EN 62326-1-2002 en Printed Boards Part 1 Generic Specification《印制板 第1部分 通用规范 IEC 62326-1-2002》.pdf

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1、BRITISH STANDARD Printed boards Part 1 : Generic specification The European Standard EN 62326-1 :2002 has the status of a British Standard ICs 31.180 BS EN 62326-1 12002 British Standards NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW BS EN 62326-1 12002 National foreword Thi

2、s British Standard is the official English language version of EN 62326-1:2002. It is identical with IEC 62326-1:2002. It supersedes BS EN 62326-1: 1997 which is withdrawn. The UKparticipation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology, which has

3、the responsibility to: This British Standard, having been prepared under the direction of the Electrotechnical Sector Policy and Strategy Committee, was published under the authority of the Standards Policy and Strategy Committee on 16 August 2002 - - aid enquirers to understand the text; present to

4、 the responsible international/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. - A list of organizations represented on this committee can be ob

5、tained on request to its secretary. From 1 January 1997, all IEC publications have the number 60000 added to the old number. For instance, IEC 27-1 has been renumbered as IEC 60027-1. For a period oftime during the change over from one numbering system to the other, publications may contain identifi

6、ers from both systems. Cros s-r e ferenc es The British Standards which implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search”faci1ity ofthe BS

7、I Electronic Catalogue or of British Standards Online This publication does not purport to include all the necessary provisions of a contract. Users are responsible for their correct application. Compliance with a British Standard does not ofitself confer immunity from legal obligations. Summary of

8、pages This document comprises a front cover, an inside front cover, the EN title page, pages 2 to 53 and a back cover. The BSI copyright date displayed in this document indicates when the document was last issued. Amendments issued since publication Amd.No. I Date I Comments O BSI 16 August 2002 ISB

9、N O 580 40265 7 EUROPEAN STANDARD EN 62326-1 NORME EUROP .ENNE EUROPfISCHE NORM June 2002 ICs 31.180 Supersedes EN 62326-1 :I997 English version Printed boards Part 1 : Generic specification (IEC 62326-1 12002) Cartes imprimes Partie I : Spcification gnrique (CE1 62326-1 12002) Leiterplatten Teil 1

10、: Fachgrundspezifikation (I EC 62326-1 12002) This European Standard was approved by CENELEC on 2002-06-01. CENELEC members are bound to comply with the CENKENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alte

11、ration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by t

12、ranslation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the oficial versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Czech Republic, Denmark, Finland, France, Germany, Gree

13、ce, Hungary, Iceland, Ireland, Italy, Luxembourg, Malta, Netherlands, Norway, Portugal, Slovakia, Spain, Sweden, Switzerland and United Kingdom. CENELEC European Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique EuropYkches Komitee f, r Elektrotechnische

14、Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels O 2002 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No. EN 62326-1:2002 E Page 2 EN62326-12002 Foreword The text of document 91/274/FDIS, future edition 2 of IEC 62326

15、-1, prepared by IEC TC 91, Electronics assembly technology, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62326-1 on 2002-06-01. This European Standard supersedes EN 62326-1 :I997 The following dates were fixed: latest date by which the EN has to be implemented at

16、national level by publication of an identical national standard or by endorsement latest date by which the national standards conflicting with the EN have to be withdrawn (dop) 2003-03-01 (dow) 2005-06-01 Annexes designated “normative“ are part of the body of the standard. Annexes designated “inform

17、ative“ are given for information only. In this standard, annexes M and ZA are normative and annexes A, B, C, D, E, F, G, H, I, J, K and L are informative. Annex ZA has been added by CENELEC. Endorsement not i ce The text of the International Standard IEC 62326-1:2002 was approved by CENELEC as a Eur

18、opean Standard without any modification. Page 3 EN62326-12002 CONTENTS INTRODUCTION . 6 1 Scope 7 2 Normative references 7 3 General 8 3.1 General considerations 8 3.2 Structure of the specification series . 9 4 Particular stipulations 12 4.1 Primary stage of manufacture 12 4.2 Structurally similar

19、printed boards 12 4.3 Certified records of released lots (CRRL) . 12 4.4 Delayed delivery 12 4.5 Release for delivery before the completion of all tests 13 4.6 Re-submission of rejected lots . 13 4.7 Marking of printed boards and package 13 4.7.1 Printed boards . 13 4.7.2 Package 13 4.8 Ordering inf

