BS DD IEC PAS 60747-17-2011 Semiconductor devices Discrete devices Magnetic and capacitive coupler for basic and reinforced isolation《半导体元件 分立元件 基本和增强隔离用磁性和电容耦合器》.pdf

《BS DD IEC PAS 60747-17-2011 Semiconductor devices Discrete devices Magnetic and capacitive coupler for basic and reinforced isolation《半导体元件 分立元件 基本和增强隔离用磁性和电容耦合器》.pdf》由会员分享，可在线阅读，更多相关《BS DD IEC PAS 60747-17-2011 Semiconductor devices Discrete devices Magnetic and capacitive coupler for basic and reinforced isolation《半导体元件 分立元件 基本和增强隔离用磁性和电容耦合器》.pdf（44页珍藏版）》请在麦多课文档分享上搜索。

1、raising standards worldwideNO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBSI Standards PublicationSemiconductor devices Discrete devicesPart 17: Magnetic and capacitive coupler for basic and reinforced isolationDD IEC/PAS 60747-17:2011National forewordThis Draft for Developme

2、nt is the UK implementation of IEC/PAS 60747-17:2011.This publication is not to be regarded as a British Standard.It is being issued in the Draft for Development series of publications and is of a provisional nature. It should be applied on this provisional basis, so that information and experience

3、of its practical application can be obtained.A PAS is a Technical Specification not fulfilling the requirements for a stand-ard, but made available to the public and established in an organization operating under a given procedure.A review of this Draft for Development will be carried out not later

4、than three years after its publication.Notification of the start of the review period, with a request for the submission of comments from users of this Draft for Development, will be made in an announcement in the appropriate issue of Update Standards. According to the replies received, BSI Technica

5、l Committee EPL/47 will judge whether the validity of the PAS should be extended for a further three years or what other action should be taken and pass their comments on to the relevant international committee.Observations which it is felt should receive attention before the official call for comme

6、nts will be welcomed. These should be sent to the Secretary of BSI Technical Committee EPL/47 at British Stand-ards House, 389 Chiswick High Road, London W4 4AL.The UK participation in its preparation was entrusted to Technical Committee EPL/47, Semiconductors.A list of organizations represented on

7、this committee can be obtained on request to its secretary.This publication does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. BSI 2011ISBN 978 0 580 75938 3ICS 31.080.99Compliance with a British Standard cannot confer immunity

8、from legal obligations.This Draft for Development was published under the authority of the Standards Policy and Strategy Committee on 31 December 2011.Amendments issued since publicationAmd. No. Date Text affectedDRAFT FOR DEVELOPMENTDD IEC/PAS 60747-17:2011IEC/PAS 60747-17 Edition 1.0 2011-11 PUBLI

9、CLY AVAILABLE SPECIFICATION PRE-STANDARD Semiconductor devices Discrete devices Part 17: Magnetic and capacitive coupler for basic and reinforced isolation INTERNATIONAL ELECTROTECHNICAL COMMISSION W ICS 31.080.99 PRICE CODE ISBN 978-2-88912-792-4 Registered trademark of the International Electrotec

10、hnical Commission DD IEC/PAS 60747-17:2011 2 PAS 60747-17 IEC:2011(E) CONTENTS FOREWORD . 5 1 Scope . 7 2 Normative references . 7 3 Magnetic and Capacitive Coupler . 8 3.1 Semiconductor material . 8 3.2 Details of outline and encapsulation 8 3.2.1 Outline drawing . 8 3.2.2 Method of encapsulation 9

11、 3.2.3 Terminal identification and indication of any connection between a terminal and the case 9 3.3 Type of coupler . 9 3.3.1 SIO2 Isolators . 9 3.3.2 Thin film Polymer Isolators 9 4 Terms related to ratings and characteristics for a coupler . 9 4.1 lsolation sides . 9 4.2 lsolation capacitance: C

12、IO. 9 4.3 lsolation resistance: RIO9 4.4 lsolation voltage 9 4.5 Logic state match 9 4.6 Logic state transition match . 9 4.7 Common mode transient immunity (CMTI) . 10 4.8 Magnetic field immunity (MFI) 10 4.8.1 Static magnetic field immunity (SMFI) 10 4.8.2 Variable magnetic field immunity (VMFI) 1

13、0 4.9 Propagation Delay: tpLHor tpHL. 10 4.10 Further terms and abbreviations 10 5 Terms for couplers providing protection against electrical shock . 10 5.1 Safety ratings of couplers for reinforced insulation 10 5.2 Electrical safety requirements of couplers for basic and reinforced insulation 10 5

14、.2.1 Partial discharge (pd) 11 5.2.2 Apparent charge: qpd. 11 5.2.3 Threshold apparent charge: qpd(TH). 11 5.2.4 Test voltages and time intervals for the partial-discharge test of couplers 11 5.2.5 Lifetime (Lifetime) 15 5.2.6 Failure Rate over Lifetime (FROL) . 15 5.2.7 Statistical model (model) .

