JEDEC ECA JS709B-2015 Definition of Low-Halogen For Electronic Products.pdf

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1、JOINT JEDEC/ECA STANDARD Definition of “Low-Halogen” For Electronic Products JS709B (Revision of JS709A, May 2012) APRIL 2015 JEDEC SOLID STATE TECHNOLOGY ASSOCIATION ELECTRONIC COMPONENTS ASSOCIATION Electronic Components AssociationStandardsNOTICE JEDEC standards and publications contain material

2、that has been prepared, reviewed, and approved through the JEDEC Board of Directors level and subsequently reviewed and approved by the JEDEC legal counsel. JEDEC standards and publications are designed to serve the public interest through eliminating misunderstandings between manufacturers and purc

3、hasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for use by those other than JEDEC members, whether the standard is to be used either domestically or internationally. JEDEC standards and

4、publications are adopted without regard to whether or not their adoption may involve patents or articles, materials, or processes. By such action JEDEC does not assume any liability to any patent owner, nor does it assume any obligation whatever to parties adopting the JEDEC standards or publication

5、s. The information included in JEDEC standards and publications represents a sound approach to product specification and application, principally from the solid state device manufacturer viewpoint. Within the JEDEC organization there are procedures whereby a JEDEC standard or publication may be furt

6、her processed and ultimately become an ANSI standard. No claims to be in conformance with this standard may be made unless all requirements stated in the standard are met. Inquiries, comments, and suggestions relative to the content of this JEDEC standard or publication should be addressed to JEDEC

7、at the address below, or refer to www.jedec.org under Standards and Documents for alternative contact information. Published by JEDEC Solid State Technology Association 2015 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 This document may be downloaded free of charge; however JEDEC

8、retains the copyright on this material. By downloading this file the individual agrees not to charge for or resell the resulting material. PRICE: Contact JEDEC Printed in the U.S.A. All rights reserved PLEASE! DONT VIOLATE THE LAW! This document is copyrighted by JEDEC and may not be reproduced with

9、out permission. For information, contact: JEDEC Solid State Technology Association 3103 North 10th Street Suite 240 South Arlington, VA 22201-2107 or refer to www.jedec.org under Standards-Documents/Copyright Information. Joint JEDEC/ECA Standard No. 709B -i- DEFINITION OF “LOW-HALOGEN” FOR ELECTRON

10、IC PRODUCTS _Contents_ Foreword ii Introduction ii 1 Scope 1 2 Reference documents 2 3 Terms and definitions 3 4 Requirements for low-halogen electronic products 5 5 Compliance process for low-halogen electronic materials and components 5 6 Marking and labeling for low-halogen electronic products 6

11、Annexes (Informative) A Where BFRs, CFRs, and PVC are used in electronic or electrical products 7 B Suggested test protocols low-halogen process flow 8 C Clarification for including only Bromine however, this document will use the term “low-halogen” to refer only to bromine and chlorine to be consis

12、tent with the International Electrotechnical Commission (IEC) and IPC definitions of “halogen-free” (see 2.4). Refer to Annex C for further explanation for exclusion of astatine, iodine and fluorine. In this document, the term “low-halogen” is used to identify a material that contains low concentrat

13、ions of bromine and chlorine from brominated and chlorinated flame retardants (BFRs, CFRs) and polyvinyl chloride (PVC). Joint JEDEC/ECA Standard No. 709B Page 1 DEFINITION OF “LOW-HALOGEN” FOR ELECTRONIC PRODUCTS (From JEDEC Board Ballot JCB-15-13, formulated under the cognizance of the JEDEC JC-14

14、.4 Subcommittee on Quality Processes and Methods and the ECA S-1 Passive Components Steering Committee.) 1 Scope This standard provides terms and definitions for “low-halogen” electronic products that have the potential to contain the halogens bromine (Br) and chlorine (Cl) from the use of BFRs, CFR

15、s, and PVC, and recommends methods for marking and labeling. This standard may be applied to all nonmetallic and nonceramic materials within electronic products including, but not limited to, materials in the following components commonly found in electronic products: 1. Transistors, integrated circ

16、uits, modules consisting mainly of integrated circuits (e.g., multichip, hybrid), and memory modules 2. Resistors, capacitors, relays, inductors, and connectors 3. Printed circuit board assemblies (PCBAs) including components 4. Plastic in cables, sockets, switches and external wiring 5. Mechanical

