1、 IEC 61760-1 Edition 2.0 2006-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Part 1: Standard method for the specification of surface mounting components (SMDs) Technique du montage en surface Partie 1: Mthode de normalisation pour la spcification des composants monts en
2、surface (CMS) IEC 61760-1:2006-04(en-fr) THIS PUBLICATION IS COPYRIGHT PROTECTED Copyright 2006 IEC, Geneva, Switzerland All rights reserved. Unless otherwise specified, no part of this publication may be reproduced or utilized in any form or by any means, electronic or mechanical, including photoco
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19、. Service Clients - webstore.iec.ch/csc Si vous dsirez nous donner des commentaires sur cette publication ou si vous avez des questions contactez-nous: csciec.ch. IEC 61760-1 Edition 2.0 2006-04 INTERNATIONAL STANDARD NORME INTERNATIONALE Surface mounting technology Part 1: Standard method for the s
20、pecification of surface mounting components (SMDs) Technique du montage en surface Partie 1: Mthode de normalisation pour la spcification des composants monts en surface (CMS) INTERNATIONAL ELECTROTECHNICAL COMMISSION COMMISSION ELECTROTECHNIQUE INTERNATIONALE U ICS 31.240 PRICE CODE CODE PRIX ISBN
21、978-2-8322-1344-5 Registered trademark of the International Electrotechnical Commission Marque dpose de la Commission Electrotechnique Internationale Warning! Make sure that you obtained this publication from an authorized distributor. Attention! Veuillez vous assurer que vous avez obtenu cette publ
22、ication via un distributeur agr. 2 61760-1 IEC:2006 CONTENTS FOREWORD . 4 INTRODUCTION . 6 1 Scope and object 7 1.1 Scope 7 1.2 Object . 7 2 Normative references 7 3 Terms and definitions . 8 4 Requirements for component design and component specifications . 10 4.1 General requirement 10 4.2 Packagi
23、ng . 10 4.3 Labelling of product packaging . 10 4.4 Component marking 11 4.5 Storage and transportation . 12 4.6 Component outline and design . 12 4.7 Mechanical stress 16 4.8 Component reliability assurance 16 4.9 Additional requirements for compatibility with lead-free soldering . 16 5 Specificati
24、on of assembly process conditions 16 5.1 General . 16 5.2 Securing the component on the substrate prior to soldering 18 5.3 Mounting methods . 19 5.4 Cleaning (where applicable) . 20 5.5 Removal and/or replacement of SMDs . 21 6 Typical process conditions 22 6.1 Soldering processes, temperature/time
25、 profiles 22 6.2 Typical cleaning conditions for assemblies . 26 7 Requirements for components and component specifications related to suitability with various mounting processes . 27 7.1 General . 27 7.2 Wettability . 27 7.3 Resistance to dissolution of metallization . 27 7.4 Resistance to solderin
26、g heat 27 7.5 Resistance to cleaning solvent . 28 7.6 Soldering profiles . 28 7.7 Bonding strength test for the component glue interface test 28 Bibliography 30 Figure 1 Example of a component with marked specific orientation put in tape and tray 11 Figure 2 Vacuum pipette, pick-up area and componen
27、t compartment: Example for a component with a flat surface 13 Figure 3 Coplanarity of terminals . 13 Figure 4 Stable seating of component . 14 Figure 5 Unstable seating of component . 14 Figure 6 Terminals arranged peripherally in two rows 14 61760-1 IEC:2006 3 Figure 7 Good contrast to component bo
28、dy and surroundings . 14 Figure 8 Component weight/pipette suction strength . 15 Figure 9 Process steps for soldering . 17 Figure 10 Process steps for gluing 18 Figure 11 SnPb Vapour phase soldering Temperature/time profile (terminal temperature) . 22 Figure 12 Lead-free SnAgCu Vapour phase solderin
29、g Temperature/time profile (terminal temperature) . 23 Figure 13 Infrared soldering, forced gas convection reflow soldering Temperature/time profile for SnPb solders . 24 Figure 14 Infrared soldering, forced gas convection reflow soldering Temperature/time profile for lead-free SnAgCu solders 25 Fig
30、ure 15 Double wave soldering for SnPb and lead-free SnAgCu solder Temperature/time profile (terminal temperature) 26 Table 1 Basic cleaning processes . 26 4 61760-1 IEC:2006 INTERNATIONAL ELECTROTECHNICAL COMMISSION _ SURFACE MOUNTING TECHNOLOGY Part 1: Standard method for the specification of surfa
31、ce mounting components (SMDs) FOREWORD 1) The International Electrotechnical Commission (IEC) is a worldwide organization for standardization comprising all national electrotechnical committees (IEC National Committees). The object of IEC is to promote international co-operation on all questions con
32、cerning standardization in the electrical and electronic fields. To this end and in addition to other activities, IEC publishes International Standards, Technical Specifications, Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as “IEC Publication(s)”). Th
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40、tions. 8) Attention is drawn to the Normative references cited in this publication. Use of the referenced publications is indispensable for the correct application of this publication. 9) Attention is drawn to the possibility that some of the elements of this IEC Publication may be the subject of pa
41、tent rights. IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC 61760-1 has been prepared by IEC technical committee 91: Surface mounting technology. This second edition cancels and replaces the first edition, published in 1998, and constitute
42、s a technical revision. The main changes with regard to the previous edition concern: requirements related to leadfree soldering; extension of the scope to include also components mounted by gluing; direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat
43、; classification into categories based on the components ability to withstand resistance to soldering heat has been deleted. 61760-1 IEC:2006 5 This bilingual version (2014-02) corresponds to the monolingual English version, published in 2006-04. The text of this standard is based on the following d
44、ocuments: FDIS Report on voting 91/577/FDIS 91/588/RVD Full information on the voting for the approval of this standard can be found in the report on voting indicated in the above table. The French version of this standard has not been voted upon. The committee has decided that the contents of this
45、publication will remain unchanged until the maintenance result date indicated on the IEC web site under “http:/webstore.iec.ch“ in the data related to the specific publication. At this date, the publication will be reconfirmed; withdrawn; replaced by a revised edition, or amended. 6 61760-1 IEC:2006
46、 INTRODUCTION Specifications for electronic components have in the past been formulated for each component family. The regulations for environmental tests have been selected from IEC 60068 and other IEC and ISO publications. The overriding condition for this procedure was that all components, once i
47、nstalled in a piece of equipment, had to satisfy certain criteria. The introduction and increasing use of surface mounting components make it necessary to extend the existing requirements to include those arising from processing during assembly. Irrespective of the component family involved, all com
48、ponents on one and the same side of a printed circuit board are exposed to the same mounting process (see flow charts in Clause 5). Nevertheless there exists no harmonized standard that prescribes the content of a component specification. It is the purpose of this standard to define the general requ
49、irements for component specifications derived from the assembly processes. This is done in three steps. In the first step general requirements for component specifications and component design related to the handling and placement of the component on the substrate are given (Clause 4). In the second step the definition of reference process conditions as representative of a group of assembly
