ECA EIA-364-113-2010 TP-113 Corrosivity of Contacts Test Procedure for Electrical Connectors and Sockets《电连接器和插座的接触腐蚀性测试程序》.pdf

《ECA EIA-364-113-2010 TP-113 Corrosivity of Contacts Test Procedure for Electrical Connectors and Sockets《电连接器和插座的接触腐蚀性测试程序》.pdf》由会员分享，可在线阅读，更多相关《ECA EIA-364-113-2010 TP-113 Corrosivity of Contacts Test Procedure for Electrical Connectors and Sockets《电连接器和插座的接触腐蚀性测试程序》.pdf（14页珍藏版）》请在麦多课文档分享上搜索。

1、 EIA STANDARD TP-113 CORROSIVITY OF CONTACTS TEST PROCEDURE FOR ELECTRICAL CONNECTORS AND SOCKETS EIA-364-113 MARCH 2010 EIA Standards Electronic Components Association ANSI/EIA-364-113-2010 Approved: June 4, 2010 EIA-364-113 NOTICE EIA Engineering Standards and Publications are designed to serve th

2、e public interest through eliminating misunderstandings between manufacturers and purchasers, facilitating interchangeability and improvement of products, and assisting the purchaser in selecting and obtaining with minimum delay the proper product for his particular need. Existence of such Standards

3、 and Publications shall not in any respect preclude any member or nonmember of EIA from manufacturing or selling products not conforming to such Standards and Publications, nor shall the existence of such Standards and Publications preclude their voluntary use by those other than EIA members, whethe

4、r the standard is to be used either domestically or internationally. Standards and Publications are adopted by EIA in accordance with the American National Standards Institute (ANSI) patent policy. By such action, EIA does not assume any liability to any patent owner, nor does it assume any obligati

5、on whatever to parties adopting the Standard or Publication. This EIA Standard is considered to have International Standardization implication, but the International Electrotechnical Commission activity has not progressed to the point where a valid comparison between the EIA Standard and the IEC doc

6、ument can be made. This Standard does not purport to address all safety problems associated with its use or all applicable regulatory requirements. It is the responsibility of the user of this Standard to establish appropriate safety and health practices and to determine the applicability of regulat

7、ory limitations before its use. (From Standards Proposal No. 5204 formulated under the cognizance of the CE-2.0 National Connector and Socket Standards Committee) Published by: ELECTRONIC COMPONENTS ASSOCIATION 2010 EIA Standards and Technology Department 2500 Wilson Boulevard Suite 310 Arlington, V

8、A 22201 PRICE: Please call: Global Engineering Documents, USA and Canada (1-800-854-7179) http:/ All rights reserved Printed in U.S.A. PLEASE ! DONT VIOLATE THE LAW! This document is copyrighted by the EIA and may not be reproduced without permission. Organizations may obtain permission to reproduce

9、 a limited number of copies through entering into a license agreement. For information, contact: Global Engineering Documents 15 Inverness Way East Englewood, CO 80112-5704 or call USA and Canada (1-800-854-7179), International (303-397-7956) CONTENTS Clause Page 1 Introduction . 1 1.1 Scope . 1 2 T

10、est resources 1 2.1 Material . 1 3 Test specimen 1 3.1 Description 1 3.2 Preparation 2 4 Test procedure . 2 5 Details to be specified . 4 6 Test documentation . 4 Table 1 Test conditions 3 i (This page left blank) ii EIA-364-113 Page 1 TEST PROCEDURE No. 113 CORROSIVITY OF CONTACTS TEST PROCEDURE FO

11、R ELECTRICAL CONNECTOR AND SOCKET (From EIA Standards Proposal No. 5204, formulated under the cognizance EIA CE-2.0 Committee on National Connector Standards.) 1 Introduction 1.1 Scope 1.1.1 This test procedure establishes a test method to determine whether corrosion products as a result of residual

12、 corrosive elements may be created on contact surfaces. Said products may be a result from improper cleaning or lack thereof, improper processes, entrapped particulates, etc. The following plating systems (but not limited to) are of interest. gold over copper (alloys) with or without nickel underpla

13、te, gold over palladium-nickel over copper (alloys) with or without nickel underplate, silver plated systems with or without underplates. 1.1.2 This test procedure does not determine to what extent, if any, the performance of the product tested may be affected by the presence of residual corrosive e

14、lements on the contacts or connectors and any resulting corrosion from the test exposure. Any effect that the existence of residual corrosive elements may have on product performance would be dependent on many factors including the product design, the location, type, concentration of residual corros

15、ive elements, and the actual application of the product. 2 Test resources 2.1 Material Noncorrosive string or equivalent 3 Test specimen 3.1 Description 3.1.1 Specimens shall be unassembled contacts (loose or on a carry strip). Contacts used in insert moldings shall be supplied loose prior to the mo

16、lding operation. All contacts shall be tested in the as received condition, see 3.2.3 through 3.2.5. 3.1.2 Unplated control samples shall be from the same lot of contacts used in the insert molded assemblies, see 3.2.3 through 3.2.5. EIA-364-113 Page 2 3.2. Preparation 3.2.1 The test chamber shall b

17、e thoroughly cleaned, including the water pan for the humidity generation. Deionized water shall be used. 3.2.2 A drip shield shall be used at an angle over the specimens under test to prevent stray water droplets from depositing on the test specimens. The drip shield shall be constructed of non-rea

