IEC 61188-5-2-2003 Printed boards and printed board assemblies - Design and use - Part 5-2 Attachment (land joint) considerations Discrete components《印制电路板和印制电路板组件.设计和使用.第5-2部分 焊接(焊接区 焊缝)考虑.分立器件.pdf

《IEC 61188-5-2-2003 Printed boards and printed board assemblies - Design and use - Part 5-2 Attachment (land joint) considerations Discrete components《印制电路板和印制电路板组件.设计和使用.第5-2部分 焊接(焊接区 焊缝)考虑.分立器件.pdf》由会员分享，可在线阅读，更多相关《IEC 61188-5-2-2003 Printed boards and printed board assemblies - Design and use - Part 5-2 Attachment (land joint) considerations Discrete components《印制电路板和印制电路板组件.设计和使用.第5-2部分 焊接(焊接区 焊缝)考虑.分立器件.pdf（112页珍藏版）》请在麦多课文档分享上搜索。

1、NORMEINTERNATIONALECEIIECINTERNATIONALSTANDARD61188-5-2Premire ditionFirst edition2003-06Cartes imprimes et cartes imprimes quipes Conception et utilisation Partie 5-2:Considrations sur les liaisons pistes-soudures Composants discretsPrinted boards and printed board assemblies Design and use Part 5-

2、2:Attachment (land/joint) considerations Discrete componentsNumro de rfrenceReference numberCEI/IEC 61188-5-2:2003Numrotation des publicationsDepuis le 1er janvier 1997, les publications de la CEIsont numrotes partir de 60000. Ainsi, la CEI 34-1devient la CEI 60034-1.Editions consolidesLes versions

3、consolides de certaines publications de laCEI incorporant les amendements sont disponibles. Parexemple, les numros ddition 1.0, 1.1 et 1.2 indiquentrespectivement la publication de base, la publication debase incorporant lamendement 1, et la publication debase incorporant les amendements 1 et 2.Info

4、rmations supplmentairessur les publications de la CEILe contenu technique des publications de la CEI estconstamment revu par la CEI afin quil reflte ltatactuel de la technique. Des renseignements relatifs cette publication, y compris sa validit, sont dispo-nibles dans le Catalogue des publications d

5、e la CEI(voir ci-dessous) en plus des nouvelles ditions,amendements et corrigenda. Des informations sur lessujets ltude et lavancement des travaux entreprispar le comit dtudes qui a labor cette publication,ainsi que la liste des publications parues, sontgalement disponibles par lintermdiaire de: Sit

6、e web de la CEI (www.iec.ch) Catalogue des publications de la CEILe catalogue en ligne sur le site web de la CEI(http:/www.iec.ch/searchpub/cur_fut.htm) vous permetde faire des recherches en utilisant de nombreuxcritres, comprenant des recherches textuelles, parcomit dtudes ou date de publication. D

7、esinformations en ligne sont galement disponibles surles nouvelles publications, les publications rempla-ces ou retires, ainsi que sur les corrigenda. IEC Just PublishedCe rsum des dernires publications parues(http:/www.iec.ch/online_news/justpub/jp_entry.htm)est aussi disponible par courrier lectro

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9、41 22 919 03 00Publication numberingAs from 1 January 1997 all IEC publications areissued with a designation in the 60000 series. Forexample, IEC 34-1 is now referred to as IEC 60034-1.Consolidated editionsThe IEC is now publishing consolidated versions of itspublications. For example, edition numbe

10、rs 1.0, 1.1and 1.2 refer, respectively, to the base publication,the base publication incorporating amendment 1 andthe base publication incorporating amendments 1and 2.Further information on IEC publicationsThe technical content of IEC publications is keptunder constant review by the IEC, thus ensuri

11、ng thatthe content reflects current technology. Informationrelating to this publication, including its validity, isavailable in the IEC Catalogue of publications(see below) in addition to new editions, amendmentsand corrigenda. Information on the subjects underconsideration and work in progress unde

12、rtaken by thetechnical committee which has prepared thispublication, as well as the list of publications issued,is also available from the following: IEC Web Site (www.iec.ch) Catalogue of IEC publicationsThe on-line catalogue on the IEC web site(http:/www.iec.ch/searchpub/cur_fut.htm) enablesyou to

