DLA SMD-5962-96797 REV C-2004 MICROCIRCUIT DIGITAL RADIATION HARDENED HIGH SPEED CMOS NON-INVERTING OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON《互补金属氧化物半导体 非倒相.pdf

《DLA SMD-5962-96797 REV C-2004 MICROCIRCUIT DIGITAL RADIATION HARDENED HIGH SPEED CMOS NON-INVERTING OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON《互补金属氧化物半导体 非倒相.pdf》由会员分享，可在线阅读，更多相关《DLA SMD-5962-96797 REV C-2004 MICROCIRCUIT DIGITAL RADIATION HARDENED HIGH SPEED CMOS NON-INVERTING OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS MONOLITHIC SILICON《互补金属氧化物半导体 非倒相.pdf（23页珍藏版）》请在麦多课文档分享上搜索。

1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes made in accordance with NOR 5962-R153-98. 98-07-31 Monica L. Poelking B Update boilerplate to MIL-PRF-38535 requirements and update appendix A. Editorial changes throughout. - tmh 00-07-13 Monica L. Poelking C Correct logic diagram. Updat

2、e boilerplate to MIL-PRF-38535 requirements. Editorial changes throughout. - LTG 04-03-29 Thomas M. Hess REV SHET REV C C C C C C B B SHEET 15 16 17 18 19 20 21 22 REV STATUS REV C B C C C C C C B C B C C C OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PMIC N/A PREPARED BY Thanh V. Nguyen DEFENSE

3、 SUPPLY CENTER COLUMBUS STANDARD MICROCIRCUIT DRAWING CHECKED BY Thanh V. Nguyen COLUMBUS, OHIO 43216 http:/www.dscc.dla.mil THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS APPROVED BY Monica L. Poelking AND AGENCIES OF THE DEPARTMENT OF DEFENSE DRAWING APPROVAL DATE 96-02-29 MICROCIRCUIT, DIGI

4、TAL, RADIATION HARDENED, HIGH SPEED CMOS, NON-INVERTING OCTAL BUS TRANSCEIVER WITH THREE-STATE OUTPUTS, MONOLITHIC SILICON AMSC N/A REVISION LEVEL C SIZE A CAGE CODE 67268 5962-96797 SHEET 1 OF 22 DSCC FORM 2233 APR 97 5962-E204-04 Provided by IHSNot for ResaleNo reproduction or networking permitted

5、 without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96797 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL B SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device c

6、lasses Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in

7、 the following example: 5962 R 96797 01 V X C Federal stock class designator RHA designator (see 1.2.1) Devicetype (see 1.2.2) Device class designator Caseoutline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet t

8、he MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The dev

9、ice type(s) identify the circuit function as follows: Device type Generic number Circuit function 01 HCS245 Radiation hardened, SOS, high speed CMOS, non-inverting octal bus transceiver with three-state outputs 1.2.3 Device class designator. The device class designator is a single letter identifying

10、 the product assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

11、1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style R CDIP2-T20 20 Dual-in-line X CDFP4-F20 20 Flat pack 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and

12、 V or MIL-PRF-38535, appendix A for device class M. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96797 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 3 DSCC FORM 2234 APR 9

13、7 1.3 Absolute maximum ratings. 1/ 2/ 3/ Supply voltage range (VCC) -0.5 V dc to +7.0 V dc DC input voltage range (VIN) -0.5 V dc to VCC+ 0.5 V dc DC output voltage range (VOUT) . -0.5 V dc to VCC+ 0.5 V dc DC input current, any one input (IIN). 10 mA DC output current, any one output (IOUT) 25 mA S

14、torage temperature range (TSTG) -65C to +150C Lead temperature (soldering, 10 seconds) +265C Thermal resistance, junction-to-case (JC): Case R 24C/W Case X 28C/W Thermal resistance, junction-to-ambient (JA): Case R 72C/W Case X 107C/W Junction temperature (TJ). +175C Maximum power dissipation at TA=

15、 +125C (PD): 4/ Case R 0.69 W Case X 0.47 W 1.4 Recommended operating conditions. 2/ 3/ Supply voltage range (VCC) +4.5 V dc to +5.5 V dc Case operating temperature range (TC). -55C to +125C Input voltage range (VIN) 0 V to VCCOutput voltage range (VOUT). 0 V to VCCMaximum low level input voltage (V

16、IL) 30% of VCCMinimum high level input voltage (VIH). 70% of VCCMaximum input rise and fall time at VCC= 4.5 V (tr, tf) 500 ns Radiation features: Total dose . 2 x 105Rads (Si) Single event phenomenon (SEP) effective linear energy threshold (LET), no upsets (see 4.4.4.4) 100 MeV/(cm2/mg) 5/ Dose rat

17、e upset (20 ns pulse) 1 x 1010 Rads (Si)/s 5/ Latch-up None 5/ Dose rate survivability 1 x 1012Rads (Si)/s 5/ 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified here

18、in. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. 1/ Stresses above the absolute maximum rating may cause permanent damage t

19、o the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ Unless otherwise specified, all voltages are referenced to GND. 3/ The limits for the parameters specified herein shall apply over the full specified VCCrange and case temperature range of -55C

20、to +125C unless otherwise noted. 4/ If device power exceeds package dissipation capability, provide heat sinking or derate linearly (the derating is based on JA) at the following rate: Case R. 13.9 mW/C Case X. 9.3 mW/C 5/ Guaranteed by design or process but not tested.Provided by IHSNot for ResaleN