20、ormation 13 Capability approval and maintenance of capability approval . 13 5.1 General . 13 5.2 Capability approval requirements . 14 5.3 Description of capability . 14 5.4 Register of firms, products and services information (RFPS) 14 5.5 Demonstration of IECQ capability . 15 5.5.1 Test programme

21、15 5.5.2 Product capability 15 5.5.3 Process capability 16 Capability approval test report 17 Range of capability approval 17 5.7.1 Range of product capability 17 5.7.2 Range of process capability . 17 5.7.3 Extended range of approval of product/process capability . 17 5.7.4 Significant changes 18 5

22、.7.5 Amendment procedures . 18 5.8 Maintenance of capability approval 18 5.9 Suspension and withdrawal of capability approval 19 5.1 O Capability approval testing . 19 5.1 1 Inspection information in the Cap DS . 19 6 Quality assessment . 19 6.1 Quality conformance inspection . 19 6.2 Groupings of t

23、ests . 20 5 5.6 5.7 Page 4 EN62326-12002 6.2.1 Category V inspection (visual) 21 6.2.2 Category D inspection (dimensional) 21 6.2.3 Category S inspection (surface condition) . 21 6.2.4 Category E inspection (electrical) . 22 6.2.5 Category P inspection (physical) 22 6.2.6 Category Y inspection (stru

24、cture integrity) 22 6.2.7 Category Z inspection 22 6.3 Inspection information in the CDS 22 6.4 IECQ technology approval . 23 6.5 Indirect measuring methods . 23 Rules for the preparation of detail specifications . 23 7.1 Capability detail specification (Cap DS) 23 7.1 . 1 Requirements for the prepa

25、ration of the Cap DS 23 7.1.2 Numbering and content 23 7.1.3 Drawing information . 24 Customer detail specification (CDS) . 24 7.2.1 General . 24 7.2.2 Numbering and content 25 7.2.3 Drawing information . 25 7.2.4 Electronic manufacturing data 26 7.2.5 Marking . 26 7.2.6 Performance requirements . 2

26、6 7.2 Annex A (informative) Example of a CDS check-list . 27 Annex B (informative) Future structure of the specification series 28 Annex C (informative) Structure of the capability qualifying component (CQC) . 29 Annex D (informative) Abbreviations and acronyms related to IECQ and their explanations

27、 . 30 Annex E (informative) Guide to the form and content of a capability manual . 31 E.l General requirements 31 E.2 Scope of capability approva 33 E.3 Technology (process description) . 33 E.4 Subcontracting . 34 E.5 Limits of capability . 34 E.6 Description of capability . 35 E.7 Manufacturer to

28、customer interface 36 E.8 Design rules . 36 E.9 Materials list 36 E.10 Manufacture 36 E.ll Procedure in the event of CQC or product failure 37 E.12 Test programme for capability approval 37 E.13 Maintenance of approval 39 E.14 Modifications to the capability approval . 39 Page 5 EN62326-12002 Annex

29、F (informative) Example of process description . 41 F.l F.2 F.3 F.4 F.5 F.6 F.7 F.8 Base materials . 41 Basic processing method . 41 Method of pattern or image definition . 41 Method of producing holes . 41 Method of producing board shape 41 Method of construction 41 Metallic and organic finishes 41

30、 Types of interconnections 41 Annex G (informative) Example of limits of approval 42 Annex H (informative) Example of description of capability 43 Annex I (informative) Example of manufacturer-to-customer interface . 44 Annex J (informative) Example of CQC detail specification 45 Annex K (informativ

31、e) Example of test programme matrix 48 Annex L (informative) Example of test programme schedule 49 Annex M (normative) Requirements for capability approval test reports 50 Annex ZA (normative) Normative references to international publications with their corresponding European publications 52 Table

32、1 . Sample size selection 20 Table C.l . Capability qualifying component (CQC) . 29 Table E.l . Content of a capability manual 33 Page 6 EN62326-12002 INTRODUCTION IEC 62326 is applicable to printed boards, irrespective of their method of manufacture, when they are ready for the mounting of componen

33、ts. IEC 62326 is composed of separate parts covering information for the designer, manufacturer, and user generic, sectional and capability detail specifications for the IECQ and requirements for the various types of printed boards. IECQ is the IEC quality assessment system for electronic components

34、. It is a third-party certification system. Its rules (including a description of the role of the inspectorates) are published in the following: - - This part of IEC 62326 comprises the generic specification for printed boards of assessed quality and forms part of the sectional specifications and ca