13、 search by a variety of criteria including textsearches, technical committees and date ofpublication. On-line information is also availableon recently issued publications, withdrawn andreplaced publications, as well as corrigenda. IEC Just PublishedThis summary of recently issued publications(http:/

14、www.iec.ch/online_news/justpub/jp_entry.htm)is also available by email. Please contact theCustomer Service Centre (see below) for furtherinformation. Customer Service CentreIf you have any questions regarding thispublication or need further assistance, pleasecontact the Customer Service Centre:Email

15、: custserviec.chTel: +41 22 919 02 11Fax: +41 22 919 03 00.NORMEINTERNATIONALECEIIECINTERNATIONALSTANDARD61188-5-2Premire ditionFirst edition2003-06Cartes imprimes et cartes imprimes quipes Conception et utilisation Partie 5-2:Considrations sur les liaisons pistes-soudures Composants discretsPrinted

16、 boards and printed board assemblies Design and use Part 5-2:Attachment (land/joint) considerations Discrete componentsPour prix, voir catalogue en vigueurFor price, see current catalogue IEC 2003 Droits de reproduction rservs Copyright - all rights reservedAucune partie de cette publication ne peut

17、 tre reproduite niutilise sous quelque forme que ce soit et par aucun procd,lectronique ou mcanique, y compris la photocopie et lesmicrofilms, sans laccord crit de lditeur.No part of this publication may be reproduced or utilized in anyform or by any means, electronic or mechanical, includingphotoco

18、pying and microfilm, without permission in writing fromthe publisher.International Electrotechnical Commission, 3, rue de Varemb, PO Box 131, CH-1211 Geneva 20, SwitzerlandTelephone: +41 22 919 02 11 Telefax: +41 22 919 03 00 E-mail: inmailiec.ch Web: www.iec.chCODE PRIXPRICE CODE XACommission Elect

19、rotechnique InternationaleInternational Electrotechnical Commission 2 61188-5-2 CEI:2003SOMMAIREAVANT-PROPOS . 8INTRODUCTION .121 Domaine dapplication.142 Rfrences normatives .143 Emballage 164 Rsistances fixes chipses rectangulaires 164.1 Remarque introductive.164.2 Description du composant164.3 Di

20、mensions du composant.184.4 Conception du cordon de brasure 204.5 Dimensions de la zone de report245 Rsistances fixes chipses cylindriques .285.1 Remarque introductive.285.2 Description du composant285.3 Dimensions du composant.305.4 Conception du cordon de brasure 305.5 Dimensions de la zone de rep

21、ort346 Condensateurs fixes chipses dilectrique en cramique multicouche.386.1 Remarque introductive.386.2 Description du composant386.3 Dimensions du composant.426.4 Conception du cordon de brasure 426.5 Dimensions de la zone de report467 Condensateurs fixes chipses au tantale 507.1 Remarque introduc

22、tive.507.2 Description du composant507.3 Dimensions du composant.527.4 Conception du cordon de brasure 527.5 Dimensions de la zone de report568 Condensateurs fixes chipses lectrolytiques laluminium lectrolyte non solide(de type vertical).608.1 Remarque introductive.608.2 Description du composant608.

23、3 Dimensions du composant.628.4 Conception du cordon de brasure 648.5 Dimensions de la zone de report669 Condensateurs fixes chipses lectrolytiques laluminium lectrolyte non solide(de type horizontal).709.1 Remarque introductive.709.2 Description du composant709.3 Dimensions du composant.729.4 Conce

24、ption du cordon de brasure 749.5 Dimensions de la zone de report7661188-5-2 IEC:2003 3 CONTENTSFOREWORD 9INTRODUCTION .131 Scope .152 Normative references153 Packaging.174 Fixed rectangular chip resistors 174.1 Introductory remark .174.2 Component description 174.3 Component dimensions .194.4 Solder

