DLA SMD-5962-96505 REV D-2012 MICROCIRCUIT LINEAR LOW DROPOUT VOLTAGE REGULATOR MONOLITHIC SILICON.pdf
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1、 REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Add case outline X. Update thermal resistance data in paragraph 1.3. Change to output voltage range test in table I. - rrp 98-09-10 R. MONNIN B Drawing updated to reflect current requirements. gt 02-12-31 R. MONNIN C Update case outline letter X
2、descriptive designator under paragraph 1.2.4 and delete figure 1. - ro 08-07-28 R. HEBER D Add device type 02. Make changes to paragraphs 1.2.2, 1.2.4, and 1.3. Make changes to Table I and figure 1. rrp 12-07-30 C. SAFFLE REV SHEET REV SHEET REV STATUS REV D D D D D D D D D D OF SHEETS SHEET 1 2 3 4
3、 5 6 7 8 9 10 PMIC N/A PREPARED BY RAJESH PITHADIA DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 http:/www.landandmaritime.dla.mil STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE CHECKED BY RAJESH PITHADIA APPROVED BY MIC
4、HAEL A. FRYE MICROCIRCUIT, LINEAR, LOW DROPOUT VOLTAGE REGULATOR, MONOLITHIC SILICON DRAWING APPROVAL DATE 96-07-05 AMSC N/A REVISION LEVEL D SIZE A CAGE CODE 67268 5962-96505 SHEET 1 OF 10 DSCC FORM 2233 APR 97 5962-E022-12 Provided by IHSNot for ResaleNo reproduction or networking permitted withou
5、t license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96505 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 2 DSCC FORM 2234 APR 97 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M)
6、and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following ex
7、ample: 5962 - 96505 01 Q E A Federal stock class designator RHA designator (see 1.2.1) Device type (see 1.2.2) Device class designator Case outline (see 1.2.4) Lead finish (see 1.2.5) / (see 1.2.3) / Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-3853
8、5 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) ide
9、ntify the circuit function as follows: Device type 1/ Generic number Circuit function 01 LM2991WG Negative, low dropout, adjustable regulator 02 LM2991GW Negative, low dropout, adjustable regulator 1.2.3 Device class designator. The device class designator is a single letter identifying the product
10、assurance level as follows: Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535 1.2.4 Case ou
11、tline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Descriptive designator Terminals Package style E GDIP1-T16 or CDIP2-T16 16 Dual-in-line X 1/ GDFP1-G16 16 Flat pack with gullwing leads 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 f
12、or device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1/ For case outline X, package material for device type 01 is aluminum nitride and package material for device type 02 is aluminum oxide. Provided by IHSNot for ResaleNo reproduction or networking permitted without license fr
13、om IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96505 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 3 DSCC FORM 2234 APR 97 1.3 Absolute maximum ratings. 2/ Input voltage -26 V to +0.3 V Power dissipation (PD) Internally limited 3/ Storage temperature range (TSTG) . -65
14、C to +150C Lead temperature (soldering, 10 seconds) +260C Junction temperature (TJ) . +150C Thermal resistance, junction-to-case (JC): Case E . 5C/W Case X (Device type 01) 1/ 3C/W Case X (Device type 02) 1/ 6C/W Thermal resistance, junction-to-ambient (JA): Case E . 75C/W still air at 0.5 W 35C/W 5
15、00 linear feet per minute (LFPM) at 0.5 W Case X (Device type 01) 1/ . 119C/W still air at 0.5 W 73C/W 500 linear feet per minute (LFPM) at 0.5 W Case X (Device type 02) 1/ . 130C/W still air at 0.5 W 80C/W 500 linear feet per minute (LFPM) at 0.5 W 1.4 Recommended operating conditions. Maximum inpu
16、t voltage (operational) . -26 V Ambient operating temperature range (TA) . -55C to +125C 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise
17、specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835
18、- Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at https:/assist.dla.mil/quicksearch/ or from the Standardiza
19、tion Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) _ 2/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ The maximum power dissipation
20、 is a function of TJMAX, JA, and TA. The maximum allowable power dissipation at any ambient temperature is PD= (TJMAX- TA) / JA. If this dissipation is exceeded, the die temperature will rise above +125C, and the device will eventually go into thermal shutdown at a TJof approximately +160C. Provided
21、 by IHSNot for ResaleNo reproduction or networking permitted without license from IHS-,-,-STANDARD MICROCIRCUIT DRAWING SIZE A 5962-96505 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 REVISION LEVEL D SHEET 4 DSCC FORM 2234 APR 97 2.2 Order of precedence. In the event of a conflict between the tex
22、t of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for devic
23、e classes Q and V shall be in accordance with MIL-PRF-38535 as specified herein, or as modified in the device manufacturers Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class
24、 M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL
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