15、15 5.3 Isolation voltages and isolation test voltages for couplers providing protection against electrical shock . 15 5.3.1 Rated isolation voltages 15 5.4 Absolute maximum ratings 16 5.4.1 Minimum and maximum storage temperatures: Tstg. 16 5.4.2 Minimum and maximum ambient or reference-point operat

16、ing temperatures: Tambor Tref. 16 5.4.3 Maximum soldering temperature: Tsld16 5.4.4 Maximum continuous (direct) reverse input voltage (VR) over the operating temperature range . 16 DD IEC/PAS 60747-17:2011PAS 60747-17 IEC:2011(E) 3 5.4.5 Maximum continuous (direct) or repetitive peak isolation volta

17、ge (VlOor VIORM) over the operating temperature range 16 5.4.6 Maximum surge isolation voltage (VIOSM) over the operating temperature range . 16 5.4.7 Maximum continuous input current (II) at an ambient or reference-point temperature of 25 C and derating curve or derating factor . 17 5.4.8 Maximum p

18、eak input current (IlM) at an ambient or reference-point temperature of 25 C and under specified pulse conditions 17 5.4.9 Maximum power dissipation (Ptrn) of the output stage at an ambient or reference- point temperature of 25 C and a derating curve or derating factor . 17 5.4.10 Maximum total powe

19、r dissipation of the package (Ptot) at an ambient or reference- point temperature of 25 C and derating curve or derating factor . 17 6 Electrical characteristics . 17 6.1 Coupler logic and timing definitions . 17 7 Coupler protection against electrical shock . 18 7.1 Type 18 7.2 Ratings (shall be li

20、sted in a special section in the manufacturers datasheet) 18 7.2.1 Safety Limiting Values . 18 7.2.2 Functional ratings 18 7.2.3 Rated isolation voltages 18 7.3 Electrical safety requirements . 19 7.4 Electrical, environmental and/or endurance test information: (supplementary information if desired

21、by the manufacturer) 19 7.4.1 Routine test . 19 7.4.2 Sample test . 19 7.4.3 Type Test 20 8 Measuring methods for couplers . 28 8.1 Input-to-output capacitance (ClO) 28 8.1.1 Purpose . 28 8.1.2 Circuit diagram 28 8.1.3 Measurement procedure 28 8.1.4 Precautions to be observed . 29 8.1.5 Special cond

22、itions . 29 8.2 Isolation resistance between input and output, RlO29 8.2.1 Purpose . 29 8.2.2 Circuit diagram 29 8.2.3 Precautions to be observed . 29 8.2.4 Measurement procedure 29 8.2.5 Special conditions . 29 8.3 Isolation test 30 8.3.1 Purpose . 30 8.3.2 Circuit diagram 30 8.3.3 Test procedure 3

23、0 8.3.4 Requirements 30 8.3.5 Specified conditions 30 8.4 Partial discharges of magnetic couplers 31 8.4.1 Purpose . 31 8.4.2 Circuit diagram 31 DD IEC/PAS 60747-17:2011 4 PAS 60747-17 IEC:2011(E) 8.4.3 Description of the test circuit and requirements . 31 8.4.4 Test procedure 32 8.4.5 Specified con

24、ditions 33 8.5 Switching times of couplers . 34 8.5.1 Purpose . 34 8.5.2 Circuit diagram 34 8.5.3 Circuit description and requirements 34 8.5.4 Precautions to be observed . 34 8.5.5 Measurement procedure 34 8.5.6 Specified conditions 35 8.6 Measuring methods of common-mode transient immunity (CMTI)

25、for magnetic couplers . 36 8.6.1 Purpose . 36 8.6.2 Circuit diagram 36 8.6.3 Circuit description and requirements 36 8.6.4 Precautions to be observed . 36 8.6.5 Measuring procedure . 37 8.6.6 Specified conditions 38 8.7 Measuring methods of magnetic field immunity for couplers 38 8.7.1 Purpose . 38

26、8.7.2 Circuit diagram 39 8.7.3 Circuit description and requirements 39 8.7.4 Measuring procedure as specified by IEC-61000-4-8 and IEC-61000-4-9 39 8.8 Surge test of the isolation 39 Figure 1 Time intervals for method a) of the test voltage 13 Figure 2 Time intervals for method b) of the test voltag

