IEC 61760-1-2006 Surface mounting technology - Part 1 Standard method for the specification of surface mounting components (SMDs)《表面安装技术.第1部分 表面安装元件(SMDS)规范的标准方法》.pdf

《IEC 61760-1-2006 Surface mounting technology - Part 1 Standard method for the specification of surface mounting components (SMDs)《表面安装技术.第1部分 表面安装元件(SMDS)规范的标准方法》.pdf》由会员分享，可在线阅读，更多相关《IEC 61760-1-2006 Surface mounting technology - Part 1 Standard method for the specification of surface mounting components (SMDs)《表面安装技术.第1部分 表面安装元件(SMDS)规范的标准方法》.pdf（64页珍藏版）》请在麦多课文档分享上搜索。

1、 IEC 61760-1 Edition 2.0 2006-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) Technique du montage en surface Partie 1: Mthode de normalisation pour la spcification des composants monts en

2、surface (CMS) IEC 61760-1:2006-04(en-fr) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2006 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photoco

3、pying and microfilm, without permission in writing from either IEC or IECs member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, please contact the address below or your local

4、 IEC member National Committee for further information. Droits de reproduction rservs. Sauf indication contraire, aucune partie de cette publication ne peut tre reproduite ni utilise sous quelque forme que ce soit et par aucun procd, lectronique ou mcanique, y compris la photocopie et les microfilms

5、, sans laccord crit de lIEC ou du Comit national de lIEC du pays du demandeur. Si vous avez des questions sur le copyright de lIEC ou si vous dsirez obtenir des droits supplmentaires sur cette publication, utilisez les coordonnes ci-aprs ou contactez le Comit national de lIEC de votre pays de rsiden

6、ce. IEC Central Office Tel.: +41 22 919 02 11 3, rue de Varemb Fax: +41 22 919 03 00 CH-1211 Geneva 20 infoiec.ch Switzerland www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all el

7、ectrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. IEC Catalogue - webstore.iec.ch/catalog

8、ue The stand-alone application for consulting the entire bibliographical information on IEC International Standards, Technical Specifications, Technical Reports and other documents. Available for PC, Mac OS, Android Tablets and iPad. IEC publications search - www.iec.ch/searchpub The advanced search

9、 enables to find IEC publications by a variety of criteria (reference number, text, technical committee,). It also gives information on projects, replaced and withdrawn publications. IEC Just Published - webstore.iec.ch/justpublished Stay up to date on all new IEC publications. Just Published detail

10、s all new publications released. Available online and also once a month by email. Electropedia - www.electropedia.org The worlds leading online dictionary of electronic and electrical terms containing more than 30 000 terms and definitions in English and French, with equivalent terms in 14 additiona

11、l languages. Also known as the International Electrotechnical Vocabulary (IEV) online. IEC Glossary - std.iec.ch/glossary More than 55 000 electrotechnical terminology entries in English and French extracted from the Terms and Definitions clause of IEC publications issued since 2002. Some entries ha

12、ve been collected from earlier publications of IEC TC 37, 77, 86 and CISPR. IEC Customer Service Centre - webstore.iec.ch/csc If you wish to give us your feedback on this publication or need further assistance, please contact the Customer Service Centre: csciec.ch. A propos de lIEC La Commission Ele

13、ctrotechnique Internationale (IEC) est la premire organisation mondiale qui labore et publie des Normes internationales pour tout ce qui a trait llectricit, llectronique et aux technologies apparentes. A propos des publications IEC Le contenu technique des publications IEC est constamment revu. Veui

14、llez vous assurer que vous possdez ldition la plus rcente, un corrigendum ou amendement peut avoir t publi. Catalogue IEC - webstore.iec.ch/catalogue Application autonome pour consulter tous les renseignements bibliographiques sur les Normes internationales, Spcifications techniques, Rapports techni

15、ques et autres documents de lIEC. Disponible pour PC, Mac OS, tablettes Android et iPad. Recherche de publications IEC - www.iec.ch/searchpub La recherche avance permet de trouver des publications IEC en utilisant diffrents critres (numro de rfrence, texte, comit dtudes,). Elle donne aussi des infor

16、mations sur les projets et les publications remplaces ou retires. IEC Just Published - webstore.iec.ch/justpublished Restez inform sur les nouvelles publications IEC. Just Published dtaille les nouvelles publications parues. Disponible en ligne et aussi une fois par mois par email. Electropedia - ww

17、w.electropedia.org Le premier dictionnaire en ligne de termes lectroniques et lectriques. Il contient plus de 30 000 termes et dfinitions en anglais et en franais, ainsi que les termes quivalents dans 14 langues additionnelles. Egalement appel Vocabulaire Electrotechnique International (IEV) en lign

18、e. Glossaire IEC - std.iec.ch/glossary Plus de 55 000 entres terminologiques lectrotechniques, en anglais et en franais, extraites des articles Termes et Dfinitions des publications IEC parues depuis 2002. Plus certaines entres antrieures extraites des publications des CE 37, 77, 86 et CISPR de lIEC

19、. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61760-1 Edition 2.0 2006-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Part 1: Standard method for the s

20、pecification of surface mounting components (SMDs) Technique du montage en surface Partie 1: Mthode de normalisation pour la spcification des composants monts en surface (CMS) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE U ICS 31.240 PRICE CODE CODE PRIX ISBN

21、978-2-8322-1344-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publ

22、ication via un distributeur agr. 2 61760-1 IEC:2006 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope and object 7 1.1 Scope 7 1.2 Object . 7 2 Normative references 7 3 Terms and definitions . 8 4 Requirements for component design and component specifications . 10 4.1 General requirement 10 4.2 Packagi