18、ctive material. 3.2.3 A minimum of 10 as received plated specimens shall be attached to non-reactive string. An additional five specimens minimum, of the as received samples, shall be cleaned using ultrasonics and deionized water or equivalent process. A minimum of 10 control samples from connector

19、assemblies shall also be prepared. All test specimens shall be exposed in the unassembled and unmated condition except as noted in 3.2.5. 3.2.4 The test specimens (loose contacts, carrier strips or assemblies) shall be suspended in the chamber no closer than 5 centimeters (2 inches) from any chamber

20、 surface or to each other. 3.2.5 Optional (Connector assemblies) Contacts that have been assembled or insert molded may be tested along with loose contacts, see 3.2.3, at the discretion of the sponsoring activity. All test specimens shall be exposed in the unmated state. A total of five connector as

21、semblies and the number of loose contacts, see 3.2.3, shall be exposed. All loose contacts, carrier strips and assemblies shall be examined in accordance with 4.9 through 4.11. For insert-molded connectors a minimum of 10 contacts per connector shall be examined. For connector assemblies with less t

22、han 10 positions all positions shall be examined. Upon completion of the visual examination, all test specimens shall be returned to the test sponsors for final disposition 4 Test procedure 4.1 The environment used is considered benign in that it will not create corrosion by itself. It is and acts a

23、s an accelerator and will initiate corrosion when in contact with corrosive elements or particulates that may have been deposited on metallized surfaces or entrapped in or on plating imperfections such as pore sites, material edges where the plating has thinned, voids, nicks, etc. 4.2 When corrosion

24、 occurs, it is recommended that root cause be determined. Said activity may require additional procedures that are beyond the scope of this test procedure. In this instance, a separate report may be issued. When performed, the applicable test procedures used shall be listed with appropriate data. EI

25、A-364-113 Page 3 4.3 Care should be taken in the selection of the test condition. The following guidelines are applicable: Test condition I: Flux induced corrosion, Test condition I or II: Loose contacts, Test condition I: When printed circuit boards are used with mating contact pads, Test condition

26、 II: When printed circuit boards are used with mating pads to which no soldering operation has been performed. NOTE When in doubt, test condition I shall be selected. 4.4 The test specimens shall be placed in the chamber with the chamber at room ambient conditions. 4.5 Unless otherwise specified, th

27、e chamber temperature shall be increased at an approximate rate of 1 C per minute (1.8 F per minute) and the humidity at an approximate rate of 4% per minute. At the conclusion of the exposure, the chamber ramp down rates shall be the same as the ramp up rates. 4.6 It is important that during the ex

28、posure that condensation does not form on the test samples. If condensation does form on the samples, the test shall be aborted. In this instance the ramp rate may have to be adjusted to a level at which condensation does not form. 4.7 The test environment shall be in accordance with EIA-364-31, Met

29、hod II. One of the test conditions in table 1 shall be chosen. Table 1 Test conditions Test condition Temperature Relative humidity Duration I 40 C 2 C 90% to 96% 14 days II 85 C 2 C 82% to 88% 14 days 4.8 Upon completion of the exposure, the test specimens shall be allowed to recover to room ambien

30、t conditions. Wiping of the specimens shall not be allowed. 4.9 Unless otherwise specified in the referencing document, all test specimens shall be examined under 20X magnification. 4.10 If corrosion is observed on the unplated control samples, the test shall be considered invalid and will have to b

31、e repeated. Moisture spots, staining or surface tarnish shall not be considered as a reject. EIA-364-113 Page 4 4.11 Unless otherwise specified by the referencing document, the area of examination shall be the contact and projected wipe areas. The following are examples of (but not limited to) these

32、 areas: pin contacts: complete diametrical wipe area, blade or pads: projected wipe area, socket contacts same zones, as indicated in EIA-364-53 figures 2 through 8. NOTE Evidence of corrosion products outside of the examination zones shall not be cause for failure 5 Details to be specified The foll

33、owing details shall be specified in the referencing document: 5.1. Description of test specimens including part numbers, plating and plating thickness 5.2 Pass/fail criteria 5.3 Test conditions I or II 5.4 Specimen size, if other than specified 5.5 Connector assemblies, if applicable 6 Documentation

34、 Documentation shall contain the details specified in clause 5, with any exceptions, and the following: 6.1 Title of test 6.2 Specimen description and/or part number 6.3 Test equipment used, and date of last and next calibration 6.4 Room ambient temperature and humidity 6.5 Test condition used and a

35、pplicable charts 6.6 Results 6.7 Visual observations 6.8 Name of operator and start/finish date(s) of test EIA Document Improvement Proposal If in the review or use of this document, a potential change is made evident for safety, health or technical reasons, please fill in the appropriate informatio

36、n below and mail or FAX to: Electronic Industries Alliance Standards Department and Technology Department 2500 Wilson Blvd.- Suite 310 Arlington, VA 22201 FAX: (703-875-8908) Document No.: Document Title: Submitters Name: Telephone No.: FAX No.: e-mail: Address: Urgency of Change: Immediate: At next

37、 revision: Problem Area: a. Clause Number and /or Drawing: b. Recommended Changes: c. Reason/Rationale for Recommendation: Additional Remarks: Signature: Date: FOR EIA USE ONLY Responsible Committee: Chairman: Date comments forwarded to Committee Chairman: Revision History Revision letter Project number Additions, changes and deletions SP-5204 Released Electronic Components Association 2500 Wilson Boulevard, Suite 310 * Arlington, VA 22201 * tel 703-907-8021 * fax 703-875-8908 www.ecaus.org