17、plastics (enclosures, fans, etc.) 6. Films, tapes, inks, and adhesives 7. Soldering flux residues (when present) 8. Sound, shock, and vibration dampeners (foams, resins, etc.) This document establishes the maximum concentration level for the halogens bromine (Br) and chlorine (Cl) from the use of BF

18、Rs, CFRs, and PVC. While the halogen group contains fluorine, chlorine, bromine, iodine, and astatine, this document will use the term “low-halogen” to refer only to bromine and chlorine. Refer to Annex C for further explanation for exclusion of astatine, iodine and fluorine. NOTE The definition of

19、“low-halogen” is different from the term “halogen-free” as described in IEC 61249-2 sectional standard related to non-halogenated base material and as defined in the J-STD-609A marking and labeling standard; standards that pertain only to printed boards and are currently in use in the electronics an

20、d solid-state industries. BFRs, CFRs, and PVC in materials that may be used during processing, in product delivery systems, or in packaging, but do not remain within the final product are not included in the scope of this document. Joint JEDEC/ECA Standard No. 709B Page 2 2 Reference documents 2.1 I

21、EC1(IEC 62321 Ed. 1: 2008 “Electrotechnical products - Determination of levels of six regulated substances (lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls, polybrominated diphenyl ethers) IEC 61189-2 Test methods for electrical materials, printed boards and other interconnecti

22、on structures and assemblies EN 14582:2007-06 Characterization of waste - Halogen and sulphur content - Oxygen combustion in closed systems and determination methods IEC 61249-2 Materials for printed boards and other interconnecting structures sectionals: - Part 2-21: Reinforced base materials, clad

23、 and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burn

24、ing test), copper-clad - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad - Part 2-26 Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced lamina

25、ted sheets of defined flammability (vertical burning test), copper-clad 2.2 IPC2IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits IPC-4101 Specification for Base Materials for Rigid and Multilayer Printed Boards IPC/JEDEC J-STD-609 Marking and Labeling of Component

26、s, PCBs and PCBAs to Identify Lead (Pb), Pb-free and Other Attributes IPC-TM-650 TM 2.3.41 Test Method for Total Halogen Content in Base Materials IPC/WP/TR-584A IPC White Paper and Technical Report on the Use of Halogenated Flame Retardants in Printed Circuit Boards and Assemblies 2.3 ISO3ISO 11469

27、:2000 Plastics Generic identification and marking of plastics products ISO 1043-4:1998 Plastics - Symbols and abbreviated terms - Part 4: Flame retardants 2.4 JEDEC4JESD88 JEDEC Dictionary of Terms for Solid-state Technology 1www.iec.ch 2www.ipc.org 3www.iso.org 4www.jedec.org Joint JEDEC/ECA Standa

28、rd No. 709B Page 3 2 Reference documents (contd) 2.5 JEITA5MC-001 Guideline of Halogen Free Epoxy Molding Compound for Semiconductor 2.6 JPCA6JPCAES01 Test Method for Halogen Free Materials 3 Terms and definitions For the purposes of this publication, the following terms and definitions apply. For o

29、ther terms, the definitions in JESD88 and/or IPC-T-50 apply. At astatine BFR brominated flame retardant Br bromine Cl chlorine CFR chlorinated flame retardant F fluorine FR flame retardant I iodine IC Ion Chromatography IEC International Electrotechnical Commission ISO International Organization for

30、 Standardization PBDE polybrominated diphenyl ether PCB printed circuit board PCBA printed circuit board assembly PPM parts per million PTFE Polytetrafluoroethylene PVC polyvinyl chloride TBBPA tetrabromobisphenol-A XRF x-ray fluorescence 5www.jeita.jp 6www.jpca.org Joint JEDEC/ECA Standard No. 709B

31、 Page 4 3 Terms and definitions (contd) block polymer: A substance composed of block macromolecules (IUPAC definition) brominated/chlorinated flame retardants (BFR/CFR): Flame retardants that contain bromine and/or chlorine. NOTE These compounds are typically added to or reacted into polymers such a

32、s certain epoxy resins and thermoplastics to reduce their flammability. Examples include, but are not limited to, tetrabromobisphenol-A (TBBPA), brominated epoxy resins, and polybrominated diphenyl ethers (PBDEs). congener (within the context of this standard): A member of the same kind, class or gr

