BS EN 61967-1-2002 Integrated circuits - Measurement of electromagnetic emissions 150 kHz to 1 GHz - General conditions and definitions《集成电路 150kHz-1GHz电磁辐射的测量 一般条件和定义》.pdf

《BS EN 61967-1-2002 Integrated circuits - Measurement of electromagnetic emissions 150 kHz to 1 GHz - General conditions and definitions《集成电路 150kHz-1GHz电磁辐射的测量 一般条件和定义》.pdf》由会员分享，可在线阅读，更多相关《BS EN 61967-1-2002 Integrated circuits - Measurement of electromagnetic emissions 150 kHz to 1 GHz - General conditions and definitions《集成电路 150kHz-1GHz电磁辐射的测量 一般条件和定义》.pdf（28页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD BS EN 61967-1: 2002 IEC 61967-1: 2002 Integrated circuits Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 1: General conditions and definitions The European Standard EN 61967-1:2002 has the status of a British Standard ICS 31.200 NO COPYING WITHOUT BSI PERMISSION EXC

2、EPT AS PERMITTED BY COPYRIGHT LAWBS EN 61967-1:2002 This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 2 July 2002 BSI 2 July 2002 ISBN 0 580

3、 39890 0 National foreword This British Standard is the official English language version of EN 61967-1:2002. It is identical with IEC 61967-1:2002. The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors, which has the responsibility to: A list of organiz

4、ations represented on this committee can be obtained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system

5、to the other, publications may contain identifiers from both systems. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”

6、, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer

7、 immunity from legal obligations. aid enquirers to understand the text; present to the responsible European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the U

8、K. Summary of pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 24, an inside back cover and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date

9、CommentsEUROPEAN STANDARD EN 61967-1 NORME EUROPENNE EUROPISCHE NORM June 2002 CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2

10、002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 61967-1:2002 E ICS 31.200 English version Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz Part 1: General conditions and definitions (IEC 61967-1

11、:2002) Circuits intgrs - Mesure des missions lectromagntiques, 150 kHz 1 GHz Partie 1: Conditions gnrales et dfinitions (CEI 61967-1:2002) Integrierte Schaltungen - Messung von elektromagnetischen Aussendungen im Frequenzbereich von 150 kHz bis 1 GHz Teil 1: Allgemeine Bedingungen und Definitionen (

12、IEC 61967-1:2002) This European Standard was approved by CENELEC on 2002-05-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists an

13、d bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the respon

14、sibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Greece, Iceland, Ireland, Ital

15、y, Luxembourg, Malta, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom.Foreword The text of document 47A/632/FDIS, future edition 1 of IEC 61967-1, prepared by SC 47A, Integrated circuits, of IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote

16、 and was approved by CENELEC as EN 61967-1 on 2002-05-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2003-02-01 latest date by which the national standards conflicting wi

17、th the EN have to be withdrawn (dow) 2005-05-01 Annexes designated “normative“ are part of the body of the standard. Annexes designated “informative“ are given for information only. In this standard, annex ZA is normative and annexes A, B and C are informative. Annex ZA has been added by CENELEC. _

18、Endorsement notice The text of the International Standard IEC 61967:2002 was approved by CENELEC as a European Standard without any modification. In the official version, for Bibliography, the following notes have to be added for the standards indicated: IEC 61000-4-3 NOTE Harmonized as EN 61000-4-3

19、:1996 (modified). IEC 61000-4-6 NOTE Harmonized as EN 61000-4-6:1996 (not modified). IEC 61967-4 NOTE Harmonized as EN 61967-4:2002 (not modified). _ 2egaP 2002:176916OSINE BSI2July2002 Page2 EN619671:2002 169-761 EI:C0022 3 CONTENTS 1 Scope.5 2 Normative references .5 3 Definitions 6 4 Test conditi

20、ons.9 4.1 General .9 4.2 Ambient conditions10 4.2.1 Ambient temperature .10 4.2.2 Ambient RF field strength 10 4.2.3 Other ambient conditions.10 4.2.4 IC stability over time10 5 Test equipment.10 5.1 General .10 5.2 Shielding.10 5.3 RF measuring instrument 10 5.3.1 Measuring receiver11 5.3.2 Spectru

