EN 60749-33-2004 en Semiconductor devices Mechanical and climatic test methods Part 33 Accelerated moisture resistance Unbiased autoclave《半导体器件 机械和气候试验方法 第33部分 加速抗湿 无偏压热器 IEC 60749.pdf

《EN 60749-33-2004 en Semiconductor devices Mechanical and climatic test methods Part 33 Accelerated moisture resistance Unbiased autoclave《半导体器件 机械和气候试验方法 第33部分 加速抗湿 无偏压热器 IEC 60749.pdf》由会员分享，可在线阅读，更多相关《EN 60749-33-2004 en Semiconductor devices Mechanical and climatic test methods Part 33 Accelerated moisture resistance Unbiased autoclave《半导体器件 机械和气候试验方法 第33部分 加速抗湿 无偏压热器 IEC 60749.pdf（10页珍藏版）》请在麦多课文档分享上搜索。

1、BRITISH STANDARD BS EN 60749-33:2004 Semiconductor devices Mechanical and climatic test methods Part 33: Accelerated moisture resistance Unbiased autoclave The European Standard EN 60749-33:2004 has the status of a British Standard ICS 31.080 BS EN 60749-33:2004 This British Standard was published u

2、nder the authority of the Standards Policy and Strategy Committee on 22 June 2004 BSI 22 June 2004 ISBN 0 580 43973 9 National foreword This British Standard is the official English language version of EN 60749-33:2004. It is identical with IEC 60749-33:2004. The UK participation in its preparation

3、was entrusted by Technical Committee EPL/47, Semiconductors, to Subcommittee EPL/47/1, Film and hybrid integrated circuits, which has the responsibility to: A list of organizations represented on this subcommittee can be obtained on request to its secretary. Cross-references The British Standards wh

4、ich implement international or European publications referred to in this document may be found in the BSI Catalogue under the section entitled “International Standards Correspondence Index”, or by using the “Search” facility of the BSI Electronic Catalogue or of British Standards Online. This public

5、ation does not purport to include all the necessary provisions of a contract. Users are responsible for its correct application. Compliance with a British Standard does not of itself confer immunity from legal obligations. aid enquirers to understand the text; present to the responsible internationa

6、l/European committee any enquiries on the interpretation, or proposals for change, and keep the UK interests informed; monitor related international and European developments and promulgate them in the UK. Summary of pages This document comprises a front cover, an inside front cover, the EN title pa

7、ge, pages 2 to 6, an inside back cover and a back cover. The BSI copyright notice displayed in this document indicates when the document was last issued. Amendments issued since publication Amd. No. Date CommentsEUROPEAN STANDARD EN 60749-33 NORME EUROPENNE EUROPISCHE NORM April 2004 CENELEC Europea

8、n Committee for Electrotechnical Standardization Comit Europen de Normalisation Electrotechnique Europisches Komitee fr Elektrotechnische Normung Central Secretariat: rue de Stassart 35, B - 1050 Brussels 2004 CENELEC - All rights of exploitation in any form and by any means reserved worldwide for C

9、ENELEC members. Ref. No. EN 60749-33:2004 E ICS 31.080 English version Semiconductor devices Mechanical and climatic test methods Part 33: Accelerated moisture resistance Unbiased autoclave (IEC 60749-33:2004) Dispositifs semiconducteurs Mthodes dessais mcaniques et climatiques Partie 33: Rsistance

10、lhumidit acclre Autoclave sans polarisation (CEI 60749-33:2004) Halbleiterbauelemente Mechanische und klimatische Prfverfahren Teil 33: Beschleunigte Verfahren fr Feuchtebestndigkeit Autoclave ohne elektrische Beanspruchung (IEC 60749-33:2004) This European Standard was approved by CENELEC on 2004-0

11、4-01. CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obt

12、ained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Cen

13、tral Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, Czech Republic, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Luxembourg, Malta, Netherl

14、ands, Norway, Poland, Portugal, Slovakia, Slovenia, Spain, Sweden, Switzerland and United Kingdom. Foreword The text of document 47/1737/FDIS, future edition 1 of IEC 60749-33, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as

15、 EN 60749-33 on 2004-04-01. The following dates were fixed: latest date by which the EN has to be implemented at national level by publication of an identical national standard or by endorsement (dop) 2005-01-01 latest date by which the national standards conflicting with the EN have to be withdrawn

16、 (dow) 2007-04-01 Annex ZA has been added by CENELEC. _ Endorsement notice The text of the International Standard IEC 60749-33:2004 was approved by CENELEC as a European Standard without any modification. _ Page2 EN6074933:2004SEMICONDUCTOR DEVICES MECHANICAL AND CLIMATIC TEST METHODS Part 33: Accel

17、erated moisture resistance Unbiased autoclave 1 Scope and object The unbiased autoclave test is performed to evaluate the moisture resistance integrity of non- hermetic packaged solid-state devices using moisture condensing or moisture saturated steam environments. It is a highly accelerated test wh

18、ich employs conditions of pressure, humidity and temperature under condensing conditions to accelerate moisture penetration through the external protective material (encapsulant or seal) or along the interface between the external protective material and the metallic conductors passing through it. T

19、his test is used to identify failure mechanisms internal to the package and is destructive. 2 Normative references The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest editi

20、on of the referenced document (including any amendments) applies. IEC 60749-24, Semiconductor devices Mechanical and climatic test methods Part 24: Accelerated moisture resistance Unbiased HAST 3 Test apparatus The test requires a chamber capable of maintaining a specified temperature and relative h

21、umidity under pressure. 3.1 Records A permanent record of the temperature profile for each test cycle is recommended so that the stress conditions can be verified. 3.2 Devices under stress Devices under stress shall be no closer than 30 mm from the internal chamber surface and shall not be subjected