33、oup of compounds with similar structures and similar chemical properties. copolymer: A polymer derived from more than one species of monomer. (IUPAC definition) electronic device: A device whose operation depends on the conduction of electrons and/or holes in vacuum, gas, or semiconductor. NOTE Exam

34、ples of electronic devices include transistors, integrated circuits, hybrid integrated circuits, and modules containing active electronic components. electronic product: An item containing one or more electronic devices performing major functions. low-halogen: Meeting the criteria established in cla

35、use 4 of this document. NOTE Low halogen electronic products may still contain some halogens, providing, of course, that each material in them meets the requirements in clause 4. plastic: Any of a group of synthetic or natural organic compounds produced by polymerization, optionally combined with ad

36、ditives (organic or inorganic fillers, modifiers, etc.) into a homogeneous material capable of being molded, extruded, or cast into various shapes and films. polymer alloy: A polymer blend (considered to be an alloy) that contains either a crystallizable component or two relatively rigid or amorphou

37、s polymers Joint JEDEC/ECA Standard No. 709B Page 5 4 Requirements for low-halogen electronic products The halogens fluorine (F), iodine (I), and astatine (At) are not covered by this document (see annex C). Bromine (Br) and chlorine (Cl) refer to all oxidation states of these elements. Bromine (Br)

38、 and chlorine (Cl) in materials that may be used during processing but do not remain within the final product are not included in this definition. For an electronic product to be defined as “low-halogen”, each material within the product must meet all of the following requirements. 1) Each material

39、within an electronic product, (excluding printed board laminates) shall contain 1000 ppm (0.1%) by weight of bromine if the bromine source is from BFRs and 1000 ppm (0.1%) by weight of chlorine if the chlorine source is from CFRs, PVC, PVC congeners, PVC block polymers, PVC copolymers, or polymer al

40、loys containing PVC. Higher concentrations of bromine and chlorine are allowed in plastics contained within electronic products (other than printed board laminates contained within those devices) as long as their sources are not flame retardants, PVC, PVC congeners, PVC block polymers, PVC copolymer

41、s, or polymer alloys containing PVC. 2) All printed board laminates contained within electronic and electrical products, including those within a passive or solid-state device shall meet the “halogen-free” requirements for Br and Cl as defined in the most current version of one of the following spec

42、ifications: IEC 61249-2, IPC-4101, JPCA-ES-01. NOTE See Annex A for a list of likely uses of flame retardants, PVC, PVC congeners, PVC block polymers, PVC copolymers, or polymer alloys containing PVC within electronic products. 5 Compliance process for low-halogen electronic materials and components

43、 An electronic product often contains many materials / components from a complex and global supply chain. Therefore, all individual entities or suppliers within the chain have to be required to take responsibility for ensuring that the materials / components that they supply meet this standards requ

44、irements. Each supplier / individual entity within the supply chain is only responsible to prove compliance to their respective customer for the material / component that they supply. Any material / component that is declared to be “low-halogen” per Clause 4 herein must be supported by proof that su

45、bstantiates the claim. Since there is not a single, simple, cost-effective, and reliable test method that covers the spectrum of materials / components included in electronic products, customers and suppliers should mutually agree on the best method to demonstrate compliance to this document. If ana

46、lytical testing is used, elemental Br and Cl analysis is the most expedient and cost effective to perform. (IEC 62321 provides screening and analytical test methods for some but not all of the substances within the scope of this document.) If results detect Br or Cl above 1000ppm threshold, the supp

47、lier should determine if the source of the Br or Cl is from flame retardants, PVC, PVC congeners, PVC block polymers, PVC copolymers, or polymer alloys containing PVC. The proof of compliance documents may include material declarations, datasheets and / or analytical data. Joint JEDEC/ECA Standard N

48、o. 709B Page 6 6 Marking and labeling for “low-halogen” electronic products 6.1 Marking of printed boards If all materials used in the fabrication of a finished printed board laminate contained within a passive or solid-state device meet the requirements in 4, item 1, and if marking is required, the

49、 marking shall be in accordance with J-STD-609. 6.2 Marking of mechanical plastics Mechanical plastic parts contained within a passive or solid-state device may be marked / labeled in accordance with ISO 11469:2000. Compositions containing flame retardants may be marked per ISO 1043-4:1998. 6.3 Marking of passive and solid-state devices, cables, and other components of an electronic product Marking is not required on passive or solid-state devices to denote low-halogen status. As an alternative,