35、pability detail specifications circulated to the National Committees. IEC QC 001001: Basic Rules; IEC QC 001002: Rules of Procedure (several parts). EXAMPLE For rigid multilayer printed board the following standards apply: IEC 62326-1, IEC 62326-4 and IEC 62326-4-1. All three standards should be con

36、sidered jointly. For further information regarding specification structure and inter-relationship between the specifications, see annex B. Page 7 EN62326-12002 PRINTED BOARDS - Part 1 : Generic specification 1 Scope This part of IEC 62326 defines capability approval (CA) procedures for printed board

37、s. When IECQ recognition is required, the capability approval procedures of IEC O01 002 should be used. In addition, a technology approval (TA) schedule may also be provided as an alternative for manufacturers employing a system of process control for establishing product conformity. Both CA and TA

38、procedures apply to printed boards irrespective of their methods of manufacture, when they are ready for the mounting of components. The information and requirements may also be used for second-party approvals or for self-declaration by a manu- facturer of products covered by these specifications. 2

39、 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. IEC 601 94, Prinfed board d

40、esign, manufacfure and assembly - Terms and definifions IEC 61 182-1:1994, Prinfed boards - Elecfronic dafa descripfion and fransfer - Parf 1: Prinfed board descripfion in digifal form IEC 61 189-3:1997, Tesf mefhods for elecfrical maferials, inferconnecfion sfrucfures and assemblies - Parf 3: Tesf

41、mefhods for inferconnecfion sfrucfures (prinfed boards) IEC 61 249-2-4, Maferials for prinfed boards and ofher inferconnecfing sfrucfures - Parf 2-4: Reinforced base maferials, clad and unclad - Polyesfer non-wovenlwoven fiberglass laminafed sheef of defined flammabilify (verfical burning fesf), cop

42、per-clad IEC 61 249-2-7, Maferials for prinfed boards and ofher inferconnecfing sfrucfures - Parf 2-7: Reinforced base maferials, clad and unclad - Epoxide woven E-glass laminafed sheef of defined flammabilify (verfical burning fesf), copper-clad IEC 61 249-2-1 2, Maferials for prinfed boards and of

43、her inferconnecfing sfrucfures - Parf 2-12: Secfional specificafion sef for reinforced base maferials, clad and unclad - Epoxide non-woven aramid laminafe of defined flammabilify, copper-clad IEC 62326 (all parts), Prinfed boards IEC 62326-4, Prinfed boards - Parf 4: Rigid mulfilayer prinfed boards

44、wifh inferlayer connecfions - Secfional specificafion IEC 62326-4-1, Prinfed boards - Parf 4: Rigid mulfilayer prinfed boards wifh inferlayer connecfions - Secfional specificafion - Secfion 1: Capabilify Defail Specificafion - Performance levels A, B and C Page 8 EN62326-12002 IEC QC 001001, IEC Qua

45、lify Assessmenf Sysfem for Elecfronic Componenfs (IECQ) - Basic Rules IEC O01 002-1, IEC Qualify Assessmenf Sysfem for Elecfronic Componenfs (IECQ) - Rules of procedure - Parf 1: Adminisfrafion IEC QC 001002-2, IEC Qualify Assessmenf Sysfem for Elecfronic Componenfs (IECQ) - Rules of procedure - Par

46、f 2: Documenfafion IEC QC O01 002-3, IEC Qualify Assessmenf Sysfem for Elecfronic Componenfs (IECQ) - Rules of procedure - Parf 3: Approval procedures IEC QC 001005, Regisfer of Firms, Producfs and Services approved under fhe IECQ Sysfem, including IS0 9000 IS0 9001 :2000, Qualify managemenf sysfems

47、 - Requiremenfs 3 General 3.1 General considerations Printed boards differ from most other electronic components in important factors, such as: - there are no standard boards with standard patterns and dimensions but an infinite variety of shapes and circuit configurations; - they are “custom tailor

48、ed“, .e. all details for a particular board are agreed between manufacturer and customer; - although they are made in considerable total quantities, the production quantity of a parti- cular printed board may be small. The qualification approval procedures detailed in clause 3 of IEC QC 001002-3 are

49、 not considered suitable for the approval of printed board manufacturers, and the capability approval procedures of clause 4 of IEC QC 001002-3 shall be applied. Additionally, the manufacturer shall demonstrate that the quality management system complies with IS0 9001, as appropriate. Manufacturers seeking IECQ capability approval shall hold IECQ organization approval in accordance with clause 2 of IEC QC 001002-3 as a prerequisite. In the case of printed boards, capability approval is based on the use of capability test board (CTB) or suitable production printed board (PPB)