25、 joint fillet design .214.5 Land pattern dimensions255 Fixed cylindrical chip resistors 295.1 Introductory remark .295.2 Component description 295.3 Component dimensions .315.4 Solder joint fillet design .315.5 Land pattern dimensions356 Fixed multilayer ceramic chip capacitors.396.1 Introductory re

26、mark .396.2 Component description 396.3 Component dimensions .436.4 Solder joint fillet design .436.5 Land pattern dimensions477 Fixed tantalum chip capacitors517.1 Introductory remark .517.2 Component description 517.3 Component dimensions .537.4 Solder joint fillet design .537.5 Land pattern dimen

27、sions578 Fixed aluminium electrolytic chip capacitors with non-solid electrolyte(vertical type)618.1 Introductory remark .618.2 Component description 618.3 Component dimensions .638.4 Solder joint fillet design .658.5 Land pattern dimensions679 Fixed aluminium electrolytic chip capacitors with non-s

28、olid electrolyte(horizontal type)719.1 Introductory remark .719.2 Component description 719.3 Component dimensions .739.4 Solder joint fillet design .759.5 Land pattern dimensions77 4 61188-5-2 CEI:200310 Condensateurs fixes chipses dilectrique en film .8010.1 Remarque introductive.8010.2 Descriptio

29、n du composant8010.3 Dimensions du composant.8210.4 Conception du cordon de brasure 8410.5 Dimensions de la zone de report8611 Inductances fixes chipses (de type multicouche).9011.1 Remarque introductive.9011.2 Description du composant9011.3 Dimensions du composant.9211.4 Conception du cordon de bra

30、sure 9211.5 Dimensions de la zone de report9612 Inductances fixes chipses enroulement10013 Transistors SC-59/TO-236 .10014 Transistors SC-62/TO-243 .10015 Transistors SC-61/TO-253 .10016 Diodes SC-73 10017 Transistors SC-63/TO-252 .10018 Transistors SC-77100Bibliographie.102Figure 1 Emballage 16Figu

31、re 2 Construction dune rsistance fixe chipse rectangulaire18Figure 3 Dimensions dune rsistances fixe chipse rectangulaire20Figure 4 Protubrance de soudure .24Figure 5 Dimensions de la zone de report pour rsistances fixes chipsesrectangulaires .26Figure 6 Construction dune rsistance fixe chipse cylin

32、drique .28Figure 7 Dimensions dune rsistance fixe chipse cylindrique.30Figure 8 Protubrance de soudure .34Figure 9 Dimensions de la zone de report pour rsistances fixes chipsescylindriques.36Figure 10 Construction dun condensateur fixe chipse dilectrique en cramiquemulticouche.38Figure 11 Dimensions

33、 dun condensateur fixe chipse dilectrique en cramiquemulticouche.42Figure 12 Protubrance de soudure .46Figure 13 Dimensions de la zone de report pour condensateurs fixes chipses dilectrique en cramique multicouche.48Figure 14 Construction dun condensateur fixe chipse au tantale50Figure 15 Dimensions

34、 dun condensateur fixe chipse au tantale.52Figure 16 Protubrance de soudure .56Figure 17 Dimensions de la zone de report pour condensateurs fixes chipsesau tantale5861188-5-2 IEC:2003 5 10 Fixed film chip capacitors .8110.1 Introductory remark .8110.2 Component description 8110.3 Component dimension

35、s .8310.4 Solder joint fillet design .8510.5 Land pattern dimensions4211 Fixed chip inductors (multilayer type)9111.1 Introductory remark .9111.2 Component description 9111.3 Component dimensions .9311.4 Solder joint fillet design .9311.5 Land pattern dimensions9712 Fixed chip inductors (wire wound

36、type) .10113 SC-59/TO-236 Transistors .10114 SC-62/TO-243 Transistors .10115 SC-61/TO-253 Transistors .10116 SC-73 Diodes 10117 SC-63/TO-252 Transistors .10118 SC-77 Transistors101Bibliography103Figure 1 Packaging 17Figure 2 Fixed rectangular chip resistor construction19Figure 3 Fixed rectangular ch

