DLA SMD-5962-96892 REV B-2003 MICROCIRCUIT DIGITAL-LINEAR 12-BIT D A CONVERTER MONOLITHIC SILICON《12-BIT直流电和交流电硅单片电路数字记忆微电路》.pdf

《DLA SMD-5962-96892 REV B-2003 MICROCIRCUIT DIGITAL-LINEAR 12-BIT D A CONVERTER MONOLITHIC SILICON《12-BIT直流电和交流电硅单片电路数字记忆微电路》.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-96892 REV B-2003 MICROCIRCUIT DIGITAL-LINEAR 12-BIT D A CONVERTER MONOLITHIC SILICON《12-BIT直流电和交流电硅单片电路数字记忆微电路》.pdf（12页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline “J”. Update boilerplate. - drw 98-01-22 Raymond Monnin B Replaced reference to MIL-STD-973 with reference to MIL-PRF-38535. gt 03-05-02 Raymond Monnin REV SHEET REV SHEET REV STATUS REV B B B B B B B B B B B OF SHEETS SHEET 1 2 3

2、 4 5 6 7 8 9 10 11 PMIC N/A PREPARED BY Dan Wonnell STANDARD MICROCIRCUIT DRAWING CHECKED BY Raj Pithadia DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Raj Pithadia AND AGENCIES OF THE DEPARTMENT OF DEFENSE

3、 DRAWING APPROVAL DATE 97-04-21 MICROCIRCUIT, DIGITAL-LINEAR, 12-BIT D/A CONVERTER, MONOLITHIC SILICON AMSC N/A REVISION LEVEL B SIZE A CAGE CODE 67268 5962-96892 SHEET 1 OF 11 DSCC FORM 2233 APR 97 5962-E174-03 DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. Provid

4、ed by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product a

5、ssurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) le

6、vels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 - 96892 01 V L X Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Deviceclass designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RH

7、A designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash

8、 (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 AD565AS 12 Bit D/A Converter 02 AD565AT 12 Bit D/A Converter 1.2.3 Device class designator. The device class designator is a single lette

9、r identifying the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to M

10、IL-PRF-38535 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style J GDIP1-T24 or CDIP2-T24 24 Dual-in-line K GDFP2-F24 or CDFP3-F24 24 Flat pack L GDIP3-T24 or CDIP4-T24 24 Dual-in-line 1.2.5 Lead f

11、inish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96892 DEFENSE SUPPLY CENTER

12、COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 1/ VCCpower ground - 0 to +18 V dc VEE power ground- 0 to -18 V dc Voltage on DAC output (pin 9) - -3 V dc to +12 V dc Digital inputs (pins 13 to 24) to power ground - -1.0 V dc to +7.0 V

13、dc Ref in to ref ground- 12 V dc Bipolar offset to reference ground- 12 V dc 10 V span R to reference ground- 12 V dc 20 V span R to reference ground- 24 V dc Ref out- Indefinite short to power ground momentary short to VCCPower dissipation- 1000 mW Storage temperature range - -65C to +150C Lead tem

14、perature (soldering 10 sec)- +300C Thermal resistance, junction to case (JC): Case J - 25C/W Case L- 25C/W Case K- 22C/W Thermal resistance, junction to ambient (JA): Case J - 48C/W Case L- 48C/W Case K- 69C/W 1.4 Recommended operating conditions. Positive supply voltage (VCC) - +15 V Negative suppl

15、y voltage (VEE)- -15 V Operating ambient temperature range- -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the

16、issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the solicitation. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. ST

17、ANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. HANDBOOKS DEPARTMENT OF DEFENSE MIL-HDBK-103 - List of Standard Microcircuit Drawings . MIL-HDBK-780 - Standard Microcircuit Drawings. (Unless otherwi

18、se indicated, copies of the specification, standards, and handbooks are available from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at

19、 the maximum levels may degrade performance and affect reliability. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 4 DSCC

20、 FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtain

21、ed. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form,

22、 fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimens

23、ions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specifie

24、d on figure 1. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature r

25、ange. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also

26、be marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for de

27、vice classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The complianc

28、e mark for device class M shall be a “C“ as required in MIL-PRF-38535, appendix A. 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein).

