SAE ARP 6379-2016 Processes for Application-Specific Qualification of Electrical Electronic and Electromechanical Parts and Sub-Assemblies for Use in Aerospace Defense and High Per.pdf

《SAE ARP 6379-2016 Processes for Application-Specific Qualification of Electrical Electronic and Electromechanical Parts and Sub-Assemblies for Use in Aerospace Defense and High Per.pdf》由会员分享，可在线阅读，更多相关《SAE ARP 6379-2016 Processes for Application-Specific Qualification of Electrical Electronic and Electromechanical Parts and Sub-Assemblies for Use in Aerospace Defense and High Per.pdf（11页珍藏版）》请在麦多课文档分享上搜索。

1、_SAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising theref

2、rom, is the sole responsibility of the user.”SAE reviews each technical report at least every five years at which time it may be revised, reaffirmed, stabilized, or cancelled. SAE invites your written comments and suggestions.Copyright 2016 SAE InternationalAll rights reserved. No part of this publi

3、cation may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of SAE.TO PLACE A DOCUMENT ORDER: Tel: 877-606-7323 (inside USA and Canada)Tel: +1 724-776-4970 (out

4、side USA)Fax: 724-776-0790Email: CustomerServicesae.orgSAE WEB ADDRESS: http:/www.sae.orgSAE values your input. To provide feedback on thisTechnical Report, please visithttp:/standards.sae.org/ARP6379AEROSPACERECOMMENDED PRACTICEARP6379Issued 2016-11Processes for Application-Specific Qualification o

5、f Electrical, Electronic,and Electromechanical Parts and Sub-Assemblies for Use in Aerospace, Defense, and High Performance SystemsRATIONALEThe Aerospace, Defense, and High Performance (ADHP) industries are increasingly dependent on commercial-off-the-shelf (COTS) parts and sub-assemblies (hereinaft

6、er referred to as items). The qualification tests and methods typically used by the COTS item manufacturers are based on the needs of target markets other than ADHP markets, and therefore may not be adequate for ADHP applications. It is therefore critical for those who integrate COTS items into ADHP

7、 systems to assure that those items are qualified for the specific ADHP application.INTRODUCTIONThis Aerospace Recommended Practice describes an application-specific qualification process for electrical, electronic, and electromechanical (EEE) parts and sub-assemblies in aerospace, defense, and high

8、 performance (ADHP) systems.The ADHP industries are increasingly dependent on commercial-off-the-shelf (COTS) parts and sub-assemblies (hereinafter referred to as items, or COTS items). The qualification tests and methods typically used by COTS item manufacturers are based on the needs of target mar

9、kets which, typically, are markets other than ADHP markets; and therefore may not be adequate for ADHP applications. It is critical for those who integrate COTS items into ADHP systems to assure that those items are qualified for the specific ADHP application.This document distinguishes between gene

10、ric qualification, and application-specific qualification. Generic qualificationusually consists of a standardized set of tests and methods, to provide confidence that the qualified item will perform its intended function(s) reliably in the targeted generic application(s)1. In most instances, the ge

11、neric qualification methods, processes, and tests are defined by the item manufacturers; although in some cases (most notably that of the automotive industry), the customers interact with the item manufacturers to define the qualification tests and methods.References 1 through 10 are industry standa

12、rd generic qualification documents published by the JEDEC Solid State Technology Association, for use in qualification of solid-state electronic components. Likewise, References 11 through 45have been prepared for use in generic qualification of components for automotive applications. They contain m

13、uch useful information, but are not specific to applications of ADHP systems. Additionally, a number of military qualification documents (not listed here) have been prepared for a variety of generic military applications, but are not application-specific. Additionally, most EEE part and sub-assembly

14、 manufacturers have their own generic qualification processes, which are published, with test results, on their websites or other product literature. Generic qualification data and results may be useful as a baseline for application-specific qualification; but they are generally not sufficient for A

15、DHP applications without additional application-specific data and results.In contrast to generic qualification, application-specific qualification is typically performed by the ADHP user of the item, employing a set of tests and methods that are customized for the application, to provide assurance t

16、hat the qualified item will perform its intended function(s) reliably in the specific ADHP application.1 Examples of targeted applications are computers, telecommunications, automotive, consumer electronics, etc. The market segment of items targeted for ADHP applications is miniscule, and the costs

17、of ADHP-targeted items cannot be justified in the majority of ADHP applications.SAE INTERNATIONAL ARP6379 Page 2 of 11It is rarely the case that any generic qualification test conditions will match the application-specific in-service conditions exactly; and it is important to understand and use appr