21、m analyser.11 5.3.3 Other RBW for narrowband disturbances 11 5.3.4 Disturbance type, detector type and sweep speed .11 5.3.5 Video bandwidth12 5.3.6 Verification of calibration for the RF measuring instrument 12 5.4 Frequency range .12 5.5 Pre-amplifier or attenuator.12 5.6 System gain 12 5.7 Other

22、components.12 6 Test set-up.12 6.1 General .12 6.2 Test circuit board 13 6.3 IC pin loading13 6.4 Power supply requirements Test board power supply .13 6.5 IC specific considerations14 6.5.1 IC supply voltage.14 6.5.2 IC decoupling 14 6.5.3 Activity of IC14 6.5.4 Guidelines regarding IC operation .1

23、4 7 Test procedure .14 7.1 Ambient check.14 7.2 Operational check .14 7.3 Specific procedures.15 3egaP 2002:176916OSINE BSI2July2002 Page3 EN619671:2002 169-761 EI:C0022 4 8 Test report15 8.1 General .15 8.2 Ambient.15 8.3 Description of device.15 8.4 Description of set-up .15 8.5 Description of sof

24、tware15 8.6 Data presentation15 8.6.1 Graphical presentation 15 8.6.2 Software for data capture 15 8.6.3 Data processing 15 8.7 RF emission limits .15 8.8 Interpretation of results .16 8.8.1 Comparison between IC(s) using the same test method.16 8.8.2 Comparison between different test methods 16 8.8

25、.3 Correlation to module test methods .16 9 General basic test board specification 16 9.1 Board description mechanical.16 9.2 Board description electrical characteristics.16 9.3 Ground planes.17 9.4 Pins.17 9.4.1 DIL packages 17 9.4.2 SOP, PLCC, QFP packages.17 9.4.3 PGA, BGA packages .17 9.5 Via ty

26、pe.17 9.6 Via distance 18 9.7 Additional components 18 9.7.1 Supply decoupling .18 9.7.2 I/O load .18 Annex A (informative) Test method comparison20 Annex B (informative) Flow chart of an example counter test code .21 Annex C (informative) Prescription of a worst-case application software descriptio

27、n.22 Annex ZA (normative) Normative references to international publications with their corresponding European publications .24 Bibliography23 Figure 1 General basic test board 19 Figure B.1 Test code flow chart21 Table 1 Measuring receiver bands and RBW (resolution bandwidth) default settings11 Tab

28、le 2 Spectrum analyser bands and RBW default settings11 Table 3 IC pin loading recommendations .13 Table 4 Position of vias over the board 17 Table A.1 Test method comparison20 4egaP 2002:176916OSINE BSI2July2002 Page4 EN619671:2002 169-761 EI:C0022 5 INTEGRATED CIRCUITS MEASUREMENT OF ELECTROMAGNET

29、IC EMISSIONS, 150 kHz to 1 GHz Part 1: General conditions and definitions 1 Scope This part of IEC 61967 provides general information and definitions on measurement of conducted and radiated electromagnetic disturbances from integrated circuits. It also provides a description of measurement conditio

30、ns, test equipment and set-up as well as the test procedures and content of the test reports. A test method comparison table is included as annex A to assist in selecting the appropriate measurement method(s). The object of this standard is to describe general conditions in order to establish a unif

31、orm testing environment and obtain a quantitative measure of RF disturbances from integrated circuits (IC). Critical parameters that are expected to influence the test results are described. Deviations from this standard are noted explicitly in the individual test report. The measure- ment results c

32、an be used for comparison or other purposes. Measurement of the voltage and current of conducted RF emissions or radiated RF disturbances, coming from an integrated circuit under controlled conditions, yields information about the potential for RF disturbances in an application of the integrated cir

33、cuit. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60050(161), Inte

34、rnational Electrotechnical Vocabulary (IEV) Chapter 161: Electro- magnetic compatibility CISPR 16-1:1999, Specification for radio disturbance and immunity measuring apparatus and methods Part 1: Radio disturbance and immunity measuring apparatus CISPR 25:1995, Limits and methods of measurement of ra

