BS EN 60917-1-1999 Modular order for the development of mechanical structures for electronic equipment practices - Generic standard《电子设备机械结构研制用模数序列 通用标准》.pdf

《BS EN 60917-1-1999 Modular order for the development of mechanical structures for electronic equipment practices - Generic standard《电子设备机械结构研制用模数序列 通用标准》.pdf》由会员分享，可在线阅读，更多相关《BS EN 60917-1-1999 Modular order for the development of mechanical structures for electronic equipment practices - Generic standard《电子设备机械结构研制用模数序列 通用标准》.pdf（32页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD BS EN 60917-1:1999 IEC 60917-1: 1998 Incorporating Amendment No. 1 Modular order for the development of mechanical structures for electronic equipment practices Part 1: Generic standard The European Standard EN 60917-1:1998 with the incorporation of amendment A1:2000 has the status

2、of a British Standard ICS 31.240 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS EN 60917-1:1999 This British Standard, having been prepared under the direction of the Electrotechnical Sector Committee, was published under the authority of the Standards Committee and comes i

3、nto effect on 15 January 1999 BSI 18 January 2002 ISBN 0 580 30963 0 National foreword This British Standard is the English language version of EN 60917:1998, including amendment A1:2000. It is identical with IEC 60917-1:1998, including amendment 1:2000. It supersedes BS 7728:1994, BS EN 60917:1992

4、and BS EN 60917-0:1992 which will be withdrawn on 2001-07-01. The UK participation in its preparation was entrusted by Technical Committee EPL/48, Electromechanical components for electronic equipment, to Subcommittee EPL/48/4, Mechanical structures for electronic equipment, which has the responsibi

5、lity to: aid enquirers to understand the text; present to the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. A list o

6、f organizations represented on this subcommittee can be obtained on request to its secretary. The start and finish of text introduced or altered by amendment is indicated in the text by tags . Tags indicating changes to IEC text carry the number of the IEC amendment. For example, text altered by IEC

7、 amendment 1 is indicated by . From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period of time during the change over from one numbering system to the other, publications may contain identifiers

8、from both systems. Cross-references The British Standards which implement international or European publications referred to in this document may be found in the BSI Standards Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Find” facility of the

9、BSI Standards Electronic Catalogue. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. Summa

10、ry of pages This document comprises a front cover, an inside front cover, pages i and ii, the EN title page, pages 2 to 26, an inside back cover and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Amendments issued since publication Amd.

11、 No. Date Comments 13251 18 January 2002 See national forewordBS EN 60917-1:1999 BSI 18 January 2002 i Contents Page National foreword Inside front cover Foreword 2 Text of EN 60917-1 5ii blankEUROPEAN STANDARD NORME EUROPENNE EUROPISCHE NORM EN 60917-1 November 1998 +A1 August 2000 ICS 31.240 Super

12、sedes HD 550 S1:1989, EN 60917:1990 + A1:1994 and EN 60917-0:1992 English version Modular order for the development of mechanical structures for electronic equipment practices Part 1: Generic standard (includes amendment A1:2000) (IEC 60917-1:1998 +A1:2000) Ordre modulaire pour le dveloppement des s

13、tructures mcaniques pour les infrastructures lectroniques Partie 1: Norme gnrique (inclut lamendement A1:2000) (CEI 60917-1:1998 +A1:2000) Modulordnung fr die Entwicklung von Bauweisen fr elektronische Einrichtungen Teil 1: Fachgrundnorm (enthlt nderung A1:2000) (IEC 60917-1:1998 +A1:2000) This Euro

14、pean Standard was approved by CENELEC on1998-10-01. Amendment A1 was approved by CENELEC on 2000-06-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alterat

15、ion. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by tran

16、slation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, CzechRepublic, Denmark, Finland, France, Germany, Greece,

17、 Iceland, Ireland, Italy, Luxembourg, Netherlands, Norway, Portugal, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: ru

18、e de Stassart 35, B-1050 Brussels 1998 CENELEC All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 60917-1:1998 +A1:2000 EEN 60917-1:1999 BSI 18 January 2002 2 Foreword The text of document 48D/159/FDIS, future edition 1 of IEC 60917-1, prepare

