01) are formed of a high conductivity, high strength copper alloy with gold over nickel plating in the contact area. Code T contacts (dash nunber -02) are formed of a high conductivity, high strength copper alloy with tin/lead plating ov
6、er all areas. 3.3 Connector housing. Connector housings are made from high temperature thermoplastic material capable of withstanding temperatures of vapor phase, infrared, or wave type soldering assembly processes. 3.4 Contact stress. The connector design provides anti-stress protection for contact
7、s. 3.5 Misconnection. Built in polarization eliminates misconnection of SIMM module to connector. Additional polarization feature to align socket to printed wiring board for simplification of assembly. 3.6 Dielectric withstanding voltage. When tested at 1,000 V ac, there shall be no breakdown of ins
8、ulation or leakage current in excess of 5 ITA between adjacent contacts for one minute. 3.7 Operating temperature. The operating temperature range shall be from -55C to +105“C. Beneficial comnents, recomnendations, additions, deletions clarifications, etc. and any other data which may improve this d
9、ocunent should be sent to: Defense Electronics Supply Center, ATTN: DESC-ELDI, 1507 Wilmington Pike, Dayton, OH 45444-5765, or telephone (513) 296-5391, or facsimile (FAX) (513) 296-8868. AMSC N/A DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. FSC 5935 Provided by
10、IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-A-A-55Lb4 m 9999974 OLb8LO8 876 m A-A-55164 TABLE I. Dimensions. 2 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-A-A-55LbY m 9999974 0368309 702 m A-A-55164 SINGL
11、E DUAL FIGURE 1. Printed board layout. 3.8 Vibration. The connector, or hardware when assembled to the connector, shall exhibit no evidence of breaking, cracking, or loosening of parts when subject to vibration of 10-55-10 Hz traversed in 1 minute at .O6 inch total excursion for 2 hours in each of 3
12、 mutually perpendicular planes. 3.9 Physical shock. The connector or hardware when assembled to the connector, shall exhibit no evidence of breaking, cracking, or loosening of parts when subject to 50 gs saw-tooth wave shock of 11 milliseconds duration, 3 shocks in each direction applied along the 3
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