18、opriate acceleration models to convert test results to estimates of the behavior of the item in service. That process is therefore integral to the overall process described here.1. SCOPEThis document describes a process for use by ADHP integrators of EEE parts and sub-assemblies (items) that have be

19、en targeted for other applications2.This document does not describe specific tests to be conducted, sample sizes to be used, nor results to be obtained; instead, it describes a process to define and accomplish application-specific qualification; that provides confidence to both the ADHP integrators,

20、 and the integrators customers, that the item will performs its function(s) reliably in the ADHP application.2. REFERENCES2.1 For dated references, only the revision cited applies. For undated references, the latest revision of the referenced document (including any amendments) applies. Since compli

21、ance to any of the listed references is not required by this document, the user is encouraged to use later revisions than those listed, provided that the later revisions do not include substantial variations from the listed revisions.1. JESD94B, Application Specific Qualification Using Knowledge Bas

22、ed Test Methodology, JEDEC Solid State Technology Association, September 20112. JESD47I, Stress-Test-Driven Qualification of Integrated Circuits, JEDEC Solid State Technology Association, April 20113. JEP143C, Solid-State Reliability Assessment and Qualification Methodologies, JEDEC Solid State Tech

23、nology Association, June 20084. JEP150.01, Stress-Test-Driven Qualification of and Failure Mechanisms Associated with Assembled Solid-State Surface-Mount Components, JEDEC Solid State Technology Association, June 20115. JESD237, Reliability Qualification of Power Amplifier Modules, JEDEC Solid State

24、 Technology Association, March 20146. JEP122G, Failure Mechanisms and Models for Semiconductor Devices, JEDEC Solid State Technology Association, November 20107. JESD91A, Method for Developing Acceleration Models for Electronic Component Failure Mechanisms, JEDEC Solid State Technology Association,

25、January 20118. JESD85, Method for Calculating Failure Rates in Units of FITS, JEDEC Solid State Technology Association, January 20149. JESD74A, Early Life Failure Rate Calculation Procedure for Semiconductor Components, April 200010. JESD22, Series of Test Method Documents, JEDEC Solid State Technol

26、ogy Association11. AEC-Q100, Failure Mechanism Based Stress Test Qualification for Integrated Circuits (References 2 through 11 are subordinate documents to this reference. Specific revisions to References 1 through 11 are not shown here.)12. AEC-Q100-001, Wire Bond Shear Test2 This document does no

27、t include “shall” statements, and in that sense it is not a requirements document; however, it is written in a manner that it can be used as a requirement in a contract by stating that the processes described herein shall be followed.SAE INTERNATIONAL ARP6379 Page 3 of 1113. AEC-Q100-002, Human Body

28、 Model Electrostatic Discharge Test14. AEC-Q100-004, IC Latchup Test15. AEC-Q100-005, Non-Volatile Memory Program/Erase Endurance, Data Retention, and Operational Life Test16. AEC-Q-100-007, Fault Simulation and Test Grading17. AEC-Q100-008, Early Life Failure Rate (ELFR)18. AEC-Q100-009, Electrical

29、 Distribution Assessment19. AEC-Q100-010, Solder Ball Shear Test20. AEC-Q100-011, Charged Device Model (CDM) Electrostatic Discharge Test21. AEC-Q100-012, Short Circuit Reliability Characterization of Smart power Devices for 12V Systems22. AEC-Q101, Failure Mechanism Based Stress Test Qualification

30、for Discrete Semiconductors 23. AEC-Q101-001, Rev. A, Human Body Model (HBM) Electrostatic Discharge Test24. AEC-Q101-003, Rev. A, Wire Bond Shear Test25. AEC-Q101-004, Miscellaneous Test Methods26. AEC-Q101-005, Charged Device Model (CDM) Electrostatic Discharge Test27. AEC-Q101-006, Short Circuit

31、Reliability Characterization of Smart Power Devices for 12V Systems28. AEC-Q200, Stress Test Qualification for Passive Components 29. AEC-Q200, Rev. D, Base: Stress Test Qualification for Passive Components (base document)30. AEC-Q200-001, Rev. B, Flame Retardance Test31. AEC-Q200-002, Rev. B, Human

32、 Body Model (HBM) Electrostatic Discharge Test32. AEC-Q200-003, Rev. B, Beam Load (Break Strength) Test33. AEC-Q200-004, Rev. A, Measurement Procedures for Resettable Fuses34. AEC-Q200-005, Rev. A, Board Flex/Terminal Bond Strength Test35. AEC-Q200-006, Rev. A, Terminal Strength (SMD)/Shear Stress T

33、est36. AEC-Q200-007, Rev. A, Voltage Surge Test37. AEC-Q001, Rev. D, Guidelines for Part Average Testing (provides guidelines for using statistical techniques and extended operating conditions to establish part test limits; this approach could be used to provide “Known Good Die.“)38. AEC-Q002, Rev.