37、ip resistor dimensions .21Figure 4 Solder joint protrusion 25Figure 5 Fixed rectangular chip resistor land pattern dimensions .27Figure 6 Fixed cylindrical chip resistor construction29Figure 7 Fixed cylindrical chip resistor dimensions .31Figure 8 Solder joint protrusion 35Figure 9 Fixed cylindrical

38、 chip resistor land pattern dimensions .37Figure 10 Fixed multilayer ceramic chip capacitor construction 39Figure 11 Fixed multilayer ceramic chip capacitor component dimensions43Figure 12 Solder joint protrusion 47Figure 13 Fixed multilayer ceramic chip capacitor land pattern dimensions 49Figure 14

39、 Fixed tantalum chip capacitor construction .51Figure 15 Fixed tantalum chip capacitor component dimensions.53Figure 16 Solder joint protrusion 57Figure 17 Fixed tantalum chip capacitor land pattern dimensions .59 6 61188-5-2 CEI:2003Figure 18 Construction dun condensateur fixe chipse lectrolytique

40、laluminium lectrolyte non solide (de type vertical) 60Figure 19 Dimensions dun condensateur fixe chipse lectrolytique laluminium(de type vertical) .62Figure 20 Protubrance de soudure .66Figure 21 Dimensions de la zone de report pour condensateurs fixes chipseslectrolytiques laluminium (de type verti

41、cal) 70Figure 22 Construction dun condensateur fixe chipse lectrolytique laluminium lectrolyte non solide (de type horizontal) 70Figure 23 Dimensions dun condensateur fixe chipse lectrolytique laluminium(de type horizontal) .72Figure 24 Protubrance de soudure .76Figure 25 Dimensions de la zone de re

42、port pour condensateurs fixes chipseslectrolytiques laluminium (de type horizontal) 78Figure 26a Condensateur empilement .41Figure 26b Condensateur enroulement80Figure 27a A empilement .82Figure 27b A enroulement 82Figure 28 Protubrance de soudure .86Figure 29 Dimensions de la zone de report pour co

43、ndensateurs fixes chipses dilectrique en film MPPS .88Figure 30 Construction dune inductance fixe chipse 90Figure 31 Dimensions dune inductance fixe chipse (de type multicouche) .92Figure 32 Protubrance de soudure .96Figure 33 Dimensions de la zone de report pour inductances fixes chipses.9861188-5-

44、2 IEC:2003 7 Figure 18 Fixed aluminium electrolytic chip capacitor with non-solid electrolyte(vertical type) construction 61Figure 19 Fixed aluminium electrolytic chip capacitor (vertical type) dimensions 63Figure 20 Solder joint protrusion 67Figure 21 Fixed aluminium electrolytic chip capacitor (ve

45、rtical type) land patterndimensions71Figure 22 Fixed aluminium electrolytic chip capacitor with non-solid electrolyte(horizontal type) construction 71Figure 23 Fixed aluminium electrolytic chip capacitor (horizontal type) dimensions 73Figure 24 Solder joint protrusion 77Figure 25 Fixed aluminium ele

46、ctrolytic chip capacitor (horizontal type)land pattern dimensions 79Figure 26a Stacked type.38Figure 26b Wound type 81Figure 27a Stacked type.83Figure 27b Wound type 39Figure 28 Solder joint protrusion 87Figure 29 MPPS film chip capacitor land pattern dimensions89Figure 30 Fixed chip inductor constr

47、uction .91Figure 31 Fixed chip inductor (multilayer type) component dimensions.93Figure 32 Solder joint protrusion 97Figure 33 Fixed chip inductor land pattern dimensions .99 8 61188-5-2 CEI:2003COMMISSION LECTROTECHNIQUE INTERNATIONALE_CARTES IMPRIMES ET CARTES IMPRIMES EQUIPES CONCEPTION ET UTILIS

48、ATION Partie 5-2: Considrations sur les liaisons pistes-soudures Composants discretsAVANT-PROPOS1) La CEI (Commission Electrotechnique Internationale) est une organisation mondiale de normalisationcompose de lensemble des comits lectrotechniques nationaux (Comits nationaux de la CEI). La CEI apour objet de favoriser la coopration internationale pour toutes les questions de normalisation dans lesdomaines de llectricit e