19、d by SC 48D, Mechanical structures for electronic equipment, of IEC TC 48, Electromechanical components and mechanical structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 60917-1 on 1998-10-01. This European Standard supersedes HD 550

20、 S1:1989, EN 60917:1990 and its amendment A1:1994 and EN 60917-0:1992. The following dates were fixed: Annexes designated “normative” are part of the body of the standard. In this standard, Annex ZA is normative. Annex ZA has been added by CENELEC. Endorsement notice The text of the International St

21、andard IEC 60917-1:1998 was approved by CENELEC as a European Standard without any modification. Foreword to amendment A1 The text of document 48D/222/FDIS, future amendment 1 to IEC 60917-1:1998, prepared by SC 48D, Mechanical structures for electronic equipment, of IEC TC 48, Electromechanical com

22、ponents and mechanical structures for electronic equipment, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as amendment A1 to EN 60917-1:1998 on 2000-06-01. The following dates were fixed: Endorsement notice The text of amendment 1:2000 to the International Standard IEC 6

23、0917-1:1998 was approved by CENELEC as an amendment to the European Standard without any modification. latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 1999-07-01 latest date by which the national standards c

24、onflicting with the EN have to be withdrawn (dow) 2001-07-01 latest date by which the amendment has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2001-03-01 latest date by which the national standards conflicting with the amendment have

25、to be withdrawn (dow) 2003-06-01EN 60917-1:1999 BSI 18 January 2002 3 Contents Page Foreword 2 Introduction 5 1 Scope and object 5 2 Normative references 5 3 Terms, terminology and definitions 6 4 Fundamentals and background information 17 4.1 Structures of electronic equipment practices 17 4.2 Dime

26、nsional co-ordination with adjacent technical fields 17 4.3 Preparation of standards for new equipment practices 18 5 Modular order details 20 5.1 Modular grid 20 5.2 Pitches 21 5.3 Co-ordination dimensions 23 5.4 Illustration of the modular order 24 Annex ZA (normative) Normative references to inte

27、rnational publications with their corresponding European publications 25 Figure 1 8 Figure 2 8 Figure 3 9 Figure 4 9 Figure 5 10 Figure 6 10 Figure 7 11 Figure 8 11 Figure 9 12 Figure 10 12 Figure 11 13 Figure 17 13 Figure 18 14 Figure 19 14 Figure 20 14 Figure 21 15 Figure 22 15 Figure 23 16 Figure

28、 24 16 Figure 25 16 Page Figure 12 Structure levels of electronic equipment practice 17 Figure 13 Structure of equipment practice standards 19 Figure 14 Modular grid 20 Figure 15 Partitioning of co-ordination dimension C 0with the same mounting pitch mp 22 Figure 16 Examples of the application of th

29、e modular order. Pitches “p” are presented in the frames , see 5.2.1 24 Table 1 Publications containing standardized modular dimensions and/or related documents 18 Table 2 Co-ordination dimensions C i 234 blank BSI 18 January 2002EN 60917-1:1998 BSI 18 January 2002 5 Introduction The trend towards c

30、onstantly increasing functional integration and ever smaller volume and space requirements for electronic components and integrated circuits, as well as the advent of new manufacturing methods, automatic manufacturing and testing equipment and the use of Computer Aided Engineering (CAE) systems offe

31、r users considerable technical and economic advantages. In order to ensure that, when using newly developed components, manufacturing methods and CAE systems, the advantages can be fully exploited during planning, design, manufacture and testing, it is necessary for equipment practices to meet the f

32、ollowing requirements (see IEC Guide 103): arrangement of products with a minimum loss of area and space; dimensional interchangeability of products, e.g. regarding overall dimensions, mounting dimensions (fixing holes, cut-outs, etc.); dimensional compatibility and determination of interface dimens