35、dio disturbance characteristics for the protection of receivers used on board vehicles ANSI C63.2:1996, American Standard for Electromagnetic Noise and Field Strength Instrumentation, 10 Hz to 40 GHz Specifications 5egaP 2002:176916OSINE BSI2July2002 Page5 EN619671:2002 169-761 EI:C0022 6 3 Definiti

36、ons For the purpose of this part of IEC 61967, the following definitions, taken mostly from IEC 60050(161), apply. 3.1 artificial network AN agreed reference load impedance (simulated), presented to the EUT by networks (for example, extended power or communication lines) across which the RF disturba

37、nce voltage is measured and which isolates the apparatus from the power supply or loads in that frequency range IEV 161-04-05, modified 3.2 associated equipment transducers (for example, probes, networks and antennas) connected to a measuring receiver or test generator; also transducers (for example

38、, probes, networks, and antennas) which are used in the signal or disturbance transmission path between an EUT and measuring equipment or a (test-) signal generator 3.3 auto sweep fastest calibrated sweep which a spectrum analyser will automatically select based on start frequency, stop frequency, r

39、esolution bandwidth and video bandwidth 3.4 broadband emission emission which has a bandwidth greater than that of a particular measuring apparatus or receiver IEV 161-06-11, modified 3.5 common mode voltage asymmetrical voltage mean of the phasor voltages appearing between each conductor and a spec

40、ified reference, usually earth or frame IEV 161-04-09 3.6 common mode current in a cable having more than one conductor, including shields and screens, if any, the magnitude of the sum of the phasors representing the currents in each conductor IEV 161-04-39 3.7 conducted emissions transients and/or

41、other disturbances observed on the external terminals of a device during its normal operation 3.8 continuous disturbance RF disturbance with a duration of more than 200 ms at the IF-output of a measuring receiver, which causes a deflection on the meter of a measuring receiver in quasi-peak detection

42、 mode which does not decrease immediately IEV 161-02-11, modified 6egaP 2002:176916OSINE BSI2July2002 Page6 EN619671:2002 169-761 EI:C0022 7 3.9 device under test DUT device, equipment or system being evaluated NOTE As used in this standard, DUT refers to a semiconductor device being tested. 3.10 di

43、e shrink amount of shrink of the mask used to produce the integrated circuit (IC) expressed as a percentage or dimensions relative to the original artwork layout (drawn size) 3.11 differential mode current in a two-conductor cable, or for two particular conductors in a multi-conductor cable, half th

44、e magnitude of the difference of the phasors representing the currents in each conductor IEV 161-04-38 3.12 differential mode voltage voltage between any two of a specified set of active conductors IEV 161-04-08 3.13 discontinuous disturbance for counted clicks, disturbance with a duration of less t

45、han 200 ms at the IF-output of a measuring receiver, which causes a transient deflection on the meter of a measuring receiver in quasi-peak detection mode IEV 161-02-28, modified 3.14 electrically small PCB printed circuit board, whose dimension is smaller than /2, for example, 100 mm to 150 mm at 1

46、 GHz 3.15 electromagnetic compatibility EMC ability of an equipment or system to function satisfactorily in its electromagnetic environment without introducing intolerable electromagnetic disturbances to anything in that environment IEV 161-01-07 3.16 electromagnetic emission phenomenon by which ele

47、ctromagnetic energy emanates from a source 3.17 electromagnetic radiation radiated emissions 1. phenomena by which energy in the form of electromagnetic waves emanates from a source into space 2. energy transferred through space in the form of electromagnetic waves IEV 161-01-10 7egaP 2002:176916OSI

48、NE BSI2July2002 Page7 EN619671:2002 169-761 EI:C0022 8 3.18 emission limit (from a disturbing source) specified maximum emission level of a source of electromagnetic disturbance IEV 161-03-12 3.19 ground (reference) plane flat conductive surface whose potential is used as a common reference IEV 161-

49、04-36 3.20 lead frame supporting structure for the silicon die that interfaces the external pins to the die 3.21 measuring receiver receiver for the measurement of disturbances with different detectors NOTE The bandwidth of the receiver should be as specified in CISPR 16-1. 3.22 multi-chip module MCM integrated circuit whose elements are formed on or within two or more semiconduct