BS 123700-2001 System of quality assessment - Sectional specification - Flex-rigid double-sided printed boards with through-connections《质量评估体系 分规范 直通连接的软-硬性双面印制板》.pdf

《BS 123700-2001 System of quality assessment - Sectional specification - Flex-rigid double-sided printed boards with through-connections《质量评估体系 分规范 直通连接的软-硬性双面印制板》.pdf》由会员分享，可在线阅读，更多相关《BS 123700-2001 System of quality assessment - Sectional specification - Flex-rigid double-sided printed boards with through-connections《质量评估体系 分规范 直通连接的软-硬性双面印制板》.pdf（26页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD BS 123700:2001 System of quality assessment Sectional specification Flex-rigid double-sided printed boards with through-connections ICS 31.180 NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAWBS 123700:2001 This British Standard, having been prepared under the d

2、irection of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 17 December 2001 BSI 17 December 2001 The following BSI references relate to the work on this British Standard: Committee reference EPL/501 Draft

3、 for comment 01/204164 DC ISBN 0 580 38530 2 Committees responsible for this British Standard The preparation of this British Standard was entrusted to Technical Committee EPL/501, Electronic assembly technology, upon which the following bodies were represented: Association of Contract Engineers Man

4、ufacturers Federation of the Electronics Industry GAMBICA Ministry of Defence National Supervising Inspectorate Printed Circuit Interconnection Federation Surface Mounting and Related Technologies (Smart Group) Ltd. Amendments issued since publication Amd. No. Date CommentsBS 123700:2001 BSI 17 Dece

5、mber 2001 i Contents Page Committees responsible Inside front cover Foreword ii 1S c o p e 1 2 Normative references 1 3T e r m s a n d d e f i n i t i o n s 1 4 General requirements 1 5 Capability approval 1 6 Relevant specification 2 7 Capability test programme 2 8 Quality conformity inspection 2 9

6、 Test patterns and test boards 6 Bibliography 21 Figure 1 Composite test pattern Layer 1 8 Figure 2 Composite test pattern Layer 2 9 Figure 3 Composite test pattern Specimens A, B and C 10 Figure 4 Composite test pattern Specimens D and E 11 Figure 5 Composite test pattern Specimens F and G 12 Figur

7、e 6 Composite test pattern Specimens H and J 13 Figure 7 Composite test pattern Specimens K, M and N 14 Figure 8 Examples of multiple arrangements 15 Figure 9 Examples of soldered holes 16 Figure 10 Methods of reinforcing lands 17 Figure 11 Examples relating to access holes 18 Figure 12 Examples of

8、delamination 19 Table 1 Group A quality conformity inspection 3 Table 2 Group B quality conformity inspection 4 Table 3 Group C quality conformity inspection 5 Table 4 Test specimen details 6 Table 5 Structure of a typical test board 7BS 123700:2001 ii BSI 17 December 2001 Foreword This British Stan

9、dard has been prepared by Technical Committee EPL/501, Electronic assembly technology. The BS 123000:2001 series of British Standards is based on draft proposals to revise the EN 123000 series dated 1992 and 1997. These were circulated and voted on in CENELEC, but the CENELEC Technical Board decided

10、 not to approve them for publication. Following repeated attempts by the British National Committee to get them published, the Technical Board agreed to grant derogation from standstill to the British National Committee to publish national standards on the basis of the prEN 123000 series (Technical

11、Board decision D106/092). These standards are published to complement the BS EN 123000 series, which remains current. They will be withdrawn only if they are replaced by revised EN standards. They have been published because they are considered to be an improvement upon the EN series, for the follow

12、ing reasons. a) Requirements for modern materials and surface finishes required by the electronics industry have been incorporated. b) Reference is made to ANSI/IPC A-600F for many of the inspection criteria. This has been undertaken in response to industry requests. c) References to obsolete CECC r

13、egulatory documents have been replaced. d) Tests and requirements that are no longer considered relevant have been removed. e) The UK electronics industry requires standards that are subject to ongoing revision, in order to take account of new European Eco-Directives. This British Standard is a sect

14、ional specification. It should be read in conjunction with the generic specification, BS 123000, and any associated capability detail specification. It has been assumed in the preparation of this British Standard that the execution of its provisions will be entrusted to appropriately qualified and e

15、xperienced people, for whose use it has been produced. A British Standard does not purport to include all the necessary provisions of a contract. Users of British Standards are responsible for their correct application. Compliance with a British Standard does not of itself confer immunity from legal

16、 obligations. Summary of pages This document comprises a front cover, an inside front cover, pages i and ii, pages 1 to 21 and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued.BS 123700:2001 BSI 17 December 2001 1 1 Scope This British Stan

