BS DD IEC TS 62558-2011 Ultrasonics Real-time pulse-echo scanners Phantom with cylindrical artificial cysts in tissue-mimicking material and method for evaluation and periodic test.pdf
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1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationUltrasonics Real-time pulse-echo scanners Phantom with cylindrical, artificial cysts in tissue-mimicking material and method for evaluation and periodic testing of 3D-distributio
2、ns of void-detectability ratio (VDR)DD IEC/TS 62558:2011National forewordThis Draft for Development is the UK implementation of IEC/TS 62558:2011. The UK participation in its preparation was entrusted to Technical CommitteeEPL/87, UltrasonicsA list of organizations represented on this committee can
3、be obtained onrequest to its secretary.This publication does not purport to include all the necessary provisions of acontract. Users are responsible for its correct application. BSI 2011 ISBN 978 0 580 61959 5 ICS 11.040.55; 17.140.50Compliance with a British Standard cannot confer immunity from leg
4、al obligations.This Draft for Development was published under the authority of the Standards Policy and Strategy Committee on 30 June 2011.Amendments issued since publicationAmd. No. Date Text affectedDRAFT FOR DEVELOPMENTDD IEC/TS 62558:2011IEC/TS 62558Edition 1.0 2011-03TECHNICALSPECIFICATIONUltra
5、sonics Real-time pulse-echo scanners Phantom with cylindrical, artificial cysts in tissue-mimicking material and method for evaluation and periodic testing of 3D-distributions of void-detectability ratio (VDR) INTERNATIONAL ELECTROTECHNICAL COMMISSION XICS 17.140.50 PRICE CODEISBN 978-2-88912-377-3
6、Registered trademark of the International Electrotechnical Commission colourinsideDD IEC/TS 62558:2011 2 TS 62558 IEC:2011(E) CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope . 7 2 Normative references . 7 3 Terms and definitions . 7 4 Symbols . 11 5 Ambient conditions of measurement with the phantom
7、12 6 Specification of TMM 3D artificial anechoic-cyst phantom . 12 6.1 3D-phantom concept . 12 6.2 General phantom specification 12 6.3 TMM specifications: . 12 6.4 Anechoic targets . 13 6.5 Phantom enclosure 13 6.6 Scanning surface: . 13 6.7 Dimensions . 13 6.8 Phantom stability . 14 6.9 Digitized
8、image data 14 7 Principle of measurement using the 3D anechoic void phantom 15 7.1 General . 15 7.2 Analysis 15 Annex A (informative) Description of construction of an example phantom and test results 17 Annex B (informative) System description 37 Annex C (informative) Rationale 38 Annex D (informat
9、ive) Uniformity measurement . 41 Bibliography 48 Figure A.1 Example of measurement test equipment 17 Figure A.2a) Package of TMM slices containing alternating void slices and attenuation slices of polyurethane foam 19 Figure A.2b) Holes of different diameters in the void slices allow the use of the
10、phantom with different ultrasound frequencies (1 15 MHz) . 19 Figure A.2 TMM slices . 19 Figure A.3 Structure of foam 19 Figure A.4 C-images of voids . 20 Figure A.5 Experimental confirmation of Rayleigh distribution with attenuating TMM 21 Figure A.6 Speed of sound in saltwater 22 Figure A.7 Phanto
11、m with motor drive and two types of adapters 22 Figure A.8 B-, D-, C- images and grey scale 24 Figure A.9 Illustration of the VDR calculation for a ROI consisting of a single line 25 Figure A.10 B-C-D planes 26 Figure A.11 Principle of the ultrasound scanning array and beam 27 Figure A.12 Schematic
12、of B-D-C planes . 28 DD IEC/TS 62558:2011TS 62558 IEC:2011(E) 3 Figure A.13 3D-Phantom images . 29 Figure A.14 B-D-C images and VDR 30 Figure A.15a) Example: Curved Array, 40-mm radius, 3,5MHz with good VDR-values. . 31 Figure A.15b) Example: Curved Array, 40-mm radius, 3,5MHz with poor VDR-values 3
13、1 Figure A.15 VDR-values 31 Figure A.16 Example: Linear array transducer 13 MHz . 32 Figure A.17 Interpretation of VDR parameter . 33 Figure A.18 Explanation of saturation (0-255 grey-scale range) . 34 Figure A.19a) Voids 2,5 mm . 35 Figure A.19b) Voids 3,0 mm . 35 Figure A.19c) Voids 4 ;0 mm 35 Fig
14、ure A.19 Saturation effect . 35 Figure A.20 Void spot analysis . 35 Figure A.21a) Local dynamic curve 36 Figure A.21b) Expected envelope of VDR 36 Figure 21 Local dynamic range 36 Figure C.1 Autocorrelation function 39 Figure C.2a) Autocorrelation function at 4,06 cm depth 40 Figure C.2b) Autocorrel
15、ation function at 9,08 cm depth 40 Figure C.2 Autocorrelation function dependence on depth 40 Figure C.3 Autocorrelation function at 10,94 cm depth . 40 Figure D.1a) Uniformity test with related linear or curved array transducer . 42 Figure D.1b) Fixed pattern in B-image . 42 Figure D.1 Uniformity t
16、est 42 Figure D.2a) B-D-C image and fixed pattern in C-image . 43 Figure D.2b) Grey scale display of full array 43 Figure D.2 Uniformity test Additional features . 43 Figure D.3 Linear transducer with reference tape . 44 Figure D.4 Interpretation of simulated transducer failure when half of the prob
17、e is covered by five layers of 50-mm fabric tape 45 Figure D.5 Disconnected elements, example with linear transducer . 46 Figure D.6 Example with curved array transducer and reference tape 47 DD IEC/TS 62558:2011 4 TS 62558 IEC:2011(E) INTERNATIONAL ELECTROTECHNICAL COMMISSION _ ULTRASONICS REAL-TIM
18、E PULSE-ECHO SCANNERS PHANTOM WITH CYLINDRICAL, ARTIFICIAL CYSTS IN TISSUE-MIMICKING MATERIAL AND METHOD FOR EVALUATION AND PERIODIC TESTING OF 3D-DISTRIBUTIONS OF VOID-DETECTABILITY RATIO (VDR) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardi
19、zation comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes Interna
20、tional Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate i
21、n this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the
22、 two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have
23、 the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misin
24、terpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding nation
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