21、o reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96797 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 4 DSCC FORM 2234 APR 97 DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits

22、. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http:/assist.daps.dla.mil/quicksearch/ or w

23、ww.dodssp.daps.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing

24、in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in

25、the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as s

26、pecified herein. 3.1.1 Microcircuit die. For requirements for microcircuit die, see appendix A to this document. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PR

27、F-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Truth table. The truth table shall be as specified on figure 2. 3.2.4 Logi

28、c diagram. The logic diagram shall be as specified on figure 3. 3.2.5 Switching waveforms and test circuit. The switching waveforms and test circuit shall be as specified on figure 4. 3.2.6 Irradiation test connections. The irradiation test connections shall be as specified in table III. 3.3 Electri

29、cal performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full case operating temperature range. 3.4 Electrical test req

30、uirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturers PIN may also be marked. For packages where

31、 marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the “5962-“ on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PR

32、F-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a “QML“ or “Q“ as required in MIL-PRF-38535. The compliance mark for device class M shall be a “C“ as required in

33、 MIL-PRF-38535, appendix A. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96797 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 5 DSCC FORM 2234 APR 97 3.6 Certificate of com

34、pliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be list

35、ed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturers product meets, for device classes Q and V, the requirements of MIL-PRF-38535

36、 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of micr

37、ocircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for devic

38、e class M. For device class M, DSCC, DSCCs agent, and the acquiring activity retain the option to review the manufacturers facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for devi

39、ce class M. Device class M devices covered by this drawing shall be in microcircuit group number 37 (see MIL-PRF-38535, appendix A). Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96797 DEFENSE SUPPLY CENTER

40、 COLUMBUS COLUMBUS, OHIO 43216-5000 REVISION LEVEL C SHEET 6 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics. Test Symbol Test conditions 1/ -55C TC +125C unless otherwise specified Device type VCCGroup A subgroups Limits 2/ Unit Min Max For all inputs affecting output under te

41、st VIN= 3.15 V or 1.35 V For all other inputs VIN= VCCor GND IOH= -50 A All 1, 2, 3 4.40 V M, D, P, L, R 3/ All 4.5 V 1 4.40 For all inputs affecting output under test VIN= 3.85 V or 1.65 V For all other inputs VIN= VCCor GND IOH= -50 A All 1, 2, 3 5.40 High level output voltage VOHM, D, P, L, R 3/

42、All 5.5 V 1 5.40 For all inputs affecting output under test VIN= 3.15 V or 1.35 V For all other inputs VIN= VCCor GND IOL= 50 A All 1, 2, 3 0.1 M, D, P, L, R 3/ All 4.5 V 1 0.1 For all inputs affecting output under test VIN= 3.85 V or 1.65 V For all other inputs VIN= VCCor GND IOL= 50 A All 1, 2, 3

43、0.1 Low level output voltage VOLM, D, P, L, R 3/ All 5.5 V 1 0.1 V 1 +0.5 For input under test, VIN= 5.5 V For all other inputs VIN= VCCor GND All 2, 3 +5.0 Input current high IIHM, D, P, L, R 3/ All 5.5 V 1 +5.0 A 1 -0.5 For input under test, VIN= GND For all other inputs VIN= VCCor GND All 2, 3 -5

44、.0 Input current low IILM, D, P, L, R 3/ All 5.5 V 1 -5.0 A See footnotes at end of table. Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96797 DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 REVISI

45、ON LEVEL C SHEET 7 DSCC FORM 2234 APR 97 TABLE I. Electrical performance characteristics - Continued. Test Symbol Test conditions 1/ -55C TC +125C unless otherwise specified Device type VCC Group A subgroups Limits 2/ Unit Min Max 1 +1.0 OE = 5.5 V For all other inputs VIN= 0.0 V or 5.5 V VOUT= 5.5

46、V All 2, 3 +50.0 Three-state output leakage current high IOZHM, D, P, L, R 3/ All 5.5 V 1 +50.0 A 1 -1.0 OE = 5.5 V For all other inputs VIN= 0.0 V or 5.5 V VOUT= 0.0 V All 2, 3 -50.0 Three-state output leakage current low IOZLM, D, P, L, R 3/ All 5.5 V 1 -50.0 A 1 -7.2 For all inputs affecting outp

47、ut under test VIN= 4.5 V or 0.0 V For all other inputs VIN= VCCor GND VOUT= 4.1 V All 2, 3 -6.0 Output current high (Source) IOHM, D, P, L, R 3/ All 4.5 V 1 -6.0 mA 1 7.2 For all inputs affecting output under test VIN= 4.5 V or 0.0 V For all other inputs VIN= VCCor GND VOUT= 0.4 V All 2, 3 6.0 Outpu

48、t current low (Sink) IOLM, D, P, L, R 3/ All 4.5 V 1 6.0 mA 1 40.0 VIN= VCCor GND All 2, 3 750 Quiescent supply current ICCM, D, P, L, R 3/ All 5.5 V 1 750 A Input capacitance CIN5.0 V 4 10.0 pF 4 65.0 Power dissipation capacitance 4/ CPDVIH= 5.0 V VIL= 0.0 V f = 1 MHz, see 4.4.1c All 5.0 V 5, 6 68.0 pF VIH= 3.15 V, VIL= 1.35 V See 4.4.1b All 7, 8 L H Functional test 5/ M, D, P, L, R 3/ All 4.5 V 7 L H See footnotes at end of table.Provided by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96797 DEFENSE SUPPL