23、ng . 10 4.3 Labelling of product packaging . 10 4.4 Component marking 11 4.5 Storage and transportation . 12 4.6 Component outline and design . 12 4.7 Mechanical stress 16 4.8 Component reliability assurance 16 4.9 Additional requirements for compatibility with lead-free soldering . 16 5 Specificati

24、on of assembly process conditions 16 5.1 General . 16 5.2 Securing the component on the substrate prior to soldering 18 5.3 Mounting methods . 19 5.4 Cleaning (where applicable) . 20 5.5 Removal and/or replacement of SMDs . 21 6 Typical process conditions 22 6.1 Soldering processes, temperature/time

25、 profiles 22 6.2 Typical cleaning conditions for assemblies . 26 7 Requirements for components and component specifications related to suitability with various mounting processes . 27 7.1 General . 27 7.2 Wettability . 27 7.3 Resistance to dissolution of metallization . 27 7.4 Resistance to solderin

26、g heat 27 7.5 Resistance to cleaning solvent . 28 7.6 Soldering profiles . 28 7.7 Bonding strength test for the component glue interface test 28 Bibliography 30 Figure 1 Example of a component with marked specific orientation put in tape and tray 11 Figure 2 Vacuum pipette, pick-up area and componen

27、t compartment: Example for a component with a flat surface 13 Figure 3 Coplanarity of terminals . 13 Figure 4 Stable seating of component . 14 Figure 5 Unstable seating of component . 14 Figure 6 Terminals arranged peripherally in two rows 14 61760-1 IEC:2006 3 Figure 7 Good contrast to component bo

28、dy and surroundings . 14 Figure 8 Component weight/pipette suction strength . 15 Figure 9 Process steps for soldering . 17 Figure 10 Process steps for gluing 18 Figure 11 SnPb Vapour phase soldering Temperature/time profile (terminal temperature) . 22 Figure 12 Lead-free SnAgCu Vapour phase solderin

29、g Temperature/time profile (terminal temperature) . 23 Figure 13 Infrared soldering, forced gas convection reflow soldering Temperature/time profile for SnPb solders . 24 Figure 14 Infrared soldering, forced gas convection reflow soldering Temperature/time profile for lead-free SnAgCu solders 25 Fig

30、ure 15 Double wave soldering for SnPb and lead-free SnAgCu solder Temperature/time profile (terminal temperature) 26 Table 1 Basic cleaning processes . 26 4 61760-1 IEC:2006 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY Part 1: Standard method for the specification of surfa

31、ce mounting components (SMDs) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions con

32、cerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Th

33、eir preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. IEC collaborates

34、 closely with the International Organization for Standardization (ISO) in accordance with conditions determined by agreement between the two organizations. 2) The formal decisions or agreements of IEC on technical matters express, as nearly as possible, an international consensus of opinion on the r

35、elevant subjects since each technical committee has representation from all interested IEC National Committees. 3) IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. While all reasonable efforts are made to ensure that t

36、he technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user. 4) In order to promote international uniformity, IEC National Committees undertake to apply IEC Publications transparently to the maxi

37、mum extent possible in their national and regional publications. Any divergence between any IEC Publication and the corresponding national or regional publication shall be clearly indicated in the latter. 5) IEC provides no marking procedure to indicate its approval and cannot be rendered responsibl

38、e for any equipment declared to be in conformity with an IEC Publication. 6) All users should ensure that they have the latest edition of this publication. 7) No liability shall attach to IEC or its directors, employees, servants or agents including individual experts and members of its technical co

39、mmittees and IEC National Committees for any personal injury, property damage or other damage of any nature whatsoever, whether direct or indirect, or for costs (including legal fees) and expenses arising out of the publication, use of, or reliance upon, this IEC Publication or any other IEC Publica

40、tions. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of pa

41、tent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61760-1 has been prepared by IEC technical committee 91: Surface mounting technology. This second edition cancels and replaces the first edition, published in 1998, and constitute

42、s a technical revision. The main changes with regard to the previous edition concern: requirements related to leadfree soldering; extension of the scope to include also components mounted by gluing; direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat

43、; classification into categories based on the components ability to withstand resistance to soldering heat has been deleted. 61760-1 IEC:2006 5 This bilingual version (2014-02) corresponds to the monolingual English version, published in 2006-04. The text of this standard is based on the following d

44、ocuments: FDIS Report on voting 91/577/FDIS 91/588/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. The committee has decided that the contents of this

45、publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 6 61760-1 IEC:2006

46、 INTRODUCTION Specifications for electronic components have in the past been formulated for each component family. The regulations for environmental tests have been selected from IEC 60068 and other IEC and ISO publications. The overriding condition for this procedure was that all components, once i

47、nstalled in a piece of equipment, had to satisfy certain criteria. The introduction and increasing use of surface mounting components make it necessary to extend the existing requirements to include those arising from processing during assembly. Irrespective of the component family involved, all com

48、ponents on one and the same side of a printed circuit board are exposed to the same mounting process (see flow charts in Clause 5). Nevertheless there exists no harmonized standard that prescribes the content of a component specification. It is the purpose of this standard to define the general requ

49、irements for component specifications derived from the assembly processes. This is done in three steps. In the first step general requirements for component specifications and component design related to the handling and placement of the component on the substrate are given (Clause 4). In the second step the definition of reference process conditions as representative of a group of assembly