33、ions of products which: are combined with other products, e.g. instruments, racks, panels and cabinets, etc.; are used in buildings that have been built in accordance with a modular system, e.g. column spacing, room height, door height, etc. An obstacle arises from the use of two systems of dimensio

34、ning (inch metre) that are not compatible with each other. The use of an interface between both dimensioning systems represents one way around this obstacle. The recommendation is: to use only one dimensioning system and to use SI units. The dimensions given in 5.3 of this standard have been taken f

35、rom system I of IEC Guide 103 in consideration with other documents on dimensional co-ordination. 1 Scope and object This International Standard relates to equipment practices. The modular order is applicable to the main structural dimensions of electronic equipment mounted in various installations

36、where dimensional interfaces have to be considered. It refers to basic design parameters and is not intended to be used for manufacturing tolerances or clearances. In addition, information on interfaces to other technical fields, on technology and advanced design aspects is included. This standard a

37、lso covers standard terms for parts and assemblies of mechanical structures for electronic equipment. This generic standard gives the definitions of a modular order for mechanical structures of electronic equipment and provides for dimensional compatibility at mechanical interfaces with related engi

38、neering applications, e.g. printed boards, components, instrumentation, furniture, rooms, buildings, etc. Furthermore, it supports the introduction and application of the modular order rules considering that: compatibility of interface dimensions is aimed at the electronic field on the basis of the

39、SI unit metre; technical and economic advantages can be achieved when using the rules. The terms in this standard should be used in all standards for mechanical structures of electronic equipment and in related technical documents. 2 Normative references The following normative documents contain pro

40、visions which, through reference in this text, constitute provisions of this International Standard. At the time of publication, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this International Standard are encouraged to invest

41、igate the possibility of applying the most recent editions of the normative documents indicated below. Members of IEC and ISO maintain registers of currently valid International Standards. IEC 60050(581):1978, International Electrotechnical Vocabulary (IEV) Chapter 581: Electromechanical components

42、for electronic equipmentEN 60917-1:1998 6 BSI 18 January 2002 IEC 60297-1:1986, Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 1: Panels and racks IEC 60297-2:1982, Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 2: Cabinets and pitches of rack struct

43、ures IEC 60297-3:1984, Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 3: Subracks and associated plug-in units IEC 60297-4:1995, Dimensions of mechanical structures of the 482,6 mm (19 in) series Part 4: Subracks and associated plug-in units Additional dimensions IEC 60473:1

44、974, Dimensions for panel-mounted indicating and recording electrical measuring instruments IEC 60629:1978, Standard sheets for a modular system (for installation accessories for use in domestic and similar installations) IEC 60668:1980, Dimensions of panel areas and cut-outs for panel and rack-moun

45、ted industrial-process measurement and control instruments IEC 60917-2:1992, Modular order for the development of mechanical structures for electronic equipment practices Part 2: Sectional specification Interface co-ordination dimensions for the 25 mm equipment practice IEC 60917-2-1:1993, Modular o

46、rder for the development of mechanical structures for electronic equipment practices Part 2: Sectional specification Interface co-ordination dimensions for the 25 mm equipment practice Section 1: Detail specification Dimensions for cabinets and racks IEC 60917-2-2:1994, Modular order for the develop

47、ment of mechanical structures for electronic equipment practices Part 2: Sectional specification Interface co-ordination dimensions for the 25 mm equipment practice Section 2: Detail specification Dimensions for subracks, chassis, backplanes, front panels and plug-in units IEC Guide 103:1980, Guide

48、on dimensional co-ordination ISO 31:1992, Quantities and units ISO 1000:1992, SI units and recommendations for the use of their multiples and of certain other units ISO 1006:1983, Building construction Modular coordination Basic module ISO 1040:1983, Building construction Modular coordination Multim

49、odules for horizontal coordinating dimensions ISO 3827-1:1977, Shipbuilding Coordination of dimensions in ships accommodation Part 1: Principles of dimensional coordination 3 Terms, terminology and definitions For the purpose of this International Standard, the terminology used is in accordance with the terminology in IEC 60050(581) and the following additional terms and definitions apply. 3.1 equipment practice mechanical structure involved in