22、 to direct radiant heat. 3.3 Ionic contamination Ionic contamination of the test apparatus and storage chamber shall be controlled to avoid test artefacts. 3.4 Distilled or deionized water Distilled or deionized water with a minimum resistivity of 1 10 4 m (1 M m) (measured at the source) at room te

23、mperature shall be used. Page3 EN6074933:20044 General requirements This test method applies primarily to moisture resistance evaluations and robustness testing. Samples are subjected to a condensing, highly humid atmosphere under pressure to force moisture into the package to uncover weaknesses suc

24、h as delamination and metallization corrosion. This test is used to evaluate new packages or packages that have undergone changes in materials (e.g. mold compound, die passivation) or design (e.g. die/die pad sizes). However, this test should not be applied on laminate or tape based packages, i.e. F

25、R4 material, polyimide tape or equivalent. Caution should be exercised when performing this test and evaluating test results. Failure mechanisms, both internal (e.g. due to plastic package swelling from saturation) and external (e.g. dendritic growth of conducting material between leads), may be pro

26、duced which are not applicable to the intended application use conditions. Most semiconductor components are not rated for field application conditions exceeding 95 % RH, including condensing moisture such as rain or fog. The combination of high humidity, high temperature (T g ) and high pressure ma

27、y produce unrealistic material failures because absorbed moisture typically decreases the glass transition temperature for most polymeric materials. Extrapolation of autoclave test results to arrive at an application life should be accomplished with care. Autoclave testing is performed when required

28、 by the relevant specification. This can be an alternative test to that of IEC 60749-24. The unbiased HAST test is preferred. Where both this test and the unbiased HAST test are performed, the results of unbiased HAST shall take priority. 5 Test conditions Test conditions consist of a given temperat

29、ure, relative humidity, vapor pressure, and duration. Table 1 Temperature, relative humidity, and pressure (See footnotes b and c) Temperature a(dry bulb) C Relative humidity a% Vapor pressure kPa (for reference) 121 2 0 5 100 % 202 aTolerances apply to the entire usable test area. bThe test conditi

30、ons are to be applied continuously except during any interim read- outs. For interim read-outs, devices should be returned to stress within the time specified in 6.3. cThe stress duration is specified by appropriate qualification requirements or the relevant specification. A duration of 96 h is typi

31、cal for this test. CAUTION: For plastic-encapsulated microcircuits, it is known that moisture reduces the effective glass transition temperature of the molding compound. Stress temperatures above the effective glass transition temperature may lead to failure mechanisms unrelated to operational use.

32、6 Procedure The test devices shall be mounted in a manner which exposes them to the specified temperature and humidity conditions. Exposure of devices to ambient environments greater than 100 C and less than 10 % RH shall be avoided, particularly during stress ramp-up, ramp-down and the pre-readout

33、drying period. Care should be taken through equipment control or cool-down procedures to prevent destructive depressurization of the parts under test. Frequent cleaning of the test chamber is necessary to ensure elimination of contamination. Page4 EN6074933:20046.1 Handling Hand coverings which elim

34、inate any source of ancillary contamination shall be used to handle devices and test fixtures. Contamination control is important in the application of this test method and any highly accelerated moisture stress test. 6.2 Test clock The test clock starts when the temperature and relative humidity re

35、ach the set points specified in Table 1 and stops at the beginning of ramp-down. 6.3 Electrical measurements An electrical test shall be performed no sooner than 2 h and no later than 48 h after the end of ramp-down with room temperature testing being carried out first in the sequence of testing. It

36、 should be noted that for intermediate read-outs, devices shall be returned to stress within 96 h of the end of ramp-down. The rate of moisture loss from devices after removal from the chamber can be reduced by placing the devices in sealed moisture barrier bags. The bags should be non-vacuum sealed

37、 without a nitrogen purge and without desiccant. When devices are placed in sealed bags, the “test window clock“ runs at one-third of the rate of devices exposed to the laboratory ambient. Thus the test window can be extended to as much as 144 h, and the time to return to stress to as much as 288 h

38、by enclosing the devices in sealed moisture barrier bags. Devices that exceed the test window clock or extension shall be removed from test and shall have new samples submitted for testing. Condensed moisture on the exterior surface of the device package may be removed through contact with an absorb

39、ing medium or isopropyl alcohol. Because the purpose of this test is to identify failure mechanisms internal to the package, cleaning of the packaged device or leads is permitted, provided it does not induce anomalous failures or obscure valid failures. 7 Failure criteria A device under accelerated

40、moisture resistance shall be defined a failure if its parametric limits are exceeded, or its functionality cannot be demonstrated under nominal and worst- case conditions, as specified in the relevant specification or data sheet. Electrical failures due to external package damage which are an artefa

41、ct of the test method shall be excluded from the failure classification. 8 Safety The equipment manufacturers recommendation and local safety regulations shall apply. 9 Summary The following details shall be specified in the relevant specification: a) test duration (see Clause 5); b) electrical meas

42、urements after test (see 6.3). _ Page5 EN6074933:2004 Annex ZA (normative) Normative references to international publications with their corresponding European publications The following referenced documents are indispensable for the application of this document. For dated references, only the editi

43、on cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. NOTE Where an international publication has been modified by common modifications, indicated by (mod), the relevant EN/HD applies. Publication Year Title EN/HD Year IEC 60749-2

44、4 - 1)Semiconductor devices - Mechanical and climatic test methods Part 24: Accelerated moisture resistance - Unbiased HAST EN 60749-24 2004 2)1)Undated reference. 2)Valid edition at date of issue. Page6 EN6074933:2004blankBS EN 60749-33:2004 BSI 389 Chiswick High Road London W4 4AL BSI British Stan

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