27、e 14 Figure 3 Basic isolation capacitance measurement circuit 28 Figure 4 Basic isolation resistance measurement circuit 29 Figure 5 Basic isolation voltage measurement circuit . 30 Figure 6 Partial discharge test circuit . 31 Figure 7 Connections for the calibration of the complete test arrangement

28、 . 32 Figure 8 Switching time test circuit . 34 Figure 9 Transition time waveform measurement . 35 Figure 10 Propagation delay time waveform measurement . 35 Figure 11 Common-mode transient immunity (CMTI) measurement circuit for couplers 36 Figure 12 Common-mode transient immunity (CMTI) + VCMor VC

29、Mwaveform 38 Figure 13 Magnetic field immunity (MFI) test circuit . 39 Table 1 Overview of characteristics and symbols . 17 Table 2 Datasheet characteristics 19 Table 3 Tests and test sequence for coupler providing basic insulation and reinforced insulation for protection against electrical shock .

30、26 Table 4 Test conditions 28 Table 5 Specified conditions 33 DD IEC/PAS 60747-17:2011PAS 60747-17 IEC:2011(E) 5 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SEMICONDUCTOR DEVICES DISCRETE DEVICES Part 17: Magnetic and capacitive coupler for basic and reinforced isolation FOREWORD 1) The Internationa

31、l Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic f

32、ields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Their preparation is entrusted to technical committees; any

33、IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non-governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates closely with the International Organization for Standardiz

34、ation (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the relevant subjects since each technical committee has represe

35、ntation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC c

36、annot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maximum extent possible in their national and regional publicat

37、ions. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC itself does not provide any attestation of conformity. Independent certification bodies provide conformity assessment services and, in some areas,

38、access to IEC marks of conformity. IEC is not responsible for any services carried out by independent certification bodies. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including

39、individual experts and members of its technical committees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance u

40、pon, this IEC Publication or any other IEC Publications. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the element

41、s of this IEC Publication may be the subject of patent rights. IEC shall not be held responsible for identifying any or all such patent rights. A PAS is a technical specification not fulfilling the requirements for a standard, but made available to the public. DD IEC/PAS 60747-17:2011 6 PAS 60747-17

42、 IEC:2011(E) IEC-PAS 60747-17 has been processed by subcommittee 47E: Discrete semiconductor devices, of IEC technical committee 47: Semiconductor devices. The text of this PAS is based on the following document: This PAS was approved for publication by the P-members of the committee concerned as in

43、dicated in the following document Draft PAS Report on voting 47E/412/PAS 47E/423/RVD Following publication of this PAS, which is a pre-standard publication, the technical committee or subcommittee concerned may transform it into an International Standard. This PAS shall remain valid for an initial m

44、aximum period of 3 years starting from the publication date. The validity may be extended for a single period up to a maximum of 3 years, at the end of which it shall be published as another type of normative document, or shall be withdrawn. DD IEC/PAS 60747-17:2011PAS 60747-17 IEC:2011(E) 7 SEMICON

45、DUCTOR DEVICES DISCRETE DEVICES Part 17: Magnetic and capacitive coupler for basic and reinforced isolation 1 Scope This PAS gives the terminology, essential ratings, characteristics, safety test and the measuring methods of magnetic and capacitive couplers. It specifies the principles of magnetic a

46、nd capacitive coupling across an isolation barrier and the related requirements for basic isolation and reinforced insulation. 2 Normative references The following documents, in whole or in part, are normatively referenced in this document and are indispensable for its application. For dated referen

47、ces, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 60060-1, High-voltage test techniques Part 1: General definitions and test requirements IEC 60068-1:1988, Environmental testing Part 1: General and guida

48、nce IEC 60068-2-1, Environmental testing Part 2-1: Tests Test A: Cold IEC 60068-2-2, Environmental testing Part 2-2: Tests Test B: Dry heat IEC 60068-2-67, Environmental testing Part 2-67: Tests Test Cy: Damp heat, steady state, accelerated test primarily intended for components IEC 60068-2-6, Envir

49、onmental testing Part 2-6: Tests Test Fc: Vibration (sinusoidal) IEC 60068-2-14, Environmental testing Part 2-14: Tests Test N: Change of temperature IEC 60068-2-17:1994, Basic environmental testing procedures Part 2-17: Tests Test Q: Sealing IEC 60068-2-20, Environmental testing Part 2-20: Tests Test T: Test methods for solderability and resistance to soldering heat of devices with leads IEC 60068-2-27, Environmental testing