34、B, Guidelines for Statistical Yield Analysis (provides guidelines for using statistical techniques to detect and remove abnormal lots of integrated circuits)39. AEC-Q003, Rev. A, Guidelines for Characterizing the Electrical Performance of Integrated Circuit ProductsSAE INTERNATIONAL ARP6379 Page 4 o

35、f 1140. AEC-Q004, Proposed Draft, Zero Defects Guideline (describes a set of tools and processes which suppliers and users of integrated circuits can use to approach or achieve the goal of zero defects during a products lifetime) 41. AEC-Q005, Rev. A, Pb-Free Test Requirements (Contains a set of tes

36、ts and defines the minimum requirements for qualification of lead free (Pb-free) metallurgy for components to be used in any automotive electronics application)42. AEC-Q006, Qualification Requirements for Components Using Copper (Cu) Wire Interconnects.43. AEC-CDC, Certificate of Design, Constructio

37、n and Qualification (as published in AEC-Q100 Rev. H)44. AEC-QTP, Qualification Test Plan (as published in AEC-Q100, Rev. H)45. MIL-STD-810G, Environmental Engineering Considerations and Laboratory Tests, April 15, 201446. EIA-STD-4899B, Requirements for an Electronic Components Management Plan, SAE

38、 International, February 1, 201547. EIA-933B, Requirements for a COTS Assembly Management Plan, SAE International, March 1, 201548. ARP5890, Guidelines for Preparing Reliability Assessment Plans for Electronic Engine Controls, SAE International, February 1, 201149. SAE J2816, Guide for Reliability A

39、nalysis Using a Physics-of-Failure Process, December 1, 2009SAE publications are available from SAE International, 400 Commonwealth Drive, Warrendale, PA 15096-0001, Tel: 877-606-7323 (inside USA and Canada) or +1 724-776-4970 (outside USA), www.sae.org.2.2 DefinitionsACCELERATION MODEL: An equation

40、, or set of equations, used to transform the data obtained from testing or use at one set of conditions, to data that can be used to estimate behavior at another set of conditions. APPLICATION-SPECIFIC QUALIFICATION: A qualification process that is typically performed by the user of an item, employi

41、ng a set of tests and methods that are customized for the application, to provide assurance that the qualified item will perform its intended function(s) reliably in the specific application.GENERIC QUALIFICATION: A qualification process that is typically performed by the producer of an item, employ

42、ing a standardized set of tests and methods, to provide confidence that the qualified item will perform its intended function(s) reliably in the targeted generic application.3. APPLICATION-SPECIFIC QUALIFICATION PROCESSThe process for application-specific qualification of items for use in ADHP appli

43、cations includes the steps described in 3.1 to 3.7, and illustrated in the flow charts of Appendices A and B. Paragraph 3.7 describes documentation of the results of steps 3.1 through 3.6.3.1 Document the Application-Specific RequirementsDocument the requirements to be satisfied by the item in the A

44、DHP application in which the item is intended for use, including environmental conditions, and design and operating requirements. Typically, the requirements are found in the specifications, contracts, and design documents for the application.SAE INTERNATIONAL ARP6379 Page 5 of 113.1.1 Identify the

45、Environmental and Operating ConditionsIdentify, quantify, and document all relevant environmental and operating conditions that the item will experience throughout its life cycle, including transportation, storage, operation, and maintenance.(This includes, but is not limited to the following, inclu

46、ding both the level of the stress and the exposure time: xTemperature limits;xTemperature variations;xHeat dissipation and cooling;xMechanical shock;xMechanical vibration;xNatural radiation;xInduced radiation;xMoisture and corrosion;xElectromagnetic capability;xElectrical stresses;xEtc.)(A more comp

47、lete description of operating and environmental stresses may be found in Reference 46, 47, and 49. In addition, Reference 49 provides guidance on documenting life cycle environmental profile and operating environment conditions.)3.1.2 Identify the Design and Operating RequirementsIdentify, quantify,

48、 and document all requirements related to the design and operation of the item in the application, exclusive of functional performance requirements.(Examples include:xExpected operating lifetime;xOperating voltage and electric field;xPower cycles per unit time;xNumber and duration of transient state

49、s, e.g., hibernation, standby;xCumulative end-of-life failure rate;xEarly life failure rate.) SAE INTERNATIONAL ARP6379 Page 6 of 113.2 Define the Potential Failure MechanismsDefine and document the potential failure mechanisms for the item when exposed to the stresses identified, quantified, and documented in 3.1 and 3.2. A physics-of-failure analysis can be performed to identify potential failure mechanisms.(R