29、For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall a

30、ffirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in

31、 MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to

32、 this drawing is required for any change as defined in MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL

33、B SHEET 5 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ -55C TA +125C Group A subgroups Device type Limits Unit unless otherwise specified Min Max Relative accuracy RA All bits with positive errors on. All bits with negative errors on 1 All 0.5 LSB

34、2, 3 01 0.75 02 0.5 Differential nonlinearity DNL Major transitions 1 All 0.75 LSB 2, 3 All 1.0 Gain error AERREF= 50 fixed 1 All 0.25 % of FS Gain error temperature coefficient TCAE2, 3 01 30.0 ppm of FS/C 02 15.0 Offset error VOS1 All 0.05 % of FS Offset error temperature coefficient TCVOS2, 3 All

35、 2.0 ppm of FS/C Bipolar zero error 2/ BPZERBO= 50 fixed 1 All 0.15 % of FS B/P zero error 2/ temperature coefficient TCBPZE2, 3 All 10.0 ppm of FS/C Reference output voltage 3/ VREF1, 2, 3 All 9.90 10.10 V Reference output current 4/ IREF1 All 1.5 mA Output current IOUTUnipolar (all bits on) 1 All

36、-1.6 -2.4 mA Bipolar (all bits on) -0.8 -1.2 Power supply rejection ratio PSRR VCC= +11.4 V to +16.5 V dc 1 All 10.0 ppm of FRS/% VEE= -11.4 V to -16.5 V dc 25.0 Power supply current 4/ 5/ ICC1 All +5.0 mA IEE-18.0 See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networ

37、king permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - continued. Test Symbol Conditions 1/ -55C TA +125C Gro

38、up A subgroups Device type Limits Unit unless otherwise specified Min Max Power dissipation PD1 All 345.0 mW Digital input high voltage VIH1 All 2.0 5.5 V Digital input low voltage VIL1 All 0.8 V Digital input high current IIHVIH= 5.5 V 1 All 300.0 A Digital input low current IILVIL= 0 V 1 All 100.0

39、 A 1/ VCC= +15 V, VEE= -15 V, VIH= 2.0 V, VIL= 0.8 V. 2/ MSB on, all other bits off. 3/ In subgroup 1, the reference output is loaded with 0.5 mA reference input current, 1.0 mA bipolar offset current, and 1.5 mA additional current. In subgroups 2 and 3, only the 0.5 mA reference input current is ap

40、plied. The reference must be buffered to supply external loads at elevated temperatures. 4/ Guaranteed for +11.4 VCC +16.5 V. 5/ Guaranteed for -11.4 VEE -16.5 V. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 59

41、62-96892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 7 DSCC FORM 2234 APR 97 Device type 01, 02 Case outline J, K, L Terminal number Terminal symbol 1 NC 2 NC 3 VCC4 REF OUT (+10 V 1%) 5 REFERENCE GND 6 REFERENCE IN 7 -VEE8 BIPOLAR OFFSET IN 9 DAC OUT (-2 mA F.S.)

42、 10 10 V SPAN R 11 20 V SPAN R 12 POWER GND 13 BIT 12 IN LSB 14 BIT 11 IN 15 BIT 10 IN 16 BIT 9 IN 17 BIT 8 IN 18 BIT 7 IN 19 BIT 6 IN 20 BIT 5 IN 21 BIT 4 IN 22 BIT 3 IN 23 BIT 2 IN 24 BIT 1 IN MSB) FIGURE 1. Terminal connections. Provided by IHSNot for ResaleNo reproduction or networking permitted

43、 without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96892 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 8 DSCC FORM 2234 APR 97 3.9 Verification and review for device class M. For device class M, DSCC, DSCCs agent, and the acquiring activity reta

44、in the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircu

45、it group number 56 (see MIL-PRF-38535, appendix A). 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in