17、dard specifies characteristics to be assessed and test methods to be used for capability approval testing and for quality conformity inspection (lot-by-lot and periodic inspection). It is applicable for all flex-rigid double-sided printed boards with through-connections, irrespective of their method

18、 of manufacture, when they are ready for the mounting of components. This British Standard is a sectional specification intended for use with the IECQ system of quality assessment for electronic components. 2 Normative references The following normative documents contain provisions which, through re

19、ference in this text, constitute provisions of this British Standard. For dated references, subsequent amendments to, or revisions of, any of these publications do not apply. For undated references, the latest edition of the publication referred to applies. BS 4727-1:Group 11 (IEC 60194), Glossary o

20、f electrotechnical, power, telecommunication, electronics, lighting and colour terms Part 1: Terms common to power, telecommunications and electronics Group 11: Printed circuits. BS 6001-1:1999 (ISO 2859-1:1999), Sampling procedures for inspection by attributes Part 1: Sampling schemes indexed by ac

21、ceptance quality limit (AQL) for lot-by-lot inspection. BS 6221-2:1991 (IEC 60326-2:1990), Printed wiring boards Part 2: Methods of test. BS 6221-3 (IEC 60326-3), Printed wiring boards Guide for the design and use of printed wiring boards. BS 123000:2001, System of quality assessment Generic specifi

22、cation Printed boards. 3 Terms and definitions For the purposes of this British Standard the terms and definitions given in BS 4727-1:Group 11 and BS 123000 together with the following apply. 3.1 relevant specification product specification for an actual batch of printed boards, i.e. a customer deta

23、il specification as well as a capability detail specification applied to a specific material, surface finish etc., as applicable 4 General requirements The following specifications for flex-rigid double-sided printed boards with through-connections shall be prepared, unless a suitable capability det

24、ail specification already exists, using this British Standard as a basis: a) capability detail specifications for general use or applying to specific applications; b) customer detail specifications, which shall be prepared in accordance with BS 123000:2001, 7.2. NOTE 1 BS 123700-003 is an example of

25、 a capability detail specification for flex-rigid double-sided printed boards with through-connections. NOTE 2 A capability detail specification is prepared either by an international or national body or by a manufacturer (see also BS CECC 00111-4). A customer detail specification should preferably

26、be written by the customer and allocated a number within the customers own system. Further details are given in BS 123000 and BS CECC 00114-3. 5 Capability approval 5.1 Basic capability Testing shall be carried out on the composite test pattern given in clause 9. 5.2 Additional capability BS 123000:

27、2001, 5.3.3 shall apply. NOTE For multiple arrangements see also clause 9. 5.3 Maintenance of capability approval BS 123000:2001, 5.6 shall apply.BS 123700:2001 2 BSI 17 December 2001 6 Relevant specification The relevant specification shall contain all the information necessary to define the printe

28、d board clearly and completely. Care shall be taken to avoid unnecessary proscriptions. Tolerances shall be stated as necessary. Nominal values without tolerances, or simple maximum or minimum values, shall be given where these are sufficient. Where tolerances are necessary for certain areas or part

29、s of the printed board only, they shall be applied and restricted to those areas or parts. If there are several possibilities of presentation, of tolerance classes etc., the selections given in BS 6221-3 shall be applied as practical. In the case of discrepancy between the customer detail specificat

30、ion and other pertinent specifications (e.g. generic specification, sectional specification or capability detail specification), the customer detail specification shall prevail. 7 Capability test programme For initial demonstration and subsequent re-demonstration, the capability approval test progra

31、mme shall be in accordance with the relevant capability detail specification. Demonstration of additional capability shall be in accordance with BS 123000:2001, 5.3.3. NOTE For composite test pattern specimens, see clause 9 and Figure 1, Figure 2, Figure 3, Figure 4, Figure 5, Figure 6 and Figure 7.

32、 Examples of multiple arrangements of test patterns are shown in Figure 8. Examples of soldered holes are shown in Figure 9, methods of reinforcing lands in Figure 10, examples relating to access holes in Figure 11, and examples of delamination in Figure 12. There shall be no more than three failure

33、s throughout the entire sequence of tests. 8 Quality conformity inspection 8.1 General Quality conformity inspection shall be conducted on samples which are either taken from the production batch, or which are representative of the production batch (i.e. manufactured using the same processes, having

34、 the same features, and concurrent with the released batch). 8.2 Sampling plans The sampling plans of BS 6001-1, as referenced in Table 1, Table 2 and Table 3, shall be used. In all cases there shall be no defects. NOTE 1 Unless otherwise specified, production boards and/or specially designed test p

