DLA SMD-5962-99536 REV H-2012 MICROCIRCUIT DIGITAL-LINEAR RADIATION HARDENED HIGH FREQUENCY HALF BRIDGE DRIVER MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Make change to VTHUV test specified under table I. - ro 00-03-07 R. MONNIN B Add device type 02. - ro 01-07-26 R. MONNIN C Make changes to ILKand +IINtests as specified in table I. - ro 01-12-14 R. MONNIN D Make change to the high side floating s
2、upply offset voltage limit for device type 02 as specified under 1.4. - ro 02-04-17 R. MONNIN E Add a new logic diagram for device type 02. - ro 03-04-15 R. MONNIN F Make correction to the title block. Make clarification to footnote 7/ under paragraph 1.5. Add pin description to figure 1. Make chang
3、es to correct figure 3, irradiation circuit. - ro 11-01-19 C. SAFFLE G Make correction to figure 3, irradiation circuit. - ro 11-04-05 C. SAFFLE H Add device type 03, Table IB, paragraphs 4.4.4.3 and 6.7. Delete irradiation circuits. - ro 12-08-02 C. SAFFLE REV SHEET REV H H H H H H H H H H H SHEET
4、15 16 17 18 19 20 21 22 23 24 25 REV STATUS REV H H H H H H H H H H H H H H OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY RICK OFFICER DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR
5、 USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY RAYMOND MONNIN MICROCIRCUIT, DIGITAL-LINEAR, RADIATION HARDENED, HIGH FREQUENCY HALF BRIDGE DRIVER, MONOLITHIC SILICON DRAWING APPROVAL DATE 99-06-29 AMSC N/A REVISION LEVEL H SIZE A CAGE CODE 67
6、268 5962-99536 SHEET 1 OF 25 DSCC FORM 2233 APR 97 5962-E315-12 Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99536 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 2 DSCC FORM 2234 AP
7、R 97 1. SCOPE 1.1 Scope. This drawing documents three product assurance class levels consisting of high reliability (device classes Q and M), space application (device class V) and for appropriate satellite and similar applications (device class T). A choice of case outlines and lead finishes are av
8、ailable and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. For device class T, the user is encouraged to review the manufacturers Quality Management (QM) plan as part of their evaluation of these p
9、arts and their acceptability in the intended application. 1.2 PIN. The PIN is as shown in the following example: 5962 F 99536 01 V X C Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2
10、.3) / Drawing number 1.2.1 RHA designator. Device classes Q, T and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the ap
11、propriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 HS-2100RH 120 V, radiation hardened, dielectric isolated high frequency half bridge driver 02 IS-2100ARH
12、150 V, radiation hardened, dielectric isolated high frequency half bridge driver 03 IS-2100AEH 150 V, radiation hardened, dielectric isolated high frequency half bridge driver 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as fol
13、lows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q, V Certification and qualification to MIL-PRF-38535 T Certification and qualification to
14、MIL-PRF-38535 with performance as specified in the device manufacturers approved quality management plan. 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style X CDFP4-F16 16 Flat pack 1.2.5 Lead fin
15、ish. The lead finish is as specified in MIL-PRF-38535 for device classes Q, T and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-99536 DLA LAND AND MARITIME
16、 COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ 2/ High side floating supply voltage (VB): Device type 01 -0.3 V to 120 V Device types 02 and 03 -0.3 V to 150 V High side floating supply offset voltage (VS) VB 25 V to VB+ 0.3 V High side flo
17、ating output voltage (VHO) VS 0.3 V to VB+ 0.3 V Low side fixed supply voltage (VCC) -0.3 V to 25 V Low side output voltage (VLO) . COM 0.3 V to VCC+ 0.3 V Logic supply voltage (VDD) VCC3/ Logic input voltage (HIN, LIN, and SD pins) . VSS 0.3 V to VDD+0.3 V VSslew rate (dVS/ dt): Device type 01 10 V
18、 / ns maximum Device types 02 and 03 15 V / ns maximum COM (low driver return) offset to VSS: Device type 01 -7 V to +7 V Device types 02 and 03 -5 V to +5 V Maximum power dissipation (PD) (TA +25C) . 1.6 W Lead temperature (soldering, 10 seconds) . +300C Junction temperature (TJ) +175C Storage temp
19、erature range -55C to +150C Thermal resistance, junction-to-case (JC) 18C/W Thermal resistance, junction-to-ambient (JA) . 90C/W 1.4 Recommended operating conditions. High side floating supply absolute voltage (VB) . VS+ 12 V to VS+20 V High side floating supply offset voltage (VS): Device type 01 -
20、4 V to 100 V 4/ Device types 02 and 03 -4 V to 130 V 4/ High side floating output voltage (VHO) VSto VBLow side fixed supply (VCC) . 12 V to 20 V Low side output voltage (VLO) . COM to VCCLogic supply voltage (VDD) VCC3/ _ 1/ Stresses above the absolute maximum rating may cause permanent damage to t
21、he device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ All voltage parameters are absolute voltages referenced to VSS. 3/ Logic is operational for VSof -4 V but VBmust remain minimum 12 V above VSS(ground). 4/ This device is recommended for VDD= VCCand
22、 they should be tied together at the board level. VDDand VCCcan have different values but both must remain within 12 V 20 V range. Low side undervoltage monitors VDDto VSSdifferential. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIR
23、CUIT DRAWING SIZE A 5962-99536 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL H SHEET 4 DSCC FORM 2234 APR 97 1.4 Recommended operating conditions continued. Logic supply return (VSS) . 0 V COM (low driver return) offset to VSS-5 V to 5 V 5/ Logic input voltage (VIN) VSSto VDD6/ Ambi
24、ent operating temperature range (TA) -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 50 - 300 rads(Si)/s): Device types 01 and 02 classes M, Q, or V 300 krads(Si) 7/ Device type 01 class T 100 krads(Si) 7/ Device type 03 . 300 krads(Si) 8/ Maximum total dose available
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