GEIA SSB-1 002-1999 Environmental Tests and Associated Failure Mechanisms Annex to SSB-1 Guidelines for Using Plastic Encapsulated Microcircuits and Semiconductors in Military Aero.pdf
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1、 GEIA ENGINEERING BULLETIN Environmental Tests and Associated Failure Mechanisms SSB-1.002 (Annex to SSB-1, Guidelines for Using of Plastic Encapsulated Microcircuits and Semiconductors in Military, Aerospace and Other Rugged Applications) OCTOBER 1999 GOVERNMENT ELECTRONICS AND INFORMATION TECHNOLO
2、GY ASSOCIATION SSB-1.002 A Sector of the Electronic Industries Alliance Copyright Government Electronics distribution is unlimited. Copyright Government Electronics reliability tests can run thousands of hours in order to get useful results.Copyright Government Electronics & Information Technology A
3、ssociation Provided by IHS under license with GEIA Not for ResaleNo reproduction or networking permitted without license from IHS-,-,-SSB-1.00253.6 Highly Accelerated Stress TestThe Highly Accelerated Stress Test (HAST) is performed to evaluate the non-hermeticpackaging of solid state devices in hum
4、id environments. This test uses a high temperature(usually 130C), high relative humidity (about 85%), under high atmospheric pressure conditions(up to 3 atm) to accelerate the penetration of moisture through the external protective material orat the seals around the chip leads. Once moisture reaches
5、 the die surface (as described forTHB), the electric potential helps transform the device into an electrolytic cell. This in turnaccelerates the corrosion failure mechanism.This test is intended to precipitate failure mechanisms associated with metallization corrosion,delamination at material interf
6、aces, wirebond failures, and reduced insulation resistance. Oneshould exercise caution when evaluating results of HAST tests performed at temperatures higherthan 130C. Such tests can precipitate different failure mechanisms that would not be seenduring normal device operation.HAST was developed espe
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