35、atterns may be used for carrying out tests for the lot-by-lot and periodic inspection. NOTE 2 Where specially designed test patterns are used, they may be included in the panel. They may be based upon the appropriate pattern of the composite test pattern as detailed in clause 9. 8.3 Inspection group

36、s Inspection level C shall be used, unless another inspection level is specified in the customer detail specification. Other inspection levels shall be in accordance with Table 1 and Table 2. Printed boards shall be aggregated into inspection lots in accordance with BS 123000:2001, 6.1. NOTE For def

37、inition of the inspection groups, see BS 123000:2001, 6.3. Quality conformity inspection shall be carried out in accordance with Table 1, Table 2 and Table 3.BS 123700:2001 BSI 17 December 2001 3 Table 1 Group A quality conformity inspection Inspection group Characteristics Test no. aAssessment leve

38、l A Assessment level B Assessment level C Assessment level D IL b AQL c IL AQL IL AQL IL AQL Sub-group A1 Visual inspection See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Conformity 1 S2 2.5 % 100 % Identification 1 S2 2.5 % 100 % Appearance 1a S2 2.5 % 100 % Workmanship 1a S2 2.5 % 100 % Board

39、 edges 1a S2 2.5 % 100 % Eyelets 1a S2 2.5 % 100 % Bonding, conductor to substrate 1a S2 2.5 % 100 % Bonding, coverlayer to substrate and pattern 1a S2 2.5 % 100 % Conductor defects 1b S2 2.5 % 100 % Particles between conductors 1b, 1c S2 2.5 % 100 % Sub-group A2 Dimensional examination Board dimens

40、ions 2 S1 4.0 % S4 2.5 % Holes 2 S1 4.0 % S4 2.5 % Access holes 2 S1 4.0 % S4 2.5 % Slots, notches 2 S1 4.0 % S4 2.5 % Conductor width 2 S1 4.0 % S4 2.5 % Conductor spacing 2 S1 4.0 % S4 2.5 % Misalignment of hole and land 2 S1 4.0 % S4 2.5 % Positional tolerance of hole centres 2 S1 4.0 % S4 2.5 %

41、Sub-group A3 Spare group for additional group A tests NOTE This listing may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Inspection level (defined in BS 6001-1:1999, Table 1). c Acceptability

42、 quality level.BS 123700:2001 4 BSI 17 December 2001 Table 2 Group B quality conformity inspection Inspection group Characteristics Test no. a Assessment level A Assessment level B Assessment level C Assessment level D IL b AQL c IL AQL IL AQL IL AQL Sub-group B1 Dimensional interchangeability See B

43、S 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Not applicable Sub-group B2 Solderability 14a S2 2.5 % S3 2.5 % Sub-group B3 Shock tests Not applicable Sub-group B4 Mechanical tests Peel strength, conductor to base material S2 2.5 % Pull-off strength, lands with plain holes (if applicable) 11a S2 2.5

44、 % Sub-group B5 Surface finish tests (if applicable) Adhesion of plating 13a S1 2.5 % S2 2.5 % Thickness of plating, contact areas 13f S2 2.5 % Sub-group B6 Spare group for additional group B tests NOTE This listing may be subject to continuing review, as required by the publication and revision of

45、new capability detail specifications. a As specified in BS 6221-2:1991. b Inspection level (defined in BS 6001-1:1999, Table 1). c Acceptability quality level.BS 123700:2001 BSI 17 December 2001 5 Table 3 Group C quality conformity inspection Inspection group Characteristics Test no. a Assessment le

46、vel A Assessment level B Assessment level C Assessment level D No. b Defects c No. Defects No. Defects No. Defects Sub-group C1 Tests in 3-month intervals See BS 123000:2001, 7.2.5 See BS 123000:2001, 7.2.5 Insulation resistance before and after damp heat 6a 3 1 Change in resistance of plated-throug

47、h holes 3c 6 1 Sub-group C2 Tests in 12-month intervals Not applicable Sub-group C3 Spare group for additional intervals NOTE This listing may be subject to continuing review, as required by the publication and revision of new capability detail specifications. a As specified in BS 6221-2:1991. b Num

48、ber of specimens to be tested. c Maximum permissible number of defects.BS 123700:2001 6 BSI 17 December 2001 9 Test patterns and test boards 9.1 General A test pattern shall consist of: a) a part of a conductive pattern on a production board (and used in the application of the printed board); or b)

49、a special test pattern particularly designed and prepared for the purpose of testing only. A test pattern shall be located: 1) on a test coupon (a portion of a printed board or a panel detached prior to using the printed board); or 2) on a separate test board. 9.2 Capability approval testing Basic capability shall be assessed using the composite test pattern given in 9.2 and the six-layer structure given in 9.3. Where additional